JPS61168645U - - Google Patents
Info
- Publication number
- JPS61168645U JPS61168645U JP5097485U JP5097485U JPS61168645U JP S61168645 U JPS61168645 U JP S61168645U JP 5097485 U JP5097485 U JP 5097485U JP 5097485 U JP5097485 U JP 5097485U JP S61168645 U JPS61168645 U JP S61168645U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- power
- signal leads
- metal package
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 3
- 239000003990 capacitor Substances 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来のパツケージを示す断面図である。
図において１は導電性金属材料により形成され
た筐体、２は電源用リード、１０は高誘電率材料
である。なお、図中同一符号は、同一又は相当部
分を示している。
FIG. 1 is a sectional view showing an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional package. In the figure, 1 is a housing made of a conductive metal material, 2 is a power supply lead, and 10 is a high dielectric constant material. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
筐体を貫通して筐体の内部と外部を接続する複数
の電源用及び信号用リードと、前記筐体と前記電
源用及び信号用リードを絶縁、固定する誘電材料
とで構成された混成集積回路用金属パツケージに
おいて、前記筐体と前記電源用リード絶縁、固定
に高誘電率材料を用いて、前記筐体と前記電源用
リード間にコンデンサを形成してあることを特徴
とする混成集積回路用金属パツケージ。 A casing formed of a conductive metal material, a plurality of power and signal leads that penetrate the casing and connect the inside and outside of the casing, and a plurality of power and signal leads that connect the casing and the power and signal leads. In a metal package for a hybrid integrated circuit composed of an insulating and fixing dielectric material, a high dielectric constant material is used for insulating and fixing the casing and the power supply lead, and a capacitor is installed between the casing and the power supply lead. 1. A metal package for a hybrid integrated circuit, characterized in that the metal package comprises:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5097485U JPS61168645U (en) | 1985-04-05 | 1985-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5097485U JPS61168645U (en) | 1985-04-05 | 1985-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61168645U true JPS61168645U (en) | 1986-10-20 |
Family
ID=30569608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5097485U Pending JPS61168645U (en) | 1985-04-05 | 1985-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61168645U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6377141A (en) * | 1986-09-20 | 1988-04-07 | Fujitsu Ltd | Semiconductor device |
-
1985
- 1985-04-05 JP JP5097485U patent/JPS61168645U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6377141A (en) * | 1986-09-20 | 1988-04-07 | Fujitsu Ltd | Semiconductor device |
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