JPS598363A - Semiconductor device - Google Patents

Abstract

PURPOSE:To improve efficiency of packing for shipping and realize automatic measurement by forming the guide for alignment at the area near the three corners of a square protection frame which protects a plurality of leads extended outward from the side surfaces of sealed package. CONSTITUTION:A plurality of leads 23 and extended in four directions from the side surface of a resin sealed layer 21 and a protection frame 24 is provided, being isolated from the end of lead 23, at the outside of the lead 23. A protection frame 24 is connected to an upper mount substrate 22 through the bridges 251-254 at the areas corresponding to four corners of the resin sealed layer 21. Since the cut-away portions 271, 272, 28 which are used as the guides for alignment to the automatic measuring apparatus during the measurement of characteristics, are provided at the positions near three corners of the protection frame 24 in such a manner as destroying symmetry of the whole, the direction can be confirmed very easily.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor device, and particularly to a structure of a flat type semiconductor device at the shipping stage.

[Technical background of the invention]

Semiconductor devices generally have a form in which leads extend outward from the side of a sealed container in which the semiconductor device is completely enclosed, and devices in which the IJ leads are not bent are called flat types. heart.

In a typical flat type semiconductor device, the sealing container is a resin sealing layer, and leads are extended in four directions from the side of the resin sealing layer. ) type semiconductor device. Below is this QI
A P-type semiconductor device will be explained as an example.

FIG. 1 is a perspective view showing an example of a QIP type semiconductor device. In the figure, 1 is a sealed container.

A semiconductor element (not shown) is sealed in the sealed container 1. A plurality of leads 2 extend in four directions from the side surface of the sealed container 1, and the leads 2 are connected to the semiconductor element (not shown) inside the side container.

In the above-mentioned QIPm semiconductor device, the lead width and lead pitch are narrow, and because of this, the machining angle is 46 degrees.
The thick awn of the reed is also thinner.

However, there is a problem in that the leads of the QIP type semiconductor device have a weak mechanical arc and are easily bent, causing deformation such as iIi. Here, I would like to touch on the manufacturing process and handling of such semiconductor devices. For this topic, we prepare a multi-lead frame that has a series of units that correspond to a large number of semiconductor devices, and each unit The process of mounting the semiconductor chip on the bed located in the center of each unit, the process of wire-bonding this semi-folded chip and the lead pieces located around it, and the process of sealing the container with a resin mold for each unit. , a step of separating the sealed lead piece from the frame, and a step of applying a probe to the lead piece for each unit to measure the electrical properties of each semiconductor device. Furthermore, although such measurements are carried out by the manufacturer, there are also cases where measurements are carried out by the customer, and this trend has been increasing recently.

As ψ passes through numerous processes in this way, it becomes v'C that semiconductor devices and their components have a large number of transport processes. Therefore, if the 1-P deformation occurs, especially during characteristic measurements, until the customer handles the product as a final product, workability will be significantly hindered. Because of this problem, extreme care is required when handling QIP type cow-shaped conductor devices, and special packaging methods have traditionally been adopted to prevent deformation of the leads, especially during shipping. .

Conventionally, a jig as shown in FIG. 2 has been used, so this will be explained below.

This jig is made of an insulating plate made of Gerastec, and has an opening M in its center that can accommodate the sealed container 1 of the semiconductor device shown in FIG. 2. ..., a large number of slits 12 corresponding to two arrays.・
..., 12. In this way, by storing the semiconductor device in the jig and holding it in the attachment/detachment position, the leads 2 are positioned in the slit 12 to protect the semiconductor device tube, and the whole is attached to the characteristic measuring device. The products are then measured, shipped to the customer, and then measured again at the customer and used in applied equipment.

[Problems with background technology]

However, since it is necessary to use such a special jig, an attachment/detachment device is required to attach and detach the semiconductor device to this jig, which requires manual labor, complexity, and increases the cost of the product. is occurring. Furthermore, the lead may be deformed when attached to the jig, so there is a drawback that care must be taken when handling it.

[Purpose of the invention]

The present invention has been made in view of the above points, and includes a structure for protecting leads in a flat type resin-sealed semiconductor device, particularly effective for a QIP type semiconductor device, and improves the efficiency of shipping and packaging. Our objective is to provide a semiconductor device that enables automated measurement and measurement.

