JPH0297051A - Lead frame - Google Patents

Abstract

PURPOSE:To absorb the contraction of tapes due to a thermal hysteresis in the assembly process of a semiconductor device, to make it possible to eliminate the generation of the warpage of the whole lead frame and moreover, to make it possible to enhance the use efficiency of a tape material by a method wherein the tapes for positional deviation prevention use are respectively constituted of a plurality of insulating tapes. CONSTITUTION:A lead frame comprises an island 1 connected to a frame 6 by suspension leads 2, leads 3 coupled with one another by a tie bar 5 formed on the periphery of the island 1 and a plurality of insulating tapes 4A for positional deviation prevention use fixed on the leads 3. For example, a plurality of the above tapes 4A are pasted in such a way that the boundaries between the tapes intersect the leads 3 on the leads 3. In that case, the positions of the leads 3, which intersect the tapes 4A, may be any parts. For example, the positions are provided at corner parts which are resin-sealed and packaged. Thereby, as the construction of the tapes due to a heat history in the assembly process of a semiconductor device can be absorbed, the warpage of the lead frame can be inhibited from being generated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame used in the manufacture of semiconductor devices, and more particularly to a lead frame having an insulating tape for preventing misalignment.

[Conventional technology]

Conventionally, as shown in FIG. 3, a lead frame for this type of semiconductor device consists of an island 1 on which a semiconductor element is mounted, a suspension lead 2 supporting the island 1, a lead frame 3 connected by a tie bar 5, and a lead frame 3 connected to the island 1 by a tie bar 5. It mainly consisted of an insulating tape 14 made of polyimide or the like attached to the tip of the lead 3 to prevent displacement.

[Problem to be solved by the invention]

In the conventional lead frame described above, since the insulating tape 14 is integrally molded in the shape of a rectangular ring, it cannot absorb shrinkage of the tape due to thermal history during the assembly process of semiconductor devices, and the entire frame warps. This caused problems in the assembly of semiconductor devices.

Further, when forming the insulating tape, as shown in FIG. 4, the tape material 14A on the inside of the rectangular insulating tape is discarded, resulting in poor usage efficiency of the tape material and high cost.

[Means to solve the problem]

The lead frame of the present invention includes an island connected to the frame by a hanging lead, a lead formed around the island and connected by a tie bar, and a plurality of insulating tapes fixed on the lead to prevent displacement. It consists of:

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view of a first embodiment of the invention.

In the first stage, the lead frame includes an island 1 connected to a frame 6 by a hanging lead 2, a lead 3 connected by a tie bar 5, and a plurality of leads fixed to the tip of the lead 3 to prevent misalignment. It is mainly composed of the insulating tape 4A. This insulating tape 4A is pasted so that the boundaries between the tapes intersect on the leads 3. The position of the lead 3 where the insulating tape 4A intersects may be at any position, and in the first embodiment, it is provided at a part of the corner that is sealed with resin and becomes a package.

In the first embodiment configured as described above, since the insulating tape is composed of a plurality of tapes, it is possible to absorb shrinkage of the tape due to thermal history during the assembly process of the semiconductor device, so that the lead frame does not warp. This can be prevented from occurring.

FIG. 2 is a plan view of a second embodiment of the invention.

In this second embodiment, the position where the insulating tapes 4B intersect is on the suspension lead 2 or on the central glue 3.

In the second embodiment as well, it is possible to suppress the occurrence of warpage in the lead frame. Furthermore, by bonding the tapes so that no steps are formed, there is an advantage that when shrinkage of the tape due to heat is absorbed, distortion is less likely to occur.

In addition, although the case where four insulating tapes were used was explained in the said Example, four or more may be sufficient. Further, the intersecting positions of the insulating tapes may be at any position on the lead as long as they are equally spaced.

〔Effect of the invention〕

As explained above, in the present invention, by configuring the tape for preventing positional deviation from a plurality of insulating tapes, shrinkage of the tape due to thermal history during the assembly process of semiconductor devices can be absorbed, so that the lead frame It is possible to eliminate the occurrence of warpage as a whole. Furthermore, there is also the effect that the efficiency in using the tape material can be increased.

[Brief explanation of the drawing]

1 and 2 are plan views of the first and second embodiments of the present invention, FIG. 3 is a plan view of a conventional lead frame, and FIG. 4 is a layout of insulating tape used in the conventional lead frame. FIG. DESCRIPTION OF SYMBOLS 1... Island, 2... Hanging lead, 3... Lead, 4A, 4B... Insulating tape, 5... Tie bar 6... Frame, 14... Insulating tape, 14A.
...Tape material. Agent Patent Attorney Susumu Uchihara

Claims (1)

[Claims] It is characterized by comprising an island connected to the frame by a suspension lead, a lead formed around the island and connected by a tie bar, and a plurality of insulating tapes fixed on the lead to prevent positional displacement. lead frame.