JPH10107199A - Semiconductor package device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductor package device in which a stress is relaxed when a sealing resin part is molded, and in which a semiconductor chip as a whole can be coated with a junction coating material, by a method wherein the semiconductor chip is housed inside a housing recessed part, at a semiconductor mounting part, which is formed to be a nearly shallow dish shape. SOLUTION: A semiconductor mounting part 16 is constituted of a rectangular main face part 16a on which a semiconductor chip 2 is mounted and of outer circumferential wall parts 16a which are formed so as to be erected integrally from the outer circumference of the main face part 16a, and it is connected integrally to tip parts of a tab suspension part 15a and a tab suspension part 15b at upper edge parts of both outer circumferential wall parts 16b. Alternatively, when the respective outer circumferential wall parts 16b are formed as tilted walls which are tilted gradually to the inside toward lower parts, the semiconductor mounting part 16 is constituted to be a nearly shallow dish shape in which the opening part of a housing space part 17 displays an inverted trapezoid so as to be a little larger than the outer size of the main face part 16a, and the semiconductor chip is housed in its inside. As a result, a stress is relaxed when a sealing resin part is molded, and the semiconductor chip 2 as a whole can be coated surely with a junction coating material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for mounting a semiconductor chip on a chip mounting portion connected to a lead frame on which a number of lead terminal pieces are formed via tab suspension pieces, and a method for mounting the semiconductor chip on the lead frame. The present invention relates to a semiconductor package device in which a base end of a lead terminal piece and a sealing resin are molded and sealed.

[0002]

2. Description of the Related Art A semiconductor device is generally packaged for the purpose of transportation, handling, protection of a semiconductor chip, mountability on a printed circuit board or the like.

As this package, there is provided a resin-sealed package type formed by molding a sealing resin after mounting a semiconductor chip on a metal frame. This resin-encapsulated semiconductor package device has features such as being suitable for mass production and being inexpensive. That is, in this semiconductor package device, a long metal ribbon is continuously supplied as a raw material to a precision press machine, and a punching process is performed thereon to form a large number of lead frames which are semiconductor forming regions continuously. After a semiconductor chip is mounted on each of the predetermined regions of the lead frame, molding of a sealing resin is performed, followed by separation and formation.

The semiconductor package device 1 is shown in FIGS.
As shown in FIG. 1, a large number of lead terminals 4 are formed so as to protrude from the outer peripheral side surface of a rectangular sealing resin portion 3 in which a semiconductor chip 2 is sealed. The semiconductor chip 2 is mounted on the surface of a semiconductor mounting portion 5 formed on a lead frame together with each lead terminal 4, and further, lead bonding with each lead terminal 4 and a lead wire 6 is performed.
The sealing resin portion 3 is made of a thermoplastic synthetic resin such as an epoxy resin, a silicone resin or a phenol resin.
Are sealed at once.

The conventional lead frame constituting the above-described semiconductor package device 1 has a pair of tab hanging pieces 51a in a central region where a plurality of strip-shaped pieces (not shown) constituting the lead terminals 4 are arranged on both sides. The semiconductor mounting section 50 is integrally connected via a 51b. As shown in FIGS. 5 to 7, the semiconductor mounting portion 50 has a rectangular flat plate shape, and has a tab hanging piece 51 when a lead frame is formed.
The connecting portions 52a and 52b connected to a and 51b are bent in a crank shape. On the lead frame, the semiconductor chip 2 is mounted on the main surface 53 of the semiconductor mounting portion 50 thus formed. In the lead frame, the molding of the sealing resin portion 3 is performed in a state where the semiconductor chip 2 is mounted on the semiconductor mounting portion 50, and the lead frame is conveyed to the next step to form the lead terminal 4 by a press device. The semiconductor package device 1 is configured by cutting and bending the tip of the piece.

[0006]

In the above-described conventional lead frame, the sealing resin portion 3 for sealing the semiconductor chip 2 is made of a thermoplastic synthetic resin such as an epoxy resin. When the plastic synthetic resin is cured, thermal stress is applied to the semiconductor chip 2 mounted on the main surface 53 of the semiconductor mounting part 50. In addition, it is necessary to perform some measure on the lead frame so that the semiconductor chip 2 mounted on the main surface 53 of the semiconductor mounting portion 50 does not move during the molding of the sealing resin portion 3.

Therefore, as shown in FIG. 6, the junction coat material 7 is applied to the lead frame so as to cover the surface of the semiconductor chip 2 mounted on the main surface 53 of the semiconductor mounting portion 50. The semiconductor chip 2 is mounted on the semiconductor mounting portion 50 by the junction coat material 7.
Of the sealing resin portion 3 at the time of molding.

