JPH01139448U - - Google Patents
Info
- Publication number
- JPH01139448U JPH01139448U JP1988034817U JP3481788U JPH01139448U JP H01139448 U JPH01139448 U JP H01139448U JP 1988034817 U JP1988034817 U JP 1988034817U JP 3481788 U JP3481788 U JP 3481788U JP H01139448 U JPH01139448 U JP H01139448U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chip
- sealed
- electronic component
- main surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Details Of Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988034817U JPH01139448U (enExample) | 1988-03-16 | 1988-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988034817U JPH01139448U (enExample) | 1988-03-16 | 1988-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139448U true JPH01139448U (enExample) | 1989-09-22 |
Family
ID=31261492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988034817U Pending JPH01139448U (enExample) | 1988-03-16 | 1988-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139448U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH054499U (ja) * | 1991-06-28 | 1993-01-22 | 関西日本電気株式会社 | チツプ型電子部品 |
| JP2012235161A (ja) * | 2012-08-01 | 2012-11-29 | Rohm Co Ltd | パッケージ型二端子半導体装置の構造 |
-
1988
- 1988-03-16 JP JP1988034817U patent/JPH01139448U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH054499U (ja) * | 1991-06-28 | 1993-01-22 | 関西日本電気株式会社 | チツプ型電子部品 |
| JP2012235161A (ja) * | 2012-08-01 | 2012-11-29 | Rohm Co Ltd | パッケージ型二端子半導体装置の構造 |