JPH01163334U - - Google Patents
Info
- Publication number
- JPH01163334U JPH01163334U JP6019988U JP6019988U JPH01163334U JP H01163334 U JPH01163334 U JP H01163334U JP 6019988 U JP6019988 U JP 6019988U JP 6019988 U JP6019988 U JP 6019988U JP H01163334 U JPH01163334 U JP H01163334U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- chip
- electronic component
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6019988U JPH01163334U (cs) | 1988-05-06 | 1988-05-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6019988U JPH01163334U (cs) | 1988-05-06 | 1988-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163334U true JPH01163334U (cs) | 1989-11-14 |
Family
ID=31285918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6019988U Pending JPH01163334U (cs) | 1988-05-06 | 1988-05-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163334U (cs) |
-
1988
- 1988-05-06 JP JP6019988U patent/JPH01163334U/ja active Pending
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