JPH04186658A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH04186658A JPH04186658A JP31184390A JP31184390A JPH04186658A JP H04186658 A JPH04186658 A JP H04186658A JP 31184390 A JP31184390 A JP 31184390A JP 31184390 A JP31184390 A JP 31184390A JP H04186658 A JPH04186658 A JP H04186658A
- Authority
- JP
- Japan
- Prior art keywords
- ink layer
- semiconductor device
- character
- sealing resin
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の製造方法に関し、特に半導体装置
の封止樹脂表面への文字の形成方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for forming characters on the surface of a sealing resin of a semiconductor device.
従来、半導体装置における文字の形成は、平坦な封止樹
脂表面にインクで捺印するか、またはレーザビームで樹
脂表面に溝による文字を設ける方法が主に用いられてい
た。Conventionally, to form characters on semiconductor devices, the main methods used have been to stamp a flat sealing resin surface with ink, or to form characters in the form of grooves on the resin surface using a laser beam.
しかしながら、インクで捺印する方法は、インクの固着
強度や捺印状態により文字が欠けて品質が低下する欠点
がある。また、レーザで直接封止樹脂に溝により文字を
形成する方法ては、封止樹脂の色により文字の認識が困
難になるという欠点がある。However, the method of stamping with ink has the disadvantage that characters are chipped and the quality deteriorates depending on the adhesion strength of the ink and the state of the stamp. Furthermore, the method of directly forming characters in the form of grooves in the sealing resin using a laser has the disadvantage that the color of the sealing resin makes it difficult to recognize the characters.
本発明の目的は、上記欠点を除去し、明確な文字を形成
することのてきる半導体装置の製造方法を提供すること
にある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a semiconductor device that eliminates the above-mentioned drawbacks and enables the formation of clear characters.
本発明の半導体装１の製造方法は、半導体装置の封止樹
脂表面にインク層を形成したのち、レーザビームを用い
てこのインク層に文字を形成するものである。In the method of manufacturing the semiconductor device 1 of the present invention, an ink layer is formed on the surface of the sealing resin of the semiconductor device, and then characters are formed on the ink layer using a laser beam.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の一実施例を説明するた
めの半導体装置の断面図である。FIGS. 1(a) and 1(b) are cross-sectional views of a semiconductor device for explaining one embodiment of the present invention.
まず第１図（ａ）に示す様に、半導体装置１の表面に例
えばインク層２を形成する。半導体装置１の封止樹脂が
黒色てあれば、インク層２は白色のものとする。First, as shown in FIG. 1(a), for example, an ink layer 2 is formed on the surface of a semiconductor device 1. If the sealing resin of the semiconductor device 1 is black, the ink layer 2 is white.
次に第１図（ｂ）に示すように、レーザビーム３により
インク層２に？ＩＩ４を設けることによって文字の形成
を行なう。Next, as shown in FIG. 1(b), the laser beam 3 is applied to the ink layer 2. Characters are formed by providing II4.
このように本実施例によれば、封止樹脂と異なる色のイ
ンク層にレーザビームにより文字を形成するため、従来
のように文字が欠けたり文字の認識ができなくなったり
することはなくなる６尚、上記実施例においては１層の
インク層を用いた場合について説明したが、２１ｍのイ
ンク層を用いてもよい。この場合形成する文字の色は２
層のインク層により自由に選択できる。In this way, according to this embodiment, since characters are formed using a laser beam on an ink layer of a color different from that of the sealing resin, there is no possibility of characters being missing or being unrecognizable as in the past. In the above embodiment, the case where one ink layer was used was described, but a 21 m ink layer may be used. In this case, the color of the characters formed is 2
It can be freely selected depending on the ink layer.
以上説明したように本発明は、半導体装置の表面にイン
ク層を形成したのち、このインク層にレーザビームによ
り文字を形成することにより、欠けがなくかつ認識の容
易な文字が形成された′半導体装置が得られるという効
果がある。As explained above, the present invention forms an ink layer on the surface of a semiconductor device, and then forms characters on this ink layer using a laser beam. This has the effect of providing a device.
【図面の簡単な説明】
第１図は本発明の一実施例を説明するための半導体装置
の断面図である。
１・・・半導体装置、２・・・インク層、３・・レーザ
ビーム、４・・・溝。
代理人 弁理士 内 原 音BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of a semiconductor device for explaining one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Ink layer, 3... Laser beam, 4... Groove. Agent Patent Attorney Oto Uchihara
Claims (1)
レーザビームを用いてこのインク層に文字を形成するこ
とを特徴とする半導体装置の製造方法。After forming an ink layer on the surface of the sealing resin of the semiconductor device,
A method for manufacturing a semiconductor device, comprising forming characters on the ink layer using a laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31184390A JPH04186658A (en) | 1990-11-16 | 1990-11-16 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31184390A JPH04186658A (en) | 1990-11-16 | 1990-11-16 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04186658A true JPH04186658A (en) | 1992-07-03 |
Family
ID=18022074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31184390A Pending JPH04186658A (en) | 1990-11-16 | 1990-11-16 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04186658A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000066315A1 (en) * | 1999-04-30 | 2000-11-09 | Pacific Technology Corporation | Method for inscribing indicia on or in a workpiece |
| DE102016104160A1 (en) | 2015-03-10 | 2016-09-15 | Jtekt Corporation | Grinding wheel and grinding machine |
| CN111318816A (en) * | 2020-02-29 | 2020-06-23 | 上海萌化网络科技有限公司 | Integral cambered surface laser engraving process |
-
1990
- 1990-11-16 JP JP31184390A patent/JPH04186658A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000066315A1 (en) * | 1999-04-30 | 2000-11-09 | Pacific Technology Corporation | Method for inscribing indicia on or in a workpiece |
| DE102016104160A1 (en) | 2015-03-10 | 2016-09-15 | Jtekt Corporation | Grinding wheel and grinding machine |
| CN111318816A (en) * | 2020-02-29 | 2020-06-23 | 上海萌化网络科技有限公司 | Integral cambered surface laser engraving process |
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