JPS6311207A - Method for drilling printed circuit board - Google Patents
Method for drilling printed circuit boardInfo
- Publication number
- JPS6311207A JPS6311207A JP15525286A JP15525286A JPS6311207A JP S6311207 A JPS6311207 A JP S6311207A JP 15525286 A JP15525286 A JP 15525286A JP 15525286 A JP15525286 A JP 15525286A JP S6311207 A JPS6311207 A JP S6311207A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- circuit board
- printed circuit
- metal foil
- drill
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims description 11
- 239000012790 adhesive layer Substances 0.000 claims abstract description 15
- 239000011888 foil Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims abstract description 10
- 238000010030 laminating Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 239000002985 plastic film Substances 0.000 abstract description 3
- 229920006255 plastic film Polymers 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Drilling And Boring (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、プリント配線板のドリル加工方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for drilling a printed wiring board.
コンピュータを始めとする電子機器の軽薄短小化に伴１
て、プリント配線板も高密度化多層板化が進んで論る。As computers and other electronic devices become lighter, thinner, and smaller,
As a result, printed wiring boards are also becoming more densely packed and multi-layered.
ドリル加工に関しては、配線間隔は挟まり、穴は小径化
して数が増、先、高精廣に対応しようとしてηる。Regarding drilling, the spacing between wires has become narrower, the diameter of holes has become smaller and the number of holes has increased, and the number of holes has increased in an effort to accommodate higher precision and width.
プリント配線板ＩＣ当て板を当てて、ドリル加工を施せ
ば、ドリルの食いつきがよくなり、ドリル穴位置精度が
向上する。最近では鋼、アルミニウム、ステンレス鋼、
眞詣等の金Ｆ４ｆｒｉを使用した当て板が用いられて論
る。これら金属箔はかえりの発生防止によくまた、ドリ
ルを−ｔｉ［にし冷却するのに役立つが従来用いられて
論だフェノールａＪＩｆｆｔ積層板の当て板より博く、
＆量なため金属箔とプリント配線板との間に切削屑が入
り込み易く金属箔の浮き上りを生じ位置精度を低下させ
る欠点ブバありた。特にＱ、 ５ｇ１１１中以下の小径
の穴あけを行う場合には影響が大きく、穴径が日々小さ
くなっていく今日、位置精度の向上が強く要望されて−
だ。If the printed wiring board IC backing plate is applied and drilling is performed, the biting of the drill will be better and the accuracy of the drill hole position will be improved. Recently, steel, aluminum, stainless steel,
A patch plate made of gold F4fri such as Makoto is used for discussion. These metal foils are good at preventing burrs and are useful for cooling the drill, but they are more expensive than the conventionally used phenolic aJIft laminate backing plates.
Because of the large amount of metal foil, cutting chips tend to get stuck between the metal foil and the printed wiring board, causing the metal foil to rise and reducing positioning accuracy. This is especially true when drilling small diameter holes such as Q.
is.
この発明は、このような問題を解決するためになされた
ものであって、ドリル穴位置精変の高いプリント配線板
のｙ ＋３ル加工方法を提供することをその目的とする
ものである。The present invention has been made to solve these problems, and an object of the present invention is to provide a method for processing a printed wiring board with high precision in drill hole position.
本発明は導体層と絶縁層を積層成形してなるプリント配
線板に当て板を当てドリルによる穴あけを施すプリント
配線板のドリル加工方法であって、前記当て板が金属箔
の片面に粘着層を形成したもので、粘着層側をプリント
配線板に対向して載置することを特徴とするプリント配
線板のドリル加工方法のためプリント配線板と当て坂と
の間に切削屑が入り込むことがなくなったもので、以下
本発明の詳細な説明する。The present invention is a method for drilling a printed wiring board, in which a patch plate is applied to a printed wiring board formed by laminating and molding a conductive layer and an insulating layer, and a hole is drilled with a drill, wherein the patch plate has an adhesive layer on one side of a metal foil. This method of drilling a printed wiring board is characterized by placing the adhesive layer side facing the printed wiring board, which prevents cutting debris from entering between the printed wiring board and the contact slope. The present invention will now be described in detail.
