JPH01141925A - パラ配向アラミド繊維シートを基材とする改良複合材料 - Google Patents
パラ配向アラミド繊維シートを基材とする改良複合材料Info
- Publication number
- JPH01141925A JPH01141925A JP62301695A JP30169587A JPH01141925A JP H01141925 A JPH01141925 A JP H01141925A JP 62301695 A JP62301695 A JP 62301695A JP 30169587 A JP30169587 A JP 30169587A JP H01141925 A JPH01141925 A JP H01141925A
- Authority
- JP
- Japan
- Prior art keywords
- para
- aramid fiber
- fiber sheet
- oriented aramid
- oriented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
- D21H13/10—Organic non-cellulose fibres
- D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D21H13/26—Polyamides; Polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2377/00—Polyamides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/902—High modulus filament or fiber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2904—Staple length fiber
- Y10T428/2907—Staple length fiber with coating or impregnation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2938—Coating on discrete and individual rods, strands or filaments
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2962—Silane, silicone or siloxane in coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2964—Artificial fiber or filament
- Y10T428/2967—Synthetic resin or polymer
- Y10T428/2969—Polyamide, polyimide or polyester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62301695A JPH01141925A (ja) | 1987-11-30 | 1987-11-30 | パラ配向アラミド繊維シートを基材とする改良複合材料 |
| US07/276,765 US5002637A (en) | 1987-11-30 | 1988-11-28 | Composite material reinforced by para-oriented aramide fiber sheet and process for preparing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62301695A JPH01141925A (ja) | 1987-11-30 | 1987-11-30 | パラ配向アラミド繊維シートを基材とする改良複合材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01141925A true JPH01141925A (ja) | 1989-06-02 |
| JPH0360856B2 JPH0360856B2 (enExample) | 1991-09-18 |
Family
ID=17900035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62301695A Granted JPH01141925A (ja) | 1987-11-30 | 1987-11-30 | パラ配向アラミド繊維シートを基材とする改良複合材料 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5002637A (enExample) |
| JP (1) | JPH01141925A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05104675A (ja) * | 1991-10-18 | 1993-04-27 | Shin Kobe Electric Mach Co Ltd | 金属箔張り積層板およびその製造法 |
| WO1997001595A1 (en) * | 1995-06-27 | 1997-01-16 | Hitachi Chemical Company, Ltd. | Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances |
| WO2000049070A1 (en) * | 1999-02-19 | 2000-08-24 | Hitachi Chemical Co., Ltd. | Prepreg, metal-clad laminate, and printed circuit board obtained from these |
| KR100294686B1 (ko) * | 1998-07-21 | 2001-07-12 | 구본준, 론 위라하디락사 | 복합전계방식 액정표시소자 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0395232A (ja) * | 1989-09-08 | 1991-04-19 | Honshu Paper Co Ltd | パラ配向アラミド繊維状物質を基材とする改良複合材料及びその製造法 |
| DE4121547A1 (de) * | 1991-06-28 | 1993-01-14 | Daimler Benz Ag | Mehrschichtisolierfolie |
| FR2685363B1 (fr) * | 1991-12-24 | 1994-02-04 | Rhone Poulenc Fibres | Papiers synthetiques a base de fibres, pulpe et liant thermostables et leur procede d'obtention. |
| US5393872A (en) * | 1992-12-22 | 1995-02-28 | Teijin Limited | Sheetlike wholly aromatic polyamide shaped article and a method for producing the same |
| DE4401233A1 (de) * | 1994-01-18 | 1995-07-20 | Hoechst Ag | Bündel aus Stapelfasern aus aromatischen Polyamiden mit verbesserter Dispergierbarkeit in viskosen Matrizes, und Verfahren zur Herstellung von faserverstärkten Verbunden |
| EP0768334B1 (en) * | 1995-10-16 | 2004-02-18 | Sumitomo Chemical Company Limited | Prepreg, process for producing the same and printed circuit substrate using the same |
| DE69715960T2 (de) * | 1996-05-15 | 2003-01-30 | Matsushita Electric Industrial Co., Ltd. | Herstellungsverfahren eines Vliesstoffsubstrats für Leiterplattensubstrat und Herstellungsverfahren eines vorimpregnierten Materials |
