JPH01142882U - - Google Patents

Info

Publication number
JPH01142882U
JPH01142882U JP4092188U JP4092188U JPH01142882U JP H01142882 U JPH01142882 U JP H01142882U JP 4092188 U JP4092188 U JP 4092188U JP 4092188 U JP4092188 U JP 4092188U JP H01142882 U JPH01142882 U JP H01142882U
Authority
JP
Japan
Prior art keywords
ceramic substrate
pad
relay electrode
wiring pattern
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4092188U
Other languages
English (en)
Other versions
JPH0725725Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4092188U priority Critical patent/JPH0725725Y2/ja
Publication of JPH01142882U publication Critical patent/JPH01142882U/ja
Application granted granted Critical
Publication of JPH0725725Y2 publication Critical patent/JPH0725725Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)

Description

【図面の簡単な説明】
第1図は本考案に係る高密度マイクロパツドの
全体平面図、第2図は第1図のA指示部の拡大平
面図、第3図は第2図のB―B仮想線における断
面図であり、第4図は一般的な電子ビーム検査装
置の全体構成図、第5図は従来のマイクロパツド
の平面図である。 25……セラミツク基板、26……パツド、2
7……配線パターン、28……中継電極である。

Claims (1)

    【実用新案登録請求の範囲】
  1. セラミツク基板25の表面にマトリツクス状に
    配設された導体からなる複数のパツド26と、該
    セラミツク基板25内部に層状に形成された信号
    引出し用の複数の配線パターン27と、該セラミ
    ツク基板25の厚み方向に形成された該パツド2
    6と該配線パターン27とを各々接続する中継電
    極28とを備えた高密度マイクロパツド。
JP4092188U 1988-03-28 1988-03-28 高密度マイクロパッド Expired - Lifetime JPH0725725Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4092188U JPH0725725Y2 (ja) 1988-03-28 1988-03-28 高密度マイクロパッド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4092188U JPH0725725Y2 (ja) 1988-03-28 1988-03-28 高密度マイクロパッド

Publications (2)

Publication Number Publication Date
JPH01142882U true JPH01142882U (ja) 1989-09-29
JPH0725725Y2 JPH0725725Y2 (ja) 1995-06-07

Family

ID=31267377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4092188U Expired - Lifetime JPH0725725Y2 (ja) 1988-03-28 1988-03-28 高密度マイクロパッド

Country Status (1)

Country Link
JP (1) JPH0725725Y2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6471944B1 (en) * 1997-08-07 2002-10-29 Taisho Pharmaceutical Co., Ltd. Aerosol powder with improved skin adhesion

Also Published As

Publication number Publication date
JPH0725725Y2 (ja) 1995-06-07

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