JP2836287B2 - PGA lead base carrier - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PGA lead base carrier and can be used for bases of various sizes.
The present invention relates to a PGA lead base carrier that can be reused and can be handled by an automatic machine.

In recent years, multifunctional, high-performance, compact
With the reduction in weight and the like, demands for large-capacity, high-speed, and high-density mounting of semiconductor devices are increasing. Since a semiconductor device centering on a gate array meeting such a demand requires many input / output terminals, the package form is QFP (Quad Flat Package) or PGA.
(Pin Grid Array) packages are often used.

In such a package, a substrate before a semiconductor element chip is mounted is called a lead base, and tens to hundreds of leads can be led out. Then, in the case of QFP, leads of several hundred μm □ are configured to protrude laterally from around the substrate. Also, PGA
In this case, the leads of several hundred μmφ project from the upper or lower surface of the substrate in a lattice or staggered lattice.

In such a package having a large number of leads, the leads are thin and the pitch is narrow. Therefore, care must be taken to prevent the leads from being damaged during handling. Especially PGA
In the case of (1), since the pins protrude in the vertical direction, it is necessary to devise a dedicated carrier used for handling, that is, a so-called lead base carrier.

[0005]

2. Description of the Related Art PGA lead base carriers (hereinafter referred to as PGA)
The carrier is abbreviated not only for the semiconductor device assembly process and inspection process, but also for the shipment of finished products, as well as when the lead base manufacturer delivers the lead base to the semiconductor device manufacturer. Is also used.

FIG. 3 is a partially cutaway perspective view of an example of PGA. In the figure, 4 is a lead base, 4a is a pin, 4b is a substrate, 4c is a stage, 4d is a bonding pattern, 5 is a PGA package, 6 is a chip, 7 is a wire, 8 is a sealing material, and 9 is a cap.

In FIG. 3, an alumina ceramic is mainly used for the substrate 4b of the lead base 4, but recently, a plastic substrate has also been used.
A stage 4c on which the chip 6 is mounted is provided at the center of the substrate 4b. The stage 4c is also called a cavity because it is recessed, and is distinguished between a cavity-up type and a cavity-down type depending on whether it is provided on the upper surface or the lower surface of the substrate. The lead base 4 exemplified here is a cavity-up type package.

A bonding pattern is formed around the stage 4c, for example, by wire bonding with the chip 6 or by reflow soldering in the case of surface mounting.
4d is provided.

On the other hand, dozens to hundreds of pins 4a are set up in a lattice or staggered lattice around the substrate 4b, and project from the lower surface of the substrate 4b. The pins 4a are respectively connected to the bonding patterns 4d by multilayer wiring or the like.

[0010] By the way, when the lead base 4 thus configured is delivered from a lead base manufacturer to a semiconductor device manufacturer, for example, a special carrier (transport jig) is used to prevent deformation and damage of the pins 4a. Carried using.

Next, regarding the manufacturing process of the PGA package 5, in the assembling process, first, the chip 6 is attached to the stage 4c, and wire bonding is performed with, for example, the wire 7 with the bonding pattern 4d. Next, resin sealing is performed by the sealing material 8. The sealing material 8 may be used for potting only the chip 6 and the wire 7, or when heat release is required, for example, a metal cap 9 may be used to cover the sealing material 8. is there. Thus, the assembly of the PGA package 5 is completed.

Next, in the inspection process, the PGA package 5 is subjected to a product test. If necessary, a burn-in test is also performed. The products that pass the inspection are shipped to customers as PGA package type semiconductor devices.

[0013] The PGA package type semiconductor device is also used during assembly and inspection processes, during shipping, and the like.
The GA package 5, like the lead base 4, is carried by a dedicated carrier to prevent deformation and damage of the pins 4a.

FIG. 4 is a perspective view of an example of a conventional carrier, and FIG. 5 is a sectional view taken along line XX of FIG. In the figure, 4 is a lead base, 10 is a carrier, 11 is an outer shape guide, 12 is an outer frame,
13 is a lower surface guide.

In FIG. 4, the carrier 10 is made of a thermoplastic plastic such as polystyrene by a vacuum molding method and has a thickness of about 0.1 to 0.3 mm. The outer frame 11 is formed by cutting to a predetermined size after molding.

The carrier 10 has a plurality of outer shape guides 11 each having a slanted rectangular wall surrounded by an outer frame 12 and arranged in a grid pattern. A lower surface guide 13 projects trapezoidally at the center of the bottom surrounded on all sides by the outer shape guide 11.

When the lead base 4 is housed, if the lower part of the lead base 4 where the pins 4a do not protrude is placed on the lower surface guide 13, the outer periphery of the lead base 4 guides the outer guide 11 with an inclination with a suitable margin. It is positioned and stored.

As described above, since the outer shape guide 11 is for guiding the outer shape of the lead base 4, the carrier 10 having the outer shape guides 11 of various dimensions is prepared. It is performed to use the carrier 10 properly. In addition, since the conventional carrier 10 is a product formed by a vacuum molding method using an inexpensive plastic material, there is an advantage that the thickness is thin, light and easy to handle, and since the price is low, it is conventionally disposable without being reused. Was.

[0019]

In recent years, as the number of PGA package products of semiconductor devices has increased, it has become complicated and inefficient to use carriers each time the size of the lead base changes depending on the product type.

Disposable carriers are not suitable for cost reduction and have been reviewed from the viewpoint of resource saving.
However, since the conventional carrier is a vacuum-formed product, it is difficult to clean because it is thin, and the bottom is continuously connected, so that dust is collected and drainage is not good. Therefore, there was a problem that it could not be reused.

Further, the dimensions of the outer frame are not determined because the thickness of the conventional carrier is thin. For this reason, there is a problem in that when carrying or transferring using an automatic machine, it is difficult to perform positioning due to deformation, and it is not possible to cope with automation.

Accordingly, the present invention focuses on the fact that the pins of the PGA lead base are regularly arranged, and can be used for lead bases having various external dimensions. An object of the present invention is to provide a PGA lead base carrier that can be reused and can be handled by an automatic machine.

[0023]

The above-mentioned object is to provide a connecting member and a guide member, wherein the connecting member is supported by an outer frame and is continuous in a square lattice having upper and lower openings. The guide member is provided between two sides of the connecting member that are orthogonal to each other, and the guide member is configured to accommodate a lead base having a plurality of pins projecting in a lattice shape on a lower surface. The problem is solved by a PGA lead base carrier configured so that the pins cross over the four corners of the lead base.

[0024]

The conventional carrier is formed by vacuum molding, whereas the carrier of the present invention is formed by injection molding so that it can be reused or shared.

That is, the connecting members supported by the outer frame are arranged in a rectangular lattice opening up and down. Then, the connecting member is bridged between two sides orthogonal to each other.

By the way, pins protruding from the lower surface of the lead base are regularly arranged in a grid pattern. Therefore, when storing the lead base, the guide member is made to cross the four corners of the lead base so that the pin protruding from the lower surface of the lead base straddles the connecting member.

In this case, the lead base is a strong structure connected in a honeycomb shape, and is opened vertically so that it can be washed and reused, and the four corners of the lead base are caught by the guide member