JPS5637692A - Method of manufacturing hybrid thin film integrated circuit board - Google Patents

Method of manufacturing hybrid thin film integrated circuit board

Info

Publication number
JPS5637692A
JPS5637692A JP11333979A JP11333979A JPS5637692A JP S5637692 A JPS5637692 A JP S5637692A JP 11333979 A JP11333979 A JP 11333979A JP 11333979 A JP11333979 A JP 11333979A JP S5637692 A JPS5637692 A JP S5637692A
Authority
JP
Japan
Prior art keywords
circuit board
thin film
integrated circuit
film integrated
hybrid thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11333979A
Other languages
Japanese (ja)
Other versions
JPH0114718B2 (en
Inventor
Toshirou Sasamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP11333979A priority Critical patent/JPS5637692A/en
Publication of JPS5637692A publication Critical patent/JPS5637692A/en
Publication of JPH0114718B2 publication Critical patent/JPH0114718B2/ja
Granted legal-status Critical Current

Links

JP11333979A 1979-09-04 1979-09-04 Method of manufacturing hybrid thin film integrated circuit board Granted JPS5637692A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11333979A JPS5637692A (en) 1979-09-04 1979-09-04 Method of manufacturing hybrid thin film integrated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11333979A JPS5637692A (en) 1979-09-04 1979-09-04 Method of manufacturing hybrid thin film integrated circuit board

Publications (2)

Publication Number Publication Date
JPS5637692A true JPS5637692A (en) 1981-04-11
JPH0114718B2 JPH0114718B2 (en) 1989-03-14

Family

ID=14609731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11333979A Granted JPS5637692A (en) 1979-09-04 1979-09-04 Method of manufacturing hybrid thin film integrated circuit board

Country Status (1)

Country Link
JP (1) JPS5637692A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01125966A (en) * 1987-11-11 1989-05-18 Fujitsu Ltd Manufacture of thin film circuit substrate
WO1993024925A1 (en) * 1992-05-26 1993-12-09 Nihon Cememt Co., Ltd. Ceramic substrate and its manufacture, and substrate vacuum-clamping device using ceramic vacuum-clamping board
EP1170797A3 (en) * 2000-07-04 2005-05-25 Alps Electric Co., Ltd. Thin-film capacitor element and electronic circuit board on which thin-film capacitor element is formed

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01125966A (en) * 1987-11-11 1989-05-18 Fujitsu Ltd Manufacture of thin film circuit substrate
WO1993024925A1 (en) * 1992-05-26 1993-12-09 Nihon Cememt Co., Ltd. Ceramic substrate and its manufacture, and substrate vacuum-clamping device using ceramic vacuum-clamping board
EP1170797A3 (en) * 2000-07-04 2005-05-25 Alps Electric Co., Ltd. Thin-film capacitor element and electronic circuit board on which thin-film capacitor element is formed

Also Published As

Publication number Publication date
JPH0114718B2 (en) 1989-03-14

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