JPH01161302U - - Google Patents
Info
- Publication number
- JPH01161302U JPH01161302U JP5711488U JP5711488U JPH01161302U JP H01161302 U JPH01161302 U JP H01161302U JP 5711488 U JP5711488 U JP 5711488U JP 5711488 U JP5711488 U JP 5711488U JP H01161302 U JPH01161302 U JP H01161302U
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- soldered
- lead wire
- copper
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
- Contacts (AREA)
Description
第１図ないし第４図は本考案の一実施例を示す
図である。第１図は可変抵抗器用抵抗基板の平面
図、第２図は第１図のＡ―Ａ′断面図、第３図お
よび第４図は本考案による金属端子又はリード線
が半田付けされた状態を示す構造断面図である。
１：基板、２：第１の導体層、３：第２の導体
層、４：抵抗体層、５：半田層、６：金属端子又
はリード線。
1 to 4 are diagrams showing an embodiment of the present invention. Fig. 1 is a plan view of a resistance board for a variable resistor, Fig. 2 is a sectional view taken along line A-A' in Fig. 1, and Figs. 3 and 4 are soldered metal terminals or lead wires according to the present invention. FIG. 1: Substrate, 2: First conductor layer, 3: Second conductor layer, 4: Resistor layer, 5: Solder layer, 6: Metal terminal or lead wire.
Claims (1)
体層と、該第１の導体層の全面又はその一部を覆
うように銅を主体とする第２の導体層とが重畳形
成され、該第２の導体層に金属端子又はリード線
が半田付けされたことを特徴とする電子部品の端
子構造。 A first conductor layer containing silver coated on an insulating substrate and a second conductor layer mainly composed of copper are formed in an overlapping manner so as to cover the entire surface or a part of the first conductor layer, A terminal structure for an electronic component, characterized in that a metal terminal or a lead wire is soldered to the second conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5711488U JPH01161302U (en) | 1988-04-27 | 1988-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5711488U JPH01161302U (en) | 1988-04-27 | 1988-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01161302U true JPH01161302U (en) | 1989-11-09 |
Family
ID=31282968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5711488U Pending JPH01161302U (en) | 1988-04-27 | 1988-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01161302U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6323707B2 (en) * | 1983-06-30 | 1988-05-17 | Sanyo Denki Kk |
-
1988
- 1988-04-27 JP JP5711488U patent/JPH01161302U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6323707B2 (en) * | 1983-06-30 | 1988-05-17 | Sanyo Denki Kk |
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