JPH01130548U - - Google Patents
Info
- Publication number
- JPH01130548U JPH01130548U JP2691388U JP2691388U JPH01130548U JP H01130548 U JPH01130548 U JP H01130548U JP 2691388 U JP2691388 U JP 2691388U JP 2691388 U JP2691388 U JP 2691388U JP H01130548 U JPH01130548 U JP H01130548U
- Authority
- JP
- Japan
- Prior art keywords
- signal wiring
- electrical signal
- wiring layer
- layer
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002887 superconductor Substances 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図はこの考案の一実施例による半導体パツ
ケージの平面図、第２図は第１図の―線に沿
う断面図、第３図は従来の半導体パツケージの一
例を示す平面図、第４図は第３図の―線に沿
う断面図である。
２は半導体チツプ、３は電気信号配線層、４は
絶縁層、５は磁気シールド層、６は半導体パツケ
ージである。なお、図中、同一符号は同一、また
は相当部分を示す。
FIG. 1 is a plan view of a semiconductor package according to an embodiment of this invention, FIG. 2 is a sectional view taken along the line - in FIG. 1, FIG. 3 is a plan view showing an example of a conventional semiconductor package, and FIG. 4 is a sectional view taken along the line - in FIG. 3. 2 is a semiconductor chip, 3 is an electric signal wiring layer, 4 is an insulating layer, 5 is a magnetic shield layer, and 6 is a semiconductor package. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
を収容した半導体パツケージにおいて、前記電気
信号配線層に絶縁層を介して超電導体からなる磁
気シールド層を被つたことを特徴とする半導体パ
ツケージ。 1. A semiconductor package having an electrical signal wiring layer and housing a semiconductor chip, characterized in that the electrical signal wiring layer is covered with a magnetic shield layer made of a superconductor via an insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2691388U JPH01130548U (en) | 1988-03-02 | 1988-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2691388U JPH01130548U (en) | 1988-03-02 | 1988-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01130548U true JPH01130548U (en) | 1989-09-05 |
Family
ID=31248964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2691388U Pending JPH01130548U (en) | 1988-03-02 | 1988-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01130548U (en) |
-
1988
- 1988-03-02 JP JP2691388U patent/JPH01130548U/ja active Pending
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