本発明に用粘る金Ｍ箔七しては銅、アルミニウム、鉄、
ニッケル等の単独、合金からなる金１＠箔を用−ること
ができ、金ＲＭの厚みは特に限定するものではないが好
ましくはＵ、０１８〜１．０Ｈの厚みであることがドリ
ルの食Ａつきがよく望まし論ことである。粘着層として
は粘着剤の塗布層、粘着剤含浸紙布基材層、粘着層塗布
プラスチックフィルム層等で粘着剤の材質、形態は特に
限定するものではな論が好ましくは粘着層の厚みは５〜
１００ミクロンが密着性、加工後の剥離性の点でよく、
又好ましくは粘着剤塗布プラスチックフィルム（ドライ
フィルム）を用Ａることか金属箔と粘着層の一体化及び
ドリル加工後の轟て板の冷去性、除去後のプリント配線
板表面の汚染性等の点で望ましいことである。The adhesive gold M foil used in the present invention includes copper, aluminum, iron,
Gold 1@ foil consisting of nickel alone or an alloy can be used, and the thickness of the gold RM is not particularly limited, but preferably has a thickness of U, 018 to 1.0H, which is suitable for drilling. It is highly desirable to have an A. The adhesive layer may be an adhesive coating layer, an adhesive-impregnated paper cloth base layer, an adhesive layer-coated plastic film layer, etc., and the material and form of the adhesive are not particularly limited, but the thickness of the adhesive layer is preferably 5. ~
100 microns is good in terms of adhesion and peelability after processing.
Preferably, a plastic film coated with an adhesive (dry film) is used to improve the integration of the metal foil and the adhesive layer, the cooling properties of the drilling board after drilling, the contamination of the surface of the printed wiring board after removal, etc. This is desirable from the point of view.
以下不発明を実施例にもとづ層て説明する。The invention will be further explained below based on examples.
実施例１
厚さ１．６ｍの両面銅邊債層！２枚を重ねた上面に、厚
さ０．２囚のアルミニウム箔の片面に２５ミクロンのド
ライフィルムを粘着層として配設した当て板の粘着層側
を積／Ｉ板に対向して載置し、更に積層板の下面に捨て
板を配設してからドリル（三菱ダイヤチタニグト）で穴
あけ加工した。Example 1 Double-sided copper bond layer with a thickness of 1.6 m! On the top surface of the two stacked sheets, place the adhesive layer side of a patch plate, which is made of aluminum foil with a thickness of 0.2 mm with a 25 micron dry film on one side as an adhesive layer, facing the stack/I plate. Furthermore, a sacrificial board was placed on the bottom of the laminate, and then holes were drilled using a drill (Mitsubishi Dia Titanigto).
比較列ｌ
実施例１の当て板として厚さ０．２ｕのアルミニウム箔
を用すた以外は実施例１と同様に処理した。Comparison row 1 The same process as in Example 1 was performed except that an aluminum foil with a thickness of 0.2 μ was used as the backing plate.
比較列２
実施例１の邑で板として厚さ１ｆｆのフェノール樹脂積
層板を用−た以外は実施例１と同様に処理した。Comparison row 2 The same process as in Example 1 was carried out except that a phenol resin laminate having a thickness of 1 ff was used as the plate in the case of Example 1.
実施例及び比較例１と２の穴あけ位置ずれは第１表で明
白なように本発明の方法によるものの性能はよく、本発
明のプリント配線板のドリル加工方法の優れていること
を礒認した。As is clear from Table 1, the performance of the method of the present invention was good for the positional deviation of the holes in Examples and Comparative Examples 1 and 2, confirming the superiority of the method of drilling printed wiring boards of the present invention. .