[Summary of the invention]

Positioning guides are formed near three corners of a square protection frame that protects a plurality of leads extending outward from the side surface of the sealed container.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 3 is a plan view of a QIP type semiconductor device according to an embodiment of the present invention. In the figure, 21 is a resin sealing layer. The inside of the above-mentioned Jugetsuji seal)-21 has a mount board (
A semiconductor chip (not shown) mounted on the bed) 22 (sealed).
They are extended in multiple directions in four directions (
Note that the portion of each lead 23 covered with the resin sealing layer 21 is not shown). The upper board 23 is connected inside the resin sealing layer 21 to a semiconductor element (not shown). In addition, a protective frame 24 is provided outside the 1 node 23.
) -) 1" It is provided at a distance from the tip of 23 & iM. The upper B self-protection frame 24 is made by punching out a metal plate made of the same original material as the lead 23 and breaking it down with resin. stop j-21
Bridge 25 at a position opposite to the four corners of 6. It is connected to the mount substrate 22 via .about.254. As a result, the protective frame 24 is provided at the IIjj-level with the leads 23, and is apparently fixed at the four corners of the stops 7421. Also, Kizukiji sealing jIi
Incisions 261 to 264 are provided in the protection frame 24 on one side @ 11 at the four corners of i21, so that the protection frame 24
The pre-shaped portion 25 is formed only on the other side of the resin sealing layer.
1 to 254 are connected.

Furthermore, a groove (not shown) for breaking is provided along the resin sealing layer 21 on the surface of the protective frame 24 or the iron surface □ of this connecting portion. In addition, two cutout holes 271 and 272 are formed on the outer edge of one side of the protective frame 24.
One notch hole 28 is formed on the outer edge of the opposite side. In addition.

The protective frame 24 must be used as it is without cutting off the outer frame of a lead frame that is normally used in the manufacture of resin-sealed semiconductor devices.

In the above embodiment, notch holes 271.2 are provided near the three corners of the protective frame 24 so as to impair the symmetry of the whole, and are used as guides for positioning the automatic measuring device during characteristic measurement.
72.28, the direction can be confirmed very easily. By the way, the QIP of the above example
When the W semiconductor device is actually used, the protective frame 24 must be removed. However, the protective frame 24 can be formed using a simple device at the four corners of the sealing layer 2.
254 can be cut and separated, this work can be easily performed at the user's side at the shipping destination. Further, in the above-mentioned embodiment in which the connecting portion of the protective frame 24 is provided with a groove for breaking the protective frame 24, the protective frame 24 can be broken without using a special device.

FIG. 4 is a plan view showing the semiconductor device in the embodiment of FIG. 3 at an intermediate stage up to A4. The semiconductor manufacturer first prepares a so-called multi-lead frame in which a large number of protective frames 24 are connected as individual units. At first, the leads 23 are connected to the reinforcing frame 24 and formed, and then a semiconductor device is placed on the bed in the center of each unit of the lead frame, and the electrodes of the device and the leads 2 are connected to each other. 3 are connected to bonding wires in a row, and then the above-mentioned element leads are covered with the resin stopper layer 21, each lead 23' is separated from the retaining frame 24, and each protective frame 24 is Cut out the lead frame to obtain a shape as shown in FIG. That is, although manufacturing a semiconductor device requires many steps as described above, the lead frame 24 that constitutes the lead frame always protects the leads 23. According to the present invention, the protective frame 24 is left even in the stage of measuring the characteristics of the semiconductor device, and moreover, the I-id 271, 27, . ．． 28, the asymmetry can be maintained and alignment to the measuring device can be performed without error.

Further, it is also possible to measure and ship the device in a multiple series configuration as shown in FIG.

〔Effect of the invention〕

As described in detail above, according to the present invention, there is no need to use specially manufactured old tools as in the past, and when measuring characteristics, there is a Since a free alignment guide is provided, the direction can be used for easy confirmation. Since the reinforcing frame is disposed on the outside of the valley lead, it is possible to prevent the lead from being deformed during handling by grasping and handling the reinforcing frame. Also, automatic measurements on the manufacturer's side and on the user's side are therefore possible.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional QIP type semiconductor device, FIG. 2 is a perspective view showing a conventional jig, and FIG. 3 is a plan view of a QIP W semiconductor device showing an embodiment of the present invention. FIG. 4 is a plan view showing one process of manufacturing a QIP type semiconductor device according to an embodiment of the present invention. Appearance representative Patent attorney Takehiko Suzue! 1 Figure 1 Figure 3 824

Claims (1)

[Claims] A sealed container with a semiconductor element sealed therein, and a number of leads connected to the semiconductor element inside the sealed container and extending outward in a straight line from a side surface of the sealed container. , a rectangular protective frame disposed further outward from the lead tip and partially fixed to the sealed container; 3 of the protective frame;
A semiconductor device characterized in that a positioning force field is formed near one corner of the semiconductor device.