JPH02170453A - Lead frame structure of electronic component - Google Patents
Lead frame structure of electronic componentInfo
- Publication number
- JPH02170453A JPH02170453A JP63324386A JP32438688A JPH02170453A JP H02170453 A JPH02170453 A JP H02170453A JP 63324386 A JP63324386 A JP 63324386A JP 32438688 A JP32438688 A JP 32438688A JP H02170453 A JPH02170453 A JP H02170453A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- frame
- resin
- semiconductor device
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 abstract description 8
- 238000005520 cutting process Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品のリードフレーム構造に係り・、特に
電子部品の製造峙に外部装置と接続するためのリードを
固定する電子部品のリードフレーム構造に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a lead frame structure for electronic components, and more particularly to a lead frame structure for electronic components that fixes leads for connection to external devices in the manufacturing of electronic components. .
従来の技術
従来のトランジスタ等の電子部品は第６図に示すように
複数個分のリード部１０をフレーム部１１と共に一体的
に形成して、夫々のリード部１０上に半導体装置を固着
し、リードの端部を樹脂１２で封入した侵、リード部１
０とフレーム部１１とを切断することにより形成されて
いた。2. Description of the Related Art Conventional electronic components such as transistors have a plurality of lead portions 10 integrally formed with a frame portion 11 as shown in FIG. 6, and a semiconductor device is fixed onto each lead portion 10. Lead part 1 with the end of the lead sealed with resin 12
It was formed by cutting 0 and the frame part 11.
発明が解決しようとする課題
しかるに、従来の半導体装置等の電子部品のリードフレ
ーム構造はリード部の一部と半導体装置を樹脂で封入し
た後に次工程への搬送のため段積みしようとしたとき、
そのまま段積みすると、樹脂が固着したモールドパッケ
ージ１２部分だけがリードフレームの厚さ方向より突出
してしまうため、第７図に示すようにリードフレーム本
体が傾いてしまい平坦に段積みすることができず、次工
程への搬送は手作業とするか又は自動化する場合でもリ
ードフレーム本体をスリットにより一枚毎に平坦化して
収納するスリットマガジン等に収納しなければならずリ
ードフレーム本体がマガジンにあまり入らなくなりマガ
ジン数が多くなり、また、−枚毎にマガジンに収納しな
ければならず搬送の効率が悪い等の問題点があった。Problems to be Solved by the Invention However, in the conventional lead frame structure for electronic components such as semiconductor devices, when a part of the lead part and the semiconductor device are encapsulated with resin and then stacked for transportation to the next process,
If they are stacked as is, only the part of the molded package 12 to which the resin is fixed will protrude from the thickness direction of the lead frame, and the lead frame body will be tilted as shown in Figure 7, making it impossible to stack them flatly. The lead frame body must be transported to the next process manually, or even if it is automated, the lead frame body must be flattened one by one by slits and stored in a slit magazine, etc., and the lead frame body cannot fit into the magazine. There were problems such as an increase in the number of magazines, and poor transport efficiency as each sheet had to be stored in the magazine.
本発明は上記の点に鑑みてなされたもので、平坦に段積
みできる電子１ｆｆｉのリードフレーム構造に関する。The present invention has been made in view of the above points, and relates to an electronic 1ffi lead frame structure that can be stacked flatly.
ｒ！Ｒ題を解決するための手段
本発明はフレーム部とフレーム部内に延びるリード部と
を有し、半導体装置を樹脂により封止する構成の電子部
品のリードフレーム構′ｌｔｉにおいて、前記半導体装
置を前記樹脂で封入することにより前記リード部に生じ
る前記フレームの厚さ方向への突出分に相当する凸部を
前記フレーム部に形成してなる。r! Means for Solving Problem R The present invention provides a lead frame structure for an electronic component having a frame portion and a lead portion extending into the frame portion, and having a structure in which a semiconductor device is sealed with a resin. The frame portion is formed with a convex portion corresponding to the protrusion in the thickness direction of the frame that is generated in the lead portion by enclosing the lead portion with resin.
作用
フレーム部に凸部を形成し封入樹脂とバランスさせたた
め、リード部の半導体装置を樹脂で封入することにより
生じるフレームの厚さ方向への突出分により生じる片寄
りをなくすことができ、フレーム本体を複数８１１層し
てもくずれることなく積層できる。By forming a convex part on the working frame part and balancing it with the encapsulating resin, it is possible to eliminate the deviation caused by the protrusion in the thickness direction of the frame caused by encapsulating the semiconductor device in the lead part with resin. A plurality of 811 layers can be stacked without collapsing.