Claims (1)
板に当て板を当てドリルにより穴あけを施すプリント配
線板のドリル加工方法であって、前記当て板が金属箔の
片面に粘着層を形成したもので、粘着層側をプリント配
線板に対向して載置することを特徴とするプリント配線
板のドリル加工方法。(1) A method for drilling a printed wiring board, in which a patch plate is applied to a printed wiring board formed by laminating and molding a conductive layer and an insulating layer, and a hole is drilled with a drill, the patch plate forming an adhesive layer on one side of a metal foil. 1. A method for drilling a printed wiring board, which comprises placing the printed wiring board with the adhesive layer side facing the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15525286A JPS6311207A (en) | 1986-07-02 | 1986-07-02 | Method for drilling printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15525286A JPS6311207A (en) | 1986-07-02 | 1986-07-02 | Method for drilling printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6311207A true JPS6311207A (en) | 1988-01-18 |
Family
ID=15601859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15525286A Pending JPS6311207A (en) | 1986-07-02 | 1986-07-02 | Method for drilling printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6311207A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0804055A2 (en) * | 1996-02-08 | 1997-10-29 | Showa Aluminum Corporation | An entry board for drilling small holes, a method of making the same and a method for drilling small holes through a printed circuit board by using said entry board |
| JP2004210829A (en) * | 2002-12-27 | 2004-07-29 | Nippon Synthetic Chem Ind Co Ltd:The | Sheet for punching printed wiring substrate and method of punching printed wiring substrate using the sheet |
-
1986
- 1986-07-02 JP JP15525286A patent/JPS6311207A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0804055A2 (en) * | 1996-02-08 | 1997-10-29 | Showa Aluminum Corporation | An entry board for drilling small holes, a method of making the same and a method for drilling small holes through a printed circuit board by using said entry board |
| EP0804055A3 (en) * | 1996-02-08 | 1999-05-06 | Showa Aluminum Corporation | An entry board for drilling small holes, a method of making the same and a method for drilling small holes through a printed circuit board by using said entry board |
| US6000886A (en) * | 1996-02-08 | 1999-12-14 | Showa Aluminum Corporation | Entry board for drilling small holes, a method of making the same and a method for drilling small holes through a printed circuit board by using said entry board |
| US6214135B1 (en) | 1996-02-08 | 2001-04-10 | Showa Aluminum Corporation | Entry board for drilling small holes, a method of making the same and a method for drilling small holes through a printed circuit board by using said entry board |
| JP2004210829A (en) * | 2002-12-27 | 2004-07-29 | Nippon Synthetic Chem Ind Co Ltd:The | Sheet for punching printed wiring substrate and method of punching printed wiring substrate using the sheet |
| JP4520692B2 (en) * | 2002-12-27 | 2010-08-11 | 日本合成化学工業株式会社 | Printed circuit board punching sheet and printed circuit board punching method using the sheet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4972189B2 (en) | Substrate manufacturing carrier member and substrate manufacturing method using the same | |
| JPS62271612A (en) | Drilling method for printed wiring board | |
| JPS6311207A (en) | Method for drilling printed circuit board | |
| KR101119380B1 (en) | A carrier member for manufacturing a substrate and a method of manufacturing a substrate using the same | |
| JP4123637B2 (en) | Film carrier manufacturing method | |
| KR20110017757A (en) | Sheet for drilling flexible print circuit board, method for drilling flexible print circuit board using the same, and method for producing flexible print circuit board | |
| JPS6310588A (en) | Manufacture of printed wiring board | |
| JPH04130790A (en) | Working method for printed wiring board | |
| JPH09260840A (en) | Multilayered printed wiring board manufacturing method | |
| JPS59217385A (en) | Printed circuit board | |
| JPS60262636A (en) | Metallic-base laminated board | |
| JPS6372192A (en) | Manufacture of circuit board | |
| JPS634689A (en) | Printed wiring board | |
| JPS5967687A (en) | Printed circuit board | |
| JPS622591A (en) | Manufacture of metal base hybrid integrated circuit board | |
| JP4045472B2 (en) | Wiring board manufacturing method | |
| JPH05208398A (en) | Holing method for printed wiring board and lower pad plate for use therein | |
| JPH01171710A (en) | Entry board | |
| JPS62242343A (en) | Manufacture of semiconductor chip carrier | |
| JPS60263698A (en) | Method of processing metallic-base laminated board | |
| JPH05347467A (en) | Manufacture of aluminum board for semiconductor | |
| JPH01168444A (en) | Silicon steel plate base laminated plate | |
| JPS62214000A (en) | Drill working method of printed wiring board | |
| JPS61203694A (en) | Manufacture of laminate plate for aditive plating | |
| JPS61276396A (en) | Manufacture of printed wiring board |