| MY119783A (en) * | 1997-03-15 | 2005-07-29 | Sumitomo Chemical Co | Prepreg, process for producing the same and printed circuit substrate/ board using the same |
| DE19731946A1 (de) * | 1997-07-24 | 1999-01-28 | Roblon As | Befestigungseinrichtung für Rohre und andere Gegenstände sowie Verfahren zu deren Herstellung |
| DE69842092D1 (de) * | 1997-12-11 | 2011-02-17 | Ibiden Co Ltd | Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte |
| JP3631385B2 (ja) * | 1998-11-18 | 2005-03-23 | 王子製紙株式会社 | 積層板用基材およびその製造方法 |
| US6245696B1 (en) | 1999-06-25 | 2001-06-12 | Honeywell International Inc. | Lasable bond-ply materials for high density printed wiring boards |
| US6224965B1 (en) | 1999-06-25 | 2001-05-01 | Honeywell International Inc. | Microfiber dielectrics which facilitate laser via drilling |
| KR100840456B1 (ko) * | 2000-03-31 | 2008-06-20 | 히다치 가세고교 가부시끼가이샤 | 열경화성 수지 조성물, 수지 필름, 절연 재료 부착 금속박,양면 금속박 부착 절연 필름, 금속장 적층판, 다층 금속장적층판 및 다층 프린트 배선판 |
| US20020142689A1 (en) * | 2001-01-23 | 2002-10-03 | Levit Mikhail R. | Non-woven sheet of aramid floc |
| US7267288B2 (en) * | 2001-03-22 | 2007-09-11 | Nevada Supply Corporation | Polyurethane in intimate contact with fibrous material |
| US7258819B2 (en) | 2001-10-11 | 2007-08-21 | Littelfuse, Inc. | Voltage variable substrate material |
| US7332196B2 (en) * | 2002-03-29 | 2008-02-19 | Kazari-Ichi Co., Ltd. | Composite comprising heat-resistant fiber and siloxane polymer |
| US7183891B2 (en) * | 2002-04-08 | 2007-02-27 | Littelfuse, Inc. | Direct application voltage variable material, devices employing same and methods of manufacturing such devices |
| WO2003088356A1 (en) * | 2002-04-08 | 2003-10-23 | Littelfuse, Inc. | Voltage variable material for direct application and devices employing same |
| US7132922B2 (en) * | 2002-04-08 | 2006-11-07 | Littelfuse, Inc. | Direct application voltage variable material, components thereof and devices employing same |
| US20060152334A1 (en) * | 2005-01-10 | 2006-07-13 | Nathaniel Maercklein | Electrostatic discharge protection for embedded components |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4246313A (en) * | 1979-01-12 | 1981-01-20 | Owens-Illinois, Inc. | Heat-resistant composite material and method of making same |
| US4622170A (en) * | 1982-12-20 | 1986-11-11 | Northwestern University | Electrically conductive cofacially crystallizing organomacrocycle forming compositions |
| US4637851A (en) * | 1985-01-25 | 1987-01-20 | Shin-Etsu Chemical Co., Ltd. | Method for the preparation of a laminate |
-
1987
- 1987-11-30 JP JP62301695A patent/JPH01141925A/ja active Granted
-
1988
- 1988-11-28 US US07/276,765 patent/US5002637A/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05104675A (ja) * | 1991-10-18 | 1993-04-27 | Shin Kobe Electric Mach Co Ltd | 金属箔張り積層板およびその製造法 |
| WO1997001595A1 (en) * | 1995-06-27 | 1997-01-16 | Hitachi Chemical Company, Ltd. | Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances |
| KR100272785B1 (ko) * | 1995-06-27 | 2000-11-15 | 우찌가사끼 이사오 | 인쇄배선판용프리프래그,수지니스,수지조성물및상기물질을사용하여제조된인쇄배선판용적층판 |
| US6572968B2 (en) | 1995-06-27 | 2003-06-03 | Hitachi Chemical Co., Ltd. | Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards |
| US6692792B2 (en) | 1995-06-27 | 2004-02-17 | Hitachi Chemical Company, Ltd. | Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances |
| US6696155B1 (en) | 1995-06-27 | 2004-02-24 | Hitachi Chemical Company, Ltd. | Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances |
| KR100294686B1 (ko) * | 1998-07-21 | 2001-07-12 | 구본준, 론 위라하디락사 | 복합전계방식 액정표시소자 |
| WO2000049070A1 (en) * | 1999-02-19 | 2000-08-24 | Hitachi Chemical Co., Ltd. | Prepreg, metal-clad laminate, and printed circuit board obtained from these |
Also Published As
| Publication number | Publication date |
|---|---|
| US5002637A (en) | 1991-03-26 |
| JPH0360856B2 (enExample) | 1991-09-18 |
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