JPS61168250A - Plastic chip carrier - Google Patents

Abstract

PURPOSE:To reduce the improper ratio of products by forming a recess on the bottom of an injection molded resin portion, thereby eliminating high machining accuracy. CONSTITUTION:A recess 15 is formed on the bottom of an injection molded resin portion 14. External leads 18 are formed by winding the bottom outer edge projection 17 until the leads 18 arrive at the ends at the recess 15 along the side of the portion 14. The product is inverted upside down to direct the bottom of the portion 14 upward, liquid resin 16 is flowed to the recess 15, and the resin 16 is then solidified. Thus, high machining accuracy is not necessary to reduce the improper ratio of the products.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a plastic chip carrier, and in particular to a plastic chip carrier in which the external leads of a resin-sealed semiconductor element are molded inward toward the bottom surface along the resin body. It's about career.

[Conventional technology]

FIG. 2 is a partial cross-sectional side view showing an example of a conventional GELASTEC step carrier, which includes a resin body 20 and an external lead 18 drawn out from the side surface of the resin body 20. The external lead 18 is wound along the resin bottom protrusion 21 and is shaped so that its tip is located in the resin bottom depression 22. The resin bottom protrusion 21. The resin bottom recesses 22 and the separation parts 23 are provided in the same number as the external leads 18 in order to prevent contact and deformation between the external leads. Note that this conventional glass chip carrier has 1
They are manufactured from 8 pins to 68 pins.

[Problem that the invention seeks to solve]

The conventional plastic tip carrier described above has the same number of resin bottom protrusions 21 as the number of bottles. Since the resin bottom recess 22 and the separation part 23 were provided, the number of them increases as the number of bottles increases. Therefore, there is a problem in that the encapsulation mold for the GELASTEC step carrier has a complicated shape and requires high processing accuracy. The standard pitch between external leads is conventionally 1.27 mm, and it is possible to manufacture the above-mentioned encapsulation mold with conventional processing accuracy up to 68 mm. However, since the pitch between the external leads is less than 1.2 mm for products with a capacity of 100 bottles or more, very high processing precision is required for the encapsulating mold for the plastic balance carrier.

Furthermore, since the conventional plastic chip carrier described above has a complicated shape, the resin bottom protrusion 21 and separation part 23 sometimes remain attached to the encapsulating mold during resin encapsulation, resulting in defective products that do not have the resin bottom protrusion 21 etc. It may happen. In such a case, it is very difficult to remove the adhered resin remaining in the small recesses of the encapsulation mold, which may cause damage to the encapsulation mold. Therefore, it is almost impossible to carry out detailed processing on the encapsulation mold in order to further reduce the pitch between the external leads, and it has been difficult to cope with the future increase in the number of pins of plastic tip carriers.

Furthermore, the encapsulation mold for a plastic chip carrier having, for example, 68 external lead terminals is a special mold with 68 grooves carved into the bottom of the mold, so this encapsulation mold can be used to encapsulate a plastic chip carrier having, for example, 80 bins. cannot be enclosed.

In other words, the conventional technology has the disadvantage that a dedicated encapsulation mold is required depending on the number of pins of the plastic chip carrier.

[Means for solving problems]

The plastic tip carrier of the present invention is resin-encapsulated n
In a plastic tip carrier in which the external leads of semiconductor devices are molded inward toward the bottom surface along the resin body, the bottom surface is injection molded to form a basin-shaped recess.
1. a first resin drawn from a side surface of the first resin;
an external lead formed by IJ + molding by wrapping the bottom protrusion in 1 that reaches the recess along the side surface of the line; and a second resin that solidifies after being poured into the recess to fix the tip of the external lead. It consists of le.

〔Example〕

Next, the present invention will be explained with reference to FIG.

FIG. 1 is a partially sectional side view showing an embodiment of the plastic chip carrier of the present invention.

In FIG. 1, a semiconductor element 11 is mounted on a lead frame 12.
After mounting and potting with thin metal wires 13, the lead frame 12 is arranged in an encapsulation mold, and injection molded to form a resin part 144'' with a first resin. So that the recess 15 is processed,
The bottom of the encapsulation mold has a simple shape. In other words, the resin bottom protrusion 21 in the conventional example. Resin bottom dent 2
2 and the separating portion 23 (both shown in FIG. 2) do not have complicated irregularities.

After the injection molding, the external lead 18 is molded by wrapping the bottom outer edge protrusion 17 along the side surface of the resin part 14 until its tip reaches the recess 15. Thereafter, the product is turned over so that the bottom surface of the resin part 14 faces upward, and after pouring liquid resin (second resin) 16 into the recess 15 using a potting device, it is solidified. As the liquid resin 16, a thermosetting resin or an ultraviolet curable resin (hereinafter referred to as UV curable resin) is selected, but a UV curable resin is preferred since it has the advantage of quick curing.

According to this embodiment, the plastic tip carrier is made of an encapsulation mold for a 68-bin package with a lead-to-lead pitch of 1.27 mm, and by setting the lead-to-lead pitch to 1.0 mm, an 80-pin package is manufactured using the same encapsulation mold.

Packages with any number of terminals, such as lOO pins, can be manufactured.

〔Effect of the invention〕

As explained above, by forming a basin-shaped recess on the bottom of an injection-molded resin part, the shape of the encapsulating mold is simple, so high processing precision is not required, and the encapsulating The resin has good releasability from the mold and there is no resin left on the mold after molding, so the defective rate of the product is significantly reduced, and even for packages where the pitch between external leads is less than 1, Q mm. A multi-bin package can be obtained without causing deformation of the external leads, and the same encapsulation mold can be used in common for bags-VVCs having various numbers of terminals.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional side view showing an embodiment of a glass chip carrier of the present invention, and FIG. 2 is a partially sectional side view showing an example of a conventional glass chip carrier. 11...Semiconductor element, 12...Lead frame, 13...Thin metal wire, 14...
・Resin part, 15... Concavity, 16... Liquid resin, 17... Bottom outer edge protrusion, 18...
...External lead, 20...Resin body, 21.
... Resin bottom protrusion, 22 ... Resin bottom recess, 23 ... Separation part. '、Mu1、Kaya1zu Tsuvine Z play? / 23

Claims (1)

[Claims] In a plastic chip carrier in which external leads of a resin-encapsulated semiconductor element are lead-molded inward toward the bottom surface along the resin body, a first resin is injection-molded so that the bottom surface forms a basin-shaped recess; An external lead is formed into a lead by being pulled out from a side surface of the first resin, and a bottom protrusion is poured along the side surface until it reaches the recess, and the tip of the external lead is fixed by solidifying after being poured into the recess. A plastic chip carrier comprising a second resin.