JPH0114718B2 - - Google Patents
Info
- Publication number
- JPH0114718B2 JPH0114718B2 JP11333979A JP11333979A JPH0114718B2 JP H0114718 B2 JPH0114718 B2 JP H0114718B2 JP 11333979 A JP11333979 A JP 11333979A JP 11333979 A JP11333979 A JP 11333979A JP H0114718 B2 JPH0114718 B2 JP H0114718B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- photoresist film
- polyimide
- polyimide layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001721 polyimide Polymers 0.000 claims description 17
- 239000004642 Polyimide Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 239000010408 film Substances 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 229920002120 photoresistant polymer Polymers 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 5
- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000001039 wet etching Methods 0.000 claims description 2
- 238000001312 dry etching Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 229920005575 poly(amic acid) Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11333979A JPS5637692A (en) | 1979-09-04 | 1979-09-04 | Method of manufacturing hybrid thin film integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11333979A JPS5637692A (en) | 1979-09-04 | 1979-09-04 | Method of manufacturing hybrid thin film integrated circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5637692A JPS5637692A (en) | 1981-04-11 |
| JPH0114718B2 true JPH0114718B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-14 |
Family
ID=14609731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11333979A Granted JPS5637692A (en) | 1979-09-04 | 1979-09-04 | Method of manufacturing hybrid thin film integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5637692A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01125966A (ja) * | 1987-11-11 | 1989-05-18 | Fujitsu Ltd | 薄膜回路基板の製造方法 |
| KR0155186B1 (ko) * | 1992-05-26 | 1998-12-15 | 키무라 미치오 | 세라믹 기판과 그 제조방법 및 세라믹 흡착기판을 사용한 박판흡착장치 |
| EP1170797A3 (en) * | 2000-07-04 | 2005-05-25 | Alps Electric Co., Ltd. | Thin-film capacitor element and electronic circuit board on which thin-film capacitor element is formed |
-
1979
- 1979-09-04 JP JP11333979A patent/JPS5637692A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5637692A (en) | 1981-04-11 |