JPS63226092A - Ceramic board for electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a ceramic substrate for electronic components such as chip components used in electronic equipment.

Prior Art Conventionally, this type of ceramic substrate has had a shape as shown in FIG. Figure 6 shows ceramics used to make chip parts.
This is a schematic diagram of a substrate 1, in which 2 is a vertical dividing groove, 3 is a horizontal dividing groove, and is formed only by dividing grooves on the surface. Moreover, the shape of the dividing groove was a V-groove.

In terms of divisibility, such conventional ceramic substrates tend to have irregularly shaped cross sections when divided as shown in FIG.
This method has the drawback of causing trouble when mounting chip components.

On the other hand, a balance resistor using such a substrate generally has a structure as shown in FIG. In FIG. 8, 5 is a glass portion that protects the resistor, 6 is an electrode portion, and 7 is a glass portion that protects the resistor.
is a ceramic board with divided boards.

Such a conventional split board shape has a drawback that some electrode corners have sharp angles, and mounting soldering tends to cause stress to concentrate on some rear electrode corners, reducing the electrode adhesion strength.

Problems to be Solved by the Invention In order to improve the divisibility with such a conventional board, 1.
The second problem is that the dividing grooves must be made deep, and if they are made too deep, the ceramic substrate will warp and undulate, which will have an adverse effect on the product characteristics.

Second, if dividing grooves are provided on both sides as shown in Fig. 9, the dividing property will be improved, but there is a problem that stress concentration on some electrode corners ea and ab cannot be eliminated. .

It is an object of the present invention to solve the above-mentioned problems of the divisibility of a ceramic substrate and concentration of stress in a part of an electrode corner.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides dividing grooves on the same line on both the front and back surfaces, and further makes the cross-sectional shape of the dividing grooves polygonal.

Effect: According to this configuration, division occurs in the direction from the front dividing groove tip to the back dividing groove tip, and an irregular cross section is not generated.

Furthermore, by providing polygonality to the cross-sectional shape of the dividing groove, stress at a part of the electrode corner is dispersed to multiple points, preventing stress from concentrating on one point. An example will be explained with reference to the drawings.

FIG. 1 shows a ceramic substrate according to an embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view from the lateral direction of FIG. 1, and the dividing groove has a diagonal shape. FIG. 3 is an enlarged cross-sectional view from the vertical direction of FIG.
The shape is a V-groove. Moreover, FIG. 4 is a diagram showing the electrode portion of a chip resistor manufactured by dividing the structure shown in FIG. 1 into products.

In the present invention, as shown in FIG. 2, the ceramic substrate 10 is provided with horizontal dividing grooves 12 on both the front and back surfaces, and the shape of the dividing grooves is changed from a V-groove to a polygonal dividing groove with two corners. For example, the angle A in Figure 2 is 132°.

B is 150. C had a dividing groove shape of 79° and D had a horizontal dividing groove shape of 20° on the front and back sides. The cross-sectional view of the dividing groove 12 in the horizontal direction of the ceramic substrate in FIG. 2 corresponds to the electrode part in FIG.
The slope 13 in the figure is the slope 20 in FIG. 4, and the slope 14 is the slope 2 in FIG.
1, the slope 16 is connected to the slope 22, the slope 16 is connected to the slope 23,
Slope 17 corresponds to slope 24.

In addition, in FIG. 4, 5,6.7f''i in FIG.
This is the same part as 6.7.

In this way, dividing grooves are provided on both the front and back surfaces, and the dividing grooves are polygonal like two corners.

Hereinafter, specific examples using the ceramic substrate of the present invention will be described.

200 ceramic work boards of the present invention were made and put into the TEP resistor manufacturing line, and the product dimensions and variations were checked.
Furthermore, we measured the electrode strength of the finished chip resistor and compared it with conventional products.

The results are shown in Table-1.

Table-1 Test sample N=200 Product dimensions are standard 2.0±0.1W&, but the product of the present invention! = 2.04 parrot, the conventional product had i = 2.08 parrot, and the product of the present invention was able to bring it close to the middle of the standard value.

Further, the product dimensional variation was δ = 0.00911), which was significantly reduced compared to the conventional product δ = 0.016.

Furthermore, regarding the electrode strength, as a result of measuring the electrode deflection strength after soldering the chip resistor, the product of the present invention had Min=8m, which was significantly sharper than the SM of the conventional product.

In addition, regarding the electrode deflection strength, the through thickness 1 shown in Figure 5 is used.
A chip resistor 3o is soldered to the center of the printed circuit board 29, and the center part 32 of the chip resistor is used as a point of emphasis, and the distance between the fulcrums 33 is set to 901 EB, and the printed circuit board 29 is forcibly bent to prevent the chip resistor electrode from peeling off. This is to measure the deflection distance 34 of the printed circuit board 29 when this occurs.

Effects of the Invention As described above, by providing dividing grooves on both the front and back surfaces, the ceramic substrate of the present invention can be divided from the direction of the dividing grooves on the front surface to the direction of the dividing grooves on the back surface, and can maintain a divided shape without irregularities. However, by making the cross-sectional shape of the dividing grooves on the front and back screens polygonal, it is possible to disperse the stress to a part of the electrode corner after soldering the chip resistor using the ceramic substrate, and improve the electrode strength. You can improve your level.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a ceramic substrate for electronic components according to an embodiment of the present invention, Fig. 2 is an enlarged cross-sectional view from the horizontal direction of Fig. 1, and Fig. 3 is an enlarged cross-sectional view from the vertical direction of Fig. 1. Figure 4 is a perspective view showing the electrode part of a chip resistor manufactured by dividing Figure 1, Figure 6 is a schematic diagram of the electrode bending strength test, Figures 6 a to C are conventional ceramic A perspective view and a cross-sectional view of the board, FIG. 7 is a cross-sectional view when the ceramic substrate of FIG. 6 is divided, FIG. 8 is a cross-sectional view of a general chip resistor,
FIG. 9 is a cross-sectional view of a chip resistor using a ceramic substrate without polygons. 10... Ceramic substrate, 11.12...
...Dividing groove. Name of agent: Patent attorney Toshio Nakao and 1 other person! I
) Phrases Figure 4 Figure 6

Claims (1)

[Claims] Dividing grooves are provided to divide the substrate into a large number of small substrates,
A ceramic substrate for electronic components, characterized in that the dividing groove has a polygonal cross-sectional shape.