JPH01156063A - Surface mounting screen - Google Patents

Surface mounting screen

Info

Publication number
JPH01156063A
JPH01156063A JP31677087A JP31677087A JPH01156063A JP H01156063 A JPH01156063 A JP H01156063A JP 31677087 A JP31677087 A JP 31677087A JP 31677087 A JP31677087 A JP 31677087A JP H01156063 A JPH01156063 A JP H01156063A
Authority
JP
Japan
Prior art keywords
main body
screen
screen main
surface mounting
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31677087A
Other languages
Japanese (ja)
Inventor
Fushimi Yamauchi
山内　節美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP31677087A priority Critical patent/JPH01156063A/en
Publication of JPH01156063A publication Critical patent/JPH01156063A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To make a screen main body thin, by providing through-holes formed so as to permit cream solder to pass to the screen main body. CONSTITUTION:A surface mounting screen is constituted of a screen main body 1 and the through-holes 2 formed to the screen main body 1. The thickness (t) of the screen main body 1 is set to about 100mum. Because of this, cream solder is easy to pass through the through-holes 2 and a good passing property is obtained. By forming the through-holes to the screen main body, the thickness of the screen main body can be set to 100mum and the passing property of cream solder can be enhanced.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、表面実装用スクリーン、特に、表面実契パッ
ケージの組立時に使用される表面実装用スクリーンに関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a surface mounting screen, and particularly to a surface mounting screen used during assembly of a surface mounting package.

〔従来の技術〕[Conventional technology]

従来ｖ’＊面実装用スクリーンは、スクリーン本体の厚
さが、２００μｏｒ１５０μという厚さの厚いものが使
用されていた。Conventionally, v'* surface mounting screens have been used with thick screen bodies having a thickness of 200 μm or 150 μm.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながら、このような上述した従来のスクリーンは
厚さが２００μあるため、１００ｐｉｎ以上のＱＦＰ　
（Ｑｇｕａｄ　Ｆｌａｔ　Ｐａｃｋａｇｅ）になると、
クリームハンダの抜は性が悪いという欠点がある。However, since the above-mentioned conventional screen has a thickness of 200μ, it cannot be used for QFPs with 100 pins or more.
(Qguad Flat Package)
Cream solder removal has the disadvantage of being poor quality.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の表面実装用スクリーンは、厚さを薄くして構成
される。The surface mounting screen of the present invention is constructed with a reduced thickness.

〔実施例〕〔Example〕

次に、本発明の実施例について、図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.

第１図は本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing one embodiment of the present invention.

第１図に示す表面実装用スクリーンは、スクリーン本体
１と、スクリーン本体工の中に形成された抜穴２とを含
んで構成する。The surface mounting screen shown in FIG. 1 includes a screen body 1 and a hole 2 formed in the screen body.

このスクリーン本体１は厚さｔが１００μで構成されて
いる。This screen body 1 has a thickness t of 100μ.

このため、クリームハンダはこの抜穴２を通りやすく抜
は性がよい。Therefore, cream solder easily passes through this hole 2 and has good removal properties.

〔発明の効果〕〔Effect of the invention〕

本発明の表面実装用のスクリーンは、厚さを１００μと
することで、クリームハンダの抜は性を向上できるとい
う効果がある。The screen for surface mounting of the present invention has the effect of improving cream solder removal properties by having a thickness of 100 μm.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例を示す断面図である。 １・・・・・・スクリーン本体、２・・・・・・抜穴、
ｔ・・・・・・厚さ。 代理人　弁理士　　内　原　　　晋 第１図FIG. 1 is a sectional view showing one embodiment of the present invention. 1...Screen body, 2...Extraction hole,
t...Thickness. Agent: Susumu Uchihara, patent attorney Figure 1

Claims (1)

【特許請求の範囲】[Claims] 厚さが薄くされたスクリーン本体と、このスクリーン本
体の中にクリームハンダが抜けるように形成された抜穴
とを含むことを特徴とする表面実装用スクリーン。A screen for surface mounting comprising a screen main body having a reduced thickness and a hole formed in the screen main body so that cream solder can pass through.
JP31677087A 1987-12-14 1987-12-14 Surface mounting screen Pending JPH01156063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31677087A JPH01156063A (en) 1987-12-14 1987-12-14 Surface mounting screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31677087A JPH01156063A (en) 1987-12-14 1987-12-14 Surface mounting screen

Publications (1)

Publication Number Publication Date
JPH01156063A true JPH01156063A (en) 1989-06-19

Family

ID=18080731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31677087A Pending JPH01156063A (en) 1987-12-14 1987-12-14 Surface mounting screen

Country Status (1)

Country Link
JP (1) JPH01156063A (en)

Similar Documents

Publication Publication Date Title
JPH01156063A (en) Surface mounting screen
JPS63200550A (en) Lead frame
JPH0368157A (en) High frequency thick film integrated circuit device
JPH03211784A (en) Printed board
JPS62160290A (en) Soldering mask
JPH027536A (en) Semiconductor device
JPH04147660A (en) Package of electronic component and mounting structure thereof
JPS5887581A (en) Liquid crystal display element
JPH03248454A (en) Hybrid integrated circuit device
JPH04176156A (en) Semiconductor device lead frame
JPH04116965A (en) Thin film semiconductor device
JPH04170057A (en) Ic package
JPH04186658A (en) Manufacture of semiconductor device
JPH02303090A (en) Multilayer board
JPH04186755A (en) Lead frame
JPS633462B2 (en)
GB1389096A (en) Correcting lenses utilized in the manufacture of fluorescent screen of colour picture tubes and method of manufacturing the same
JPS63226092A (en) Ceramic board for electronic component
JPH04188660A (en) Lead frame
JPS61135213A (en) Lc noise filter
JPH01189196A (en) Through-hole forming method
JPS6129321U (en) liquid crystal device
JPS6430847U (en)
JPS6027166A (en) Semiconductor device
JPH0499052A (en) Lead frame