実施例
第１因は本発明の一実・施例の平面図を示す。図中、１
はフレーム部、２はリード部を示す。The first example shows a plan view of one embodiment of the present invention. In the figure, 1
2 indicates a frame portion, and 2 indicates a lead portion.
フレーム部１及びリード部２は金属板をプレスすること
により一体的に形成されており、フレーム部１とリード
部２はリード部２の端部と、り一層部２が組立て中に屈
曲してしまわないようその中間部を互いに連結している
。The frame portion 1 and the lead portion 2 are integrally formed by pressing a metal plate, and the frame portion 1 and the lead portion 2 are formed by bending the end portion of the lead portion 2 and the layer portion 2 during assembly. The middle parts are connected to each other to prevent them from getting cluttered.
リード部２は第５図に示すように半導体装置が載置され
る部分であるインナリード部３と半導体装置と外部装置
との電気的接続を到るアウタリード部４とよりなる。As shown in FIG. 5, the lead section 2 consists of an inner lead section 3 on which a semiconductor device is placed, and an outer lead section 4 that provides electrical connection between the semiconductor device and an external device.
第１図に示すようにフレーム部１は６つの区画ａ−ｆを
有し、電子部品の形成部分を包囲するように形成され、
また、夫々の区画ａ−ｆには第２図に示すように６つの
電子部品８〜１３が形成される。本実施例の電子部品８
は３本のリードが必要であり、フレーム部１の一区画内
には６つの電子部品８に対応して１８本のリードが形成
される。As shown in FIG. 1, the frame part 1 has six sections a to f, and is formed so as to surround the part where the electronic component is formed.
Further, six electronic components 8 to 13 are formed in each of the sections a to f, as shown in FIG. Electronic component 8 of this example
requires three leads, and 18 leads are formed in one section of the frame portion 1 corresponding to the six electronic components 8.
また、フレーム部１には次工程への搬送用のパイロット
穴５や逆搬送防止用の角穴６も同時に形成される。Further, a pilot hole 5 for transporting to the next process and a square hole 6 for preventing reverse transport are also formed in the frame portion 1 at the same time.
一つの電子部品を構成する三本のリードのうちの中央の
リードの端部１０（第５図審照）には半導体！ＡＭが形
成されたチップが固着される。チップと他の２木のリー
ドとは極細の導電線により結線される。At the end 10 (see Figure 5) of the central lead of the three leads that make up one electronic component, there is a semiconductor! The chip on which AM is formed is fixed. The chip and the other two leads are connected by ultra-fine conductive wires.
チップが搭載され、各リード部への結線後にインブリー
ド部３を樹脂等で封入する。このとぎ第２図、第３図に
示すように同時にフレーム１の区画を分割する部分の３
ケ所にインナリード部３に付着した樹脂製のモールドパ
ッケージ７のフレーム部１の厚さ方向への突出分に相当
する分の厚さを有する凸部９をモールドパッケージ７同
様樹脂により形成する。After the chip is mounted and wires are connected to each lead part, the in-bleed part 3 is sealed with resin or the like. At the same time, as shown in Figures 2 and 3, 3 parts of the frame 1 are divided.
A convex portion 9 having a thickness corresponding to the protrusion in the thickness direction of the frame portion 1 of the resin mold package 7 attached to the inner lead portion 3 is formed from resin at the same place as the mold package 7.
この凸部１７は第１図に示すように７ウタリ一ド部４側
方の樹脂製のモールドパッケージ７とバランスするよう
な位置に設けられる。上記のような構成とすることによ
り第４図に示すようにモールドパッケージ７により封入
後複数のリードフレーム本体を積層する場合、樹脂製の
モールドパッケージ７が上下で互いに積層されると同時
に凸部９も上下でｈいに積層される。モールドパッケー
ジ７の突出分を凸部９により補うことによりリードフレ
ーム本体を平坦な状態に保持できる。したがって、積層
してもリードフレーム本体が傾斜することなくなる。As shown in FIG. 1, this convex portion 17 is provided at a position so as to be balanced with the resin molded package 7 on the side of the lead portion 4. As shown in FIG. With the above configuration, when a plurality of lead frame bodies are stacked after being sealed with the mold package 7 as shown in FIG. They are also stacked vertically. By compensating for the protrusion of the mold package 7 with the convex portion 9, the lead frame main body can be held in a flat state. Therefore, even when stacked, the lead frame body does not tilt.
つまり、リードフレーム本体の段積み化が可能となる。In other words, the lead frame bodies can be stacked in layers.
したがって、搬送用のマガジンにスリット等を設ける必
要がなくなりより多くの部品が形成されたリードフレー
ム本体をマガジンに積載できるため効率よく処理できる
。Therefore, there is no need to provide a slit or the like in the magazine for transportation, and lead frame bodies having more parts formed thereon can be loaded on the magazine, resulting in efficient processing.
