JPH01282843A - Semiconductor device - Google Patents

Abstract

PURPOSE:To remove the effect of dimensional dispersion due to the remaining of a gate resin, and to ensure the accuracy of package size by arranging a resin filler hole to a resin notch section in which a stepped section in 1-5mm is formed to the side face of a package. CONSTITUTION:Metallic leads 2 on which a semiconductor pellet 6 is loaded are sealed with a resin 1, and a gate 3 is disposed to a resin notch section 4 in which a stepped section in 1-5mm is shaped from the resin surface of the side face of a package. Accordingly, the effect of dimensional dispersion due to the remaining of a gate resin is eliminated, and the accuracy of package size is ensured.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the outer shape of a package of a semiconductor device, and particularly to the shape of a resin injection port (gate).

[Conventional technology]

Conventionally, in a resin-sealed semiconductor device, a gate portion is disposed on the resin surface of the side surface of the package because thermosetting resin (epoxy resin, etc.) is injection molded.

FIG. 3 shows a longitudinal cross-sectional view of a conventional insulated semiconductor device molding die. As shown in FIG. 3, the metal lead 2 carrying the semiconductor pellet 6 is fixed in the cavity 9, and resin is injection molded into the cavity 9 through the gate 3. Fig. 4(a) is a top view of the package outer shape completed by the above molding, and Fig. 4(b) shows the arrow C shown in Fig. 4(a).
This is an external view of the package seen from the side, and the gate 3 (shaded area) is arranged on the resin surface of the package side surface 5.

[Problem to be solved by the invention]

In the conventional resin insulated semiconductor device described above, when the gate portion is cut after resin injection molding, the remaining resin 8 (FIG. 4) is
Approximately 4mm is generated and the package external dimensions (dimension 1 in the diagram)
This has the disadvantage that the variation in size increases, resulting in a decrease in dimensional accuracy. In particular, in recent years, demands regarding external dimensional accuracy have become stricter due to high-density packaging.

[Means to solve the problem]

The semiconductor device of the present invention is a molded insulated semiconductor device in which a metal lead carrying a semiconductor pellet is sealed with resin. ) are placed.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1(a) is a top view of a package according to an embodiment of the present invention. A metal lead 2 carrying a semiconductor pellet 6 is sealed with a resin 1, and a gate 3 is placed in a resin notch 4 having a height difference of 1 to 5 cylinders from the resin surface on the side of the package (arrow A side in the figure). ing.

In addition, the package outline as seen from the arrow A side (Fig. 1 (b)
)) indicates that the gate 3 (shaded area) is arranged in the resin cutout 4.

FIG. 2(a) is a top view of a package of another embodiment of the present invention. In this embodiment, two resin notches 4 are formed between the metal leads 2 on the resin side surface 5 from which the metal leads 2 are led out, and gates 3 are arranged in the resin notches 4. As with the first embodiment, the effect is that the accuracy of the package external dimensions (dimension 1 in the figure) can be ensured.

[Effects of the Invention] As explained above, the present invention eliminates the influence of dimensional variations due to remaining gate resin by arranging the gate portion in a resin notch having a step of 1 to 5 mm from the resin side surface. The accuracy of the package dimensions (one dimension in the figure) can be ensured.

[Brief explanation of the drawing]

FIG. 1(a) is a top view of a package according to an embodiment of the present invention;
Fig. 1(b) is an external view of the package seen from the arrow A side in Fig. 1(a), Fig. 2(a) is a top view of a package of another embodiment of the present invention, and Fig. 2(b) is the middle arrow B in Fig. 2 (a)
3 is a vertical cross-sectional view of a conventional insulated semiconductor device molding die; FIG. 4(a) is a top view of a conventional insulated semiconductor device package; FIG. 4(b) 4(a) is a package external view seen from the arrow C side in FIG. 4(a). 1...Resin, 2...Metal lead, 3.
...Gate, 4...Resin notch, 5.
...Resin side, 6...Pellet, 7...
...Molding mold, 8... Resin remaining, 9...
···cavity. Agent Patent Attorney Shinman Uchihara Figure 1 No. Z

Claims (1)

[Claims] 1. A molded insulated semiconductor device in which a metal lead carrying a semiconductor pellet is sealed with resin, characterized in that a resin injection port is disposed in a resin notch with a step formed on a side surface of the package.