In the lead frame, since the semiconductor mounting portion 50 on which the semiconductor chip 2 is mounted is formed in a rectangular plate shape as described above, when the junction coat material 7 to be applied has a low viscosity, This causes a problem of flowing down from the semiconductor mounting unit 50. The lead frame has a problem that the desired action of the junction coat material 7 cannot be exhibited because the semiconductor chip 2 cannot be sufficiently coated because the junction coat material 7 flows down in this way.

On the other hand, in the case of a lead frame, for example, when a junction coat material 7 having a slightly increased viscosity is used in order to solve such a problem, it does not easily flow, so that the entire outer peripheral portion of the semiconductor chip 2 is sufficiently extended. This causes a problem that the coating cannot be performed. In addition, the lead frame is mounted on the main surface 5 of the semiconductor mounting section 50 in advance.
In the case where the junction coat material 7 is coated on the semiconductor mounting portion 5,
This causes a problem such as leakage from zero. Therefore, in the conventional lead frame, it is necessary to set and manage the viscosity of the junction coat material 7 to be used, and to apply this junction coat material 7 to the semiconductor chip 2 mounted on the semiconductor mounting portion 50. This required a cumbersome process.

[0010] Accordingly, the present invention provides a semiconductor device in which the outer periphery of a semiconductor chip is reliably coated with a junction coat material so as to reduce stress when molding a sealing resin. Aim.

[0011]

A semiconductor package device according to the present invention which has achieved the above object has a semiconductor device of a lead frame having a large number of lead terminal pieces and a semiconductor mounting portion continuously provided via tab suspension pieces. A semiconductor chip is mounted on the mounting portion, a junction coat material is applied to the semiconductor chip, and the semiconductor chip is sealed with a sealing resin portion including the base end of the lead terminal piece and the semiconductor mounting portion. The semiconductor mounting portion is formed in a substantially shallow dish shape in which an outer peripheral wall continuous with the tab suspending piece is integrally formed on a main surface portion on which the semiconductor chip is mounted, and houses the semiconductor chip therein. A storage recess is formed.

According to the semiconductor package device of the present invention configured as described above, the semiconductor chip is housed in the housing recess of the semiconductor mounting portion formed in a substantially shallow dish shape. Junction coat material applied to the semiconductor chip to reduce stress when molding the resin portion is prevented from flowing down from the semiconductor mounting portion, and the entire semiconductor chip is reliably coated. Therefore, in the semiconductor package device, the function of the junction coat material is reliably achieved. In addition, the semiconductor package device eliminates the need to control the viscosity of the junction coat material, simplifies the application process, improves the mounting accuracy of the semiconductor chip, and forms the semiconductor chip with high accuracy.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. The semiconductor package device 1 uses a lead frame 10 having a basic configuration similar to that of the conventional lead frame 10 described above. That is, the lead frame 10 is formed as shown in FIG. 1 by using a long metal ribbon as a raw material and performing a punching process by a precision press machine. The semiconductor package device 1 mounts the semiconductor chip 2 on a later-described semiconductor mounting portion 16 of the lead frame 10, molds the sealing resin portion 3 with a synthetic resin material, and further forms strip-shaped leads forming the lead terminals 4. It is formed by cutting the tip end side of the terminal forming piece 14 and bending it.

In the lead frame 10, the semiconductor formation region H shown in FIG. 1 is continuously formed inside a pair of lead portions 11a and 11b parallel to each other along both side edges. Each of the leads 11a and 11b is provided with a perforation 12 for conveyance at a predetermined interval. The semiconductor formation region H includes bridge pieces 13a and 13b parallel to each other that connect the lead portions 11a and 11b at a predetermined interval in an orthogonal state, and the bridge pieces 13a and 13b.
13b has a plurality of lead terminal forming pieces 14 which are integrally bent and protruded from the opposing side edges in the same plane. Further, the lead frame 10 has tab hanging pieces 15a, 15b integrally protruding from the lead portions 11a, 11b located at the center of the bridge pieces 13a, 13b so as to face each other, and these tab hanging pieces 15a, The semiconductor mounting section 16 is integrally provided at the base end of the semiconductor mounting section 15b.

As shown in FIG. 1, each of the lead terminal forming pieces 14 has a bridge portion 13 a having a tip portion extending appropriately close to the outer peripheral portion of the semiconductor mounting portion 16.
13b so as to protrude integrally therewith. Each of the lead terminal forming pieces 14 has a tip portion of the semiconductor mounting portion 1 as described later.
6 constitutes a connection portion which is wire-bonded to the semiconductor chip 2 mounted on the semiconductor chip 2 and the lead wires 6. Each of the lead terminal forming pieces 14 is a bridge piece 1 as described later.
The lead terminals 4 are formed by cutting the respective tips protruding from 3a and 13b.

In the lead frame 10, a sealing resin part 3 is molded in an inner peripheral area including a semiconductor mounting part 16 and a base end of each lead terminal forming piece 14 indicated by a dashed line L in FIG. In the lead frame 10, the outer peripheral region including the base end of each lead terminal forming piece 14 on the bridge piece 13 side indicated by the two-dot chain line M in FIG. By performing the bending process, the semiconductor package device 1 that is protruded in an L-shaped state along the outer peripheral portion of the sealing resin portion 3 as shown in FIG. 8 is completed.

The semiconductor package device 1 has a significant feature in the configuration of the semiconductor mounting section 16. That is, as shown in FIGS. 2 to 4, the semiconductor mounting portion 16 includes a rectangular main surface portion 16a on which the semiconductor chip 2 is mounted, and an outer peripheral wall portion 16b integrally formed from the outer periphery of the main surface portion 16a. And a storage space portion 17 for storing the semiconductor chip 2 therein. The semiconductor mounting portion 16 is provided with tab suspension portions 15 at upper edges of both outer peripheral wall portions 16b in the longitudinal direction.
a and 15b are integrally connected with the tip portions.

The semiconductor mounting portion 16 is configured such that each outer peripheral wall portion 16b is formed as an inclined wall which is gradually inclined inward downward, so that the storage space portion 17 defines an opening portion thereof as an outer dimension of the main surface portion 16a. It is configured in a substantially shallow dish shape with a slightly larger inverted trapezoidal shape. Also, the semiconductor mounting unit 1
6, the outer dimensions of the main surface 16a constituting the storage space 17 are slightly larger than the outer dimensions of the mounting surface of the semiconductor chip 2, and the height of the outer peripheral wall 16b is the thickness of the semiconductor chip 2. It is slightly smaller than that. Therefore,
As described later, the semiconductor mounting portion 16 has an upper portion of the semiconductor chip 2 mounted in the storage space portion 17 protruding and exposed from the outer peripheral wall portion 16b.

The semiconductor mounting section 16 configured as described above
Is formed by punching and forming the lead frame 10 from a metal ribbon by a precision press machine, and then stamping the corresponding area. Needless to say, the semiconductor mounting portion 16 is used in the step of punching the lead frame 10.
The stamping rod incorporated in the press die may be pressed against the lower die to form the corresponding area by drawing, so that the stamping rod may be formed at the same time as the outer shape is removed.

The lead frame 10 is transported to an automatic mounting machine, and the semiconductor chip 2 is supplied and loaded from above into the main surface 16a of the semiconductor mounting section 16 as shown in FIG. The lead frame 10 is mounted on the semiconductor mounting section 16.
Is formed in a substantially shallow dish shape, the semiconductor chip 2 supplied onto the main surface portion 16a is locked by the outer peripheral wall portion 16b, so that the semiconductor chip 2 is prevented from dropping and being displaced during transportation to the next step. The lead frame 10 has a main surface portion 16a of the semiconductor mounting portion 16 for securely holding the semiconductor chip 2.
An adhesive is applied on the top in advance. In this case, the adhesive does not flow down from the main surface portion 16a due to the configuration of the semiconductor mounting portion 16 formed in a substantially shallow dish shape.

With the semiconductor chip 2 loaded on the semiconductor mounting portion 16 in this manner, the lead frame 10 is transported to an automatic wiring machine, and the pads of the semiconductor chip 2 and the lead terminal forming pieces 14 When the lead wires 6 are laid between the wire and the tip portion, mutual electrical connection is performed. Further, the lead frame 10 is conveyed to the junction coat material supply unit, so that the surface of the semiconductor chip 2 mounted on the semiconductor mounting unit 16 has a junction coat material 7 of appropriate viscosity made of SiO or the like. Is applied. Junction coat material 7
, A part thereof flows out from the surface of the semiconductor chip 2 to the side peripheral surface.

Since the semiconductor mounting portion 16 of the lead frame 10 is formed in a substantially shallow dish shape as described above, the junction coat material 7 flowing out from the side peripheral surface of the semiconductor chip 2 is received by the outer peripheral wall portion 16b. As a result, run-down from the main surface 16a is prevented. Therefore, as shown in FIG. 3, the entire outer peripheral portion of the semiconductor chip 2 is reliably coated with the junction coat material 7.

The lead frame 10 is conveyed to a molding machine where the molding of the sealing resin portion 3 for sealing the semiconductor chip 2 is performed. When the mold forming machine is loaded in a state where the lead frame 10 is positioned in the molding die in an open state, the molding die is clamped. Into the molding die, a cavity is filled with a thermoplastic synthetic resin material such as the above-mentioned epoxy resin in a molten state by injection from a pot. As a result, the sealing resin portion 3 is outsert-molded in the lead frame 10 in a predetermined region indicated by a dashed line L in FIG.

The lead frame 10 includes a semiconductor mounting portion 16
The outer peripheral portion of the semiconductor chip 2 mounted on the substrate is coated with a junction coat material 7. The thermoplastic synthetic resin material acts on the semiconductor chip 2 to seal thermal stress generated when the sealing resin portion 3 is formed by curing. However, since the entire semiconductor chip 2 is coated with the junction coat material 7, the thermal stress is surely alleviated, the occurrence of inconvenience such as damage to internal circuits is prevented, and the semiconductor chip 2 is mounted on the semiconductor mounting portion 16. Is improved in mounting accuracy.

The lead frame 10 is transported to a press machine, and the semiconductor package device 1 formed from each region is
To disconnect. In the lead frame 10, as shown by the two-dot chain line M in FIG. 1 described above, each lead terminal forming piece 14 is cut in the vicinity of the protruding portion of each of the bridge pieces 13a and 13b, and the side surface of the sealing resin portion 3 is formed. To form the lead terminal 4.

The semiconductor package device 1 formed as described above is mounted on the semiconductor mounting portion 16 of the lead frame 10.
Since the entire semiconductor chip 2 mounted on the substrate is reliably coated with the junction coat material 7, the mounting accuracy is improved. Therefore, in the semiconductor package device 1, the pads of the semiconductor chip 2 and the respective lead terminals 4 are reliably connected by the lead wires 6, so that the semiconductor package device 1 is formed with high precision and the yield rate is improved.
Further, in the semiconductor package device 1, the thermal stress acting on the semiconductor chip 2 generated during the molding of the sealing resin portion 3 and being applied to the semiconductor chip 2 is reduced by the junction coat material 7, thereby preventing the semiconductor chip 2 from being damaged. .
Furthermore, the semiconductor package device 1 eliminates the need for precision when applying the junction coat material 7 to the semiconductor chip 2 and eliminates the need for high-precision management of the junction coat material 7. Streamlining is achieved.

In the semiconductor package device 1 described above, the semiconductor mounting portion 16 is formed in a substantially rectangular shallow dish shape, but the shape is appropriately formed corresponding to the shape of the semiconductor chip 2 to be mounted. Further, in the semiconductor package device 1, for example, a conductive adhesive may be used to mount and fix the semiconductor chip 2 on the main surface 16a of the semiconductor mounting portion 16.

[0028]

As described above in detail, according to the semiconductor package device of the present invention, the stress generated during the molding of the sealing resin portion can be reduced without changing the basic structure of the lead frame. Since the junction coat material is applied over the entire semiconductor chip, the function and effect can be reliably achieved, and the semiconductor chip can be manufactured with high accuracy and high yield. In addition, the semiconductor package device can simplify the application of the junction coat material, and eliminates the need for high-precision viscosity management, thereby streamlining the application process of the junction coat material and achieving cost reduction. Is done.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part of a lead frame used in a semiconductor package device according to the present invention.

FIG. 2 is a plan view of an essential part for explaining a configuration of a semiconductor mounting part of the lead frame.

FIG. 3 is a longitudinal sectional view of a main part of the semiconductor mounting unit.

FIG. 4 is an exploded perspective view of a main part of the semiconductor mounting unit.

FIG. 5 is a plan view of an essential part for explaining a configuration of a semiconductor mounting part of a conventional lead frame.

FIG. 6 is a vertical sectional view of a main part of the semiconductor mounting part.

FIG. 7 is a perspective view of a main part of the semiconductor mounting unit.

FIG. 8 is a perspective view of a semiconductor package device.

FIG. 9 is a longitudinal sectional view of the semiconductor package device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor package device 2 Semiconductor chip 3 Sealing resin part 4 Lead terminal 5 Semiconductor mounting part 6 Lead wire 10 Lead frame 11a, 11b Lead part 13a, 13b Bridge piece 14 Lead terminal formation piece 15a, 15b Tab suspension piece 16 Semiconductor mounting part 16a Main surface portion 16b Outer peripheral wall portion 17 Housing recess H Semiconductor formation region

Claims (1)

[Claims] 1. A semiconductor chip is mounted on a chip mounting portion of a lead frame having a plurality of lead terminal pieces and a chip mounting portion connected to a tab suspending piece,
After applying a junction coat material to the semiconductor chip, a sealing resin portion for sealing a region including the base end portion of the lead terminal piece and the chip mounting portion is molded, and the chip mounting portion is formed of a semiconductor. An outer peripheral wall continuous with the tab suspending piece is formed on a main surface portion on which the chip is mounted so as to have a substantially shallow dish shape in which the outer peripheral wall is integrally formed and formed therein, and a housing recess for housing the semiconductor chip is formed therein. A semiconductor package device.