なお、次工程では１枚毎にパリ取り、外装メツキ、マー
ク等が行なわれ、工程毎に自動搬送される。樹脂製の凸
部９はフレーム部１とリード部２とを切り離す切断工程
でフレーム部１と共に処理される。In the next process, deburring, exterior plating, marking, etc. are performed on each sheet, and the sheets are automatically transported after each process. The resin convex portion 9 is processed together with the frame portion 1 in a cutting process for separating the frame portion 1 and the lead portion 2.
発明の効果
上述の如く、本発明によれば、フレーム部に封入樹脂と
バランスするように凸部を設けたため、段積みしたとき
にも片寄りがなくなり、平坦に段積みでき、次工程への
搬送が容易になり、またマガジンにスリットを設ける必
要がなくなるため、組立て自動化時にマガジンに効率よ
く収納でき搬送の効率がよい等の特長を有する。Effects of the Invention As described above, according to the present invention, since the convex portion is provided on the frame portion to balance the encapsulating resin, there is no unevenness when stacked, and the stacking can be done evenly, allowing for easy stacking to proceed to the next process. It is easy to transport, and since there is no need to provide a slit in the magazine, it has the advantage of being able to be efficiently stored in the magazine during assembly automation, resulting in high transport efficiency.
第１図は本発明の一実施例の平面図、第２図は本発明の
一実施例の要部の平面図、第３図は本発明の一実施例の
要部の断面図、第４図は本発明の一実施例のリードフレ
ームを積層したときの側面図、第５図は本発明の一実施
例のリードフレームの樹脂封入前の平面図、第６図は従
来の一例の平面図、第７図は従来の一例のリードフレー
ムを積層したときの側面図である。
１・・・フレーム部、２・・・リード部、７・・・モー
ルドパッケージ、９・・・凸部。
１ｔ１４図
第５０FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a plan view of a main part of an embodiment of the invention, FIG. 3 is a sectional view of a main part of an embodiment of the invention, and FIG. The figure is a side view of a stacked lead frame according to an embodiment of the present invention, FIG. 5 is a plan view of a lead frame according to an embodiment of the present invention before resin encapsulation, and FIG. 6 is a plan view of a conventional example. , FIG. 7 is a side view of a conventional example of a stacked lead frame. DESCRIPTION OF SYMBOLS 1... Frame part, 2... Lead part, 7... Mold package, 9... Convex part. 1t14 Figure 50
Claims (1)
るリード部とを有し、該リード部の端部に半導体装置を
形成し、該半導体装置を樹脂により封入する構成の電子
部品のリードフレーム構造において、 前記半導体装置を前記樹脂で封入することにより前記リ
ード部に生じる前記フレーム部の厚さ方向への突出分に
相当する凸部を前記フレーム部に設け、前記フレーム部
及び前記リード部が水平となるよう段積みできる構成と
したことを特徴とする電子部品のリードフレーム構造。[Scope of Claims] An electronic device having a frame portion and a lead portion extending from the frame portion into the frame portion, a semiconductor device being formed at the end of the lead portion, and the semiconductor device being encapsulated with resin. In the lead frame structure of the component, a convex portion corresponding to a protrusion in the thickness direction of the frame portion generated in the lead portion by encapsulating the semiconductor device with the resin is provided in the frame portion, and the frame portion and A lead frame structure for an electronic component, characterized in that the lead parts can be stacked horizontally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63324386A JPH02170453A (en) | 1988-12-22 | 1988-12-22 | Lead frame structure of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63324386A JPH02170453A (en) | 1988-12-22 | 1988-12-22 | Lead frame structure of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02170453A true JPH02170453A (en) | 1990-07-02 |
Family
ID=18165214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63324386A Pending JPH02170453A (en) | 1988-12-22 | 1988-12-22 | Lead frame structure of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02170453A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5455199A (en) * | 1992-04-17 | 1995-10-03 | Rohm Co., Ltd. | Method of manufacturing frame for LEDs |
| SG113415A1 (en) * | 2001-04-25 | 2005-08-29 | Nec Electronics Corp | Lead frame having semiconductor device mounted thereon and method for fabricating the same |
-
1988
- 1988-12-22 JP JP63324386A patent/JPH02170453A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5455199A (en) * | 1992-04-17 | 1995-10-03 | Rohm Co., Ltd. | Method of manufacturing frame for LEDs |
| SG113415A1 (en) * | 2001-04-25 | 2005-08-29 | Nec Electronics Corp | Lead frame having semiconductor device mounted thereon and method for fabricating the same |
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