JPH01157540A - ボンデイング装置における試料持ち上げ装置 - Google Patents

ボンデイング装置における試料持ち上げ装置

Info

Publication number
JPH01157540A
JPH01157540A JP62315167A JP31516787A JPH01157540A JP H01157540 A JPH01157540 A JP H01157540A JP 62315167 A JP62315167 A JP 62315167A JP 31516787 A JP31516787 A JP 31516787A JP H01157540 A JPH01157540 A JP H01157540A
Authority
JP
Japan
Prior art keywords
holder
carrier
pin
sample stage
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62315167A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0546979B2 (enExample
Inventor
Shigeru Fukuya
福家　滋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP62315167A priority Critical patent/JPH01157540A/ja
Publication of JPH01157540A publication Critical patent/JPH01157540A/ja
Publication of JPH0546979B2 publication Critical patent/JPH0546979B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP62315167A 1987-12-15 1987-12-15 ボンデイング装置における試料持ち上げ装置 Granted JPH01157540A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62315167A JPH01157540A (ja) 1987-12-15 1987-12-15 ボンデイング装置における試料持ち上げ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62315167A JPH01157540A (ja) 1987-12-15 1987-12-15 ボンデイング装置における試料持ち上げ装置

Publications (2)

Publication Number Publication Date
JPH01157540A true JPH01157540A (ja) 1989-06-20
JPH0546979B2 JPH0546979B2 (enExample) 1993-07-15

Family

ID=18062229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62315167A Granted JPH01157540A (ja) 1987-12-15 1987-12-15 ボンデイング装置における試料持ち上げ装置

Country Status (1)

Country Link
JP (1) JPH01157540A (enExample)

Also Published As

Publication number Publication date
JPH0546979B2 (enExample) 1993-07-15

Similar Documents

Publication Publication Date Title
US4923054A (en) Wafer transfer apparatus having an improved wafer transfer portion
KR100244688B1 (ko) 웨이퍼 반송장치
US5181646A (en) Lead frame holding apparatus for use in wire bonders
JPH01157540A (ja) ボンデイング装置における試料持ち上げ装置
US5009590A (en) Method and apparatus for preheating semiconductor chips
US5755373A (en) Die push-up device
KR100217285B1 (ko) 다이이송장치
JPS60258020A (ja) ガラス板のマ−キング装置
JPS6359807B2 (enExample)
JPS63169242A (ja) 基板矯正保持方法及びその装置
JPH09147786A (ja) 基板保持方法および該方法に用いる基板保持機構
JP2817080B2 (ja) ボンディング装置
CN222004605U (zh) 一种手提扣的压合机构
CN219904845U (zh) 电子元器件全自动套管成型编带一体机的套管装套机构
JPH09130095A (ja) 縦型電子部品挿入方法とその装置
KR950000559Y1 (ko) 분리기능을 갖는 칩 이송장치
JP2853889B2 (ja) 基板移載装置
JPH07155848A (ja) プレス装置
KR19980023281A (ko) 칩 픽업장치
JP3701562B2 (ja) 遊技機製造用釘打装置
KR870001399Y1 (ko) 꼬리표 부착용 바늘의 자동 가공장치
CN115354451A (zh) 一种撬缝缝纫机的抬牙送料装置
SU1433757A1 (ru) Устройство дл подачи деталей
KR910008945Y1 (ko) 리이드프레임 세퍼레이터
CN118237685A (zh) 一种带自动固定功能的焊锡机