JPH01135787U - - Google Patents
Info
- Publication number
- JPH01135787U JPH01135787U JP3126188U JP3126188U JPH01135787U JP H01135787 U JPH01135787 U JP H01135787U JP 3126188 U JP3126188 U JP 3126188U JP 3126188 U JP3126188 U JP 3126188U JP H01135787 U JPH01135787 U JP H01135787U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- printed wiring
- wiring board
- flexible printed
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Camera Bodies And Camera Details Or Accessories (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の第１実施例の斜視図、第２図
は本考案の第２実施例の斜視図、第３図ａは本考
案の作用説明図、第３図ｂは本考案に対する比較
例の作用説明図、第４図は従来例の断面図である
。
１はフレキシブルプリント配線板、２はＩＣチ
ツプ、３は封止用樹脂である。
Fig. 1 is a perspective view of the first embodiment of the invention, Fig. 2 is a perspective view of the second embodiment of the invention, Fig. 3a is an explanatory diagram of the operation of the invention, and Fig. 3b is the perspective view of the invention. FIG. 4 is a sectional view of the conventional example. 1 is a flexible printed wiring board, 2 is an IC chip, and 3 is a sealing resin.
Claims (1)
樹脂で封止されているフレキシブルプリント配線
板を、封止用樹脂とフレキシブルプリント配線板
の接着強度の強い部分に接着強度の弱い部分より
も大きく応力が加わるような方向に曲げたことを
特徴とするフレキシブルプリント配線板の取付構
造。 (2) 電子部品が表面実装され、前記電子部品が
樹脂で封止されているフレキシブルプリント配線
板を、前記電子部品の実装された面の両側に凹面
が生じるように曲げたことを特徴とするフレキシ
ブルプリント配線板の取付構造。 (3) 電子部品が表面実装され、前記電子部品が
樹脂で封止されているフレキシブルプリント配線
板を、前記電子部品の実装された面の片側に凹面
が生じるように曲げたことを特徴とするフレキシ
ブルプリント配線板の取付構造。[Claims for Utility Model Registration] (1) A flexible printed wiring board on which electronic components are surface-mounted and the electronic components are sealed with a resin is used in a portion where the adhesive strength between the sealing resin and the flexible printed wiring board is strong. A flexible printed wiring board mounting structure characterized by bending the board in a direction that applies greater stress than areas with weaker adhesive strength. (2) A flexible printed wiring board on which electronic components are surface-mounted and the electronic components are sealed with resin is bent so that concave surfaces are formed on both sides of the surface on which the electronic components are mounted. Mounting structure of flexible printed wiring board. (3) A flexible printed wiring board on which electronic components are surface-mounted and the electronic components are sealed with resin is bent so that a concave surface is formed on one side of the surface on which the electronic components are mounted. Mounting structure of flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988031261U JPH0747913Y2 (en) | 1988-03-09 | 1988-03-09 | Flexible printed wiring board mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988031261U JPH0747913Y2 (en) | 1988-03-09 | 1988-03-09 | Flexible printed wiring board mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01135787U true JPH01135787U (en) | 1989-09-18 |
| JPH0747913Y2 JPH0747913Y2 (en) | 1995-11-01 |
Family
ID=31256993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988031261U Expired - Lifetime JPH0747913Y2 (en) | 1988-03-09 | 1988-03-09 | Flexible printed wiring board mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747913Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5630788A (en) * | 1979-08-22 | 1981-03-27 | Tokyo Shibaura Electric Co | Device for mounting chip element |
| JPS57183756U (en) * | 1981-05-15 | 1982-11-20 | ||
| JPS59215753A (en) * | 1983-05-24 | 1984-12-05 | Matsushita Electric Ind Co Ltd | Sealing process of circuit parts |
-
1988
- 1988-03-09 JP JP1988031261U patent/JPH0747913Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5630788A (en) * | 1979-08-22 | 1981-03-27 | Tokyo Shibaura Electric Co | Device for mounting chip element |
| JPS57183756U (en) * | 1981-05-15 | 1982-11-20 | ||
| JPS59215753A (en) * | 1983-05-24 | 1984-12-05 | Matsushita Electric Ind Co Ltd | Sealing process of circuit parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0747913Y2 (en) | 1995-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01135787U (en) | ||
| JPS6057152U (en) | printed wiring board | |
| JPS63178374U (en) | ||
| JPS6078191U (en) | Printed wiring board fixing device | |
| JPS58118758U (en) | LED display device | |
| JPS6045465U (en) | Printed circuit board connection structure | |
| JPH01154684U (en) | ||
| JPH03120063U (en) | ||
| JPS6113938U (en) | Plug-in package board | |
| JPS6057154U (en) | flexible printed board | |
| JPS59109185U (en) | Electronics | |
| JPH0227739U (en) | ||
| JPS6045447U (en) | semiconductor equipment | |
| JPS6078158U (en) | hybrid integrated circuit board | |
| JPH0444175U (en) | ||
| JPS59158336U (en) | semiconductor equipment | |
| JPH0465492U (en) | ||
| JPS6096810U (en) | electronic components | |
| JPS59155758U (en) | printed wiring board | |
| JPH0430768U (en) | ||
| JPS59117197U (en) | Heat sink mounting structure | |
| JPS6049662U (en) | Chip component mounting structure | |
| JPS63123038U (en) | ||
| JPS6262464U (en) | ||
| JPS6083276U (en) | Printed wiring board connection device |