JPH01128558A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPH01128558A JPH01128558A JP28650587A JP28650587A JPH01128558A JP H01128558 A JPH01128558 A JP H01128558A JP 28650587 A JP28650587 A JP 28650587A JP 28650587 A JP28650587 A JP 28650587A JP H01128558 A JPH01128558 A JP H01128558A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- frame
- semiconductor device
- leads
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011241 protective layer Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂封止型半導体装置に関し、特にフラットパ
ッケージタイプの半導体装置の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealed semiconductor device, and particularly to the structure of a flat package type semiconductor device.
従来、この種の樹脂封止型半導体装置は第２図（ａ）、
（ｂ）に示されるように、リードフレームのアイランド
１と、この上に固着された半導体素子２と、この半導体
素子２とボンディングワイヤー６により接続された外部
リード３の一部とを封止樹脂４で封止したのち、成形工
程において第３図に示すように、外部リード３を成形す
ると同時に、リードフレームの外枠１０を切り離してい
た。Conventionally, this type of resin-sealed semiconductor device is shown in FIG. 2(a).
As shown in (b), the island 1 of the lead frame, the semiconductor element 2 fixed thereon, and a part of the external lead 3 connected to the semiconductor element 2 by the bonding wire 6 are sealed with resin. 4, the outer lead frame 10 of the lead frame was separated at the same time as the external leads 3 were formed in the molding process, as shown in FIG.
上述した従来の樹脂封止型半導体装置は、外部リード成
形後、外枠１０が外されるため、作業者による製品のハ
ンドリング、製品収納時におけろ収納トレー内の製品の
位置ずれ、製品の落下等に起因する外部からの力により
、リード曲がりを生じるという欠点がある。In the above-mentioned conventional resin-sealed semiconductor device, the outer frame 10 is removed after external lead molding, resulting in problems such as handling of the product by an operator, misalignment of the product in the storage tray when storing the product, and falling of the product. There is a drawback that the leads may be bent due to external forces caused by such factors.
Ｃ問題点を解決するための手段〕
本発明の樹脂封止型半導体装置は、リードフレームのア
イランドと該アイランドに固着された半導体素子と該半
導体素子に接続する外部リードの一部とを樹脂封止して
なる樹脂封止型半導体装置であって、前記外部リードの
周囲には保護用の樹脂枠が設けられているものである。Means for Solving Problem C] The resin-sealed semiconductor device of the present invention resin-seals the island of a lead frame, the semiconductor element fixed to the island, and a part of the external lead connected to the semiconductor element. The semiconductor device is a resin-sealed type semiconductor device, and a protective resin frame is provided around the external lead.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）は、本発明の一実施例の上面図及
び側面図である。FIGS. 1(a) and 1(b) are a top view and a side view of an embodiment of the present invention.
第１図（ａ）、（ｂ）において、リードフレームのアイ
ランド１と、このアイランド１上に固着された半導体素
子２と、この半導体素子２にボンディングワイヤーによ
り接続された外部リード３の一部は封止樹脂４により封
止されている。そして、特にこの外部リード３の周囲に
は保護用の樹脂枠５が設けられている。尚樹脂枠５は見
易いように斜線が施しである。In FIGS. 1(a) and 1(b), an island 1 of a lead frame, a semiconductor element 2 fixed on this island 1, and a part of an external lead 3 connected to this semiconductor element 2 by a bonding wire are shown. It is sealed with a sealing resin 4. In particular, a protective resin frame 5 is provided around the external lead 3. Note that the resin frame 5 is shaded with diagonal lines for easy viewing.
このように構成された本実施例においては、樹脂封止型
半導体装置の周囲に保護用の樹脂枠５が設けられている
ため、外部からの力により外部リード３が曲ることはな
くなる。In this embodiment configured in this manner, the protective resin frame 5 is provided around the resin-sealed semiconductor device, so that the external leads 3 are prevented from being bent by external forces.
尚、樹脂枠５は半導体素子２等を樹脂封止する際に同時
に形成することができるため、特別の工程は必要とはし
ない。Incidentally, since the resin frame 5 can be formed at the same time when the semiconductor element 2 and the like are sealed with resin, no special process is required.
〔発明の効果〕
以上説明した様に本発明は、樹脂封止型半導体装置の外
部リードを樹脂枠で取り囲むことにより、リード成形後
、作業者による製品のハンドリングや、収納トレー内で
の製品の位置ずれや製品の落下環によるリード曲りの発
生が抑制されるという効果がある。[Effects of the Invention] As explained above, the present invention surrounds the external leads of a resin-sealed semiconductor device with a resin frame, thereby making it easier for an operator to handle the product and to store the product in a storage tray after lead molding. This has the effect of suppressing the occurrence of lead bending due to misalignment or falling rings of the product.
第１図（ａ）、（ｂ）は本発明の一実施例の上面図及び
側面図、第２図（ａ）、（ｂ）は従来の樹脂封止型半導
体装置の上面図及びＡ−Ａ’線断面図、第３図は従来の
樹脂封止型半導体装置の外部リードを成形した時の斜視
図である。
１・・・アイランド、２・・・半導体素子、３・・・外
部リード、４・・・封止樹脂、５・・・樹脂枠、６・・
・ボンディングワイヤー、１０・・・外枠。FIGS. 1(a) and (b) are a top view and a side view of an embodiment of the present invention, and FIGS. 2(a) and (b) are a top view and A-A of a conventional resin-sealed semiconductor device. 3 is a perspective view of a conventional resin-sealed semiconductor device when external leads are molded. DESCRIPTION OF SYMBOLS 1... Island, 2... Semiconductor element, 3... External lead, 4... Sealing resin, 5... Resin frame, 6...
・Bonding wire, 10... Outer frame.
Claims (1)
れた半導体素子と該半導体素子に接続する外部リードの
一部とを樹脂封止してなる樹脂封止型半導体装置におい
て、前記外部リードの周囲には保護用の樹脂枠が設けら
れていることを特徴とする樹脂封止型半導体装置。In a resin-sealed semiconductor device in which an island of a lead frame, a semiconductor element fixed to the island, and a part of an external lead connected to the semiconductor element are sealed with resin, a protective layer is provided around the external lead. 1. A resin-sealed semiconductor device comprising a resin frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28650587A JPH01128558A (en) | 1987-11-13 | 1987-11-13 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28650587A JPH01128558A (en) | 1987-11-13 | 1987-11-13 | Resin-sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01128558A true JPH01128558A (en) | 1989-05-22 |
Family
ID=17705278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28650587A Pending JPH01128558A (en) | 1987-11-13 | 1987-11-13 | Resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01128558A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2255953A (en) * | 1990-08-28 | 1992-11-25 | Lsi Logic Europ | Packaging of electronic devices |
| US5677571A (en) * | 1991-11-12 | 1997-10-14 | Kabushiki Kaisha Toshiba | Semiconductor package having reinforced lead pins |
-
1987
- 1987-11-13 JP JP28650587A patent/JPH01128558A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2255953A (en) * | 1990-08-28 | 1992-11-25 | Lsi Logic Europ | Packaging of electronic devices |
| US5338899A (en) * | 1990-08-28 | 1994-08-16 | Lsi Logic Corporation | Packaging of electronic devices |
| US5677571A (en) * | 1991-11-12 | 1997-10-14 | Kabushiki Kaisha Toshiba | Semiconductor package having reinforced lead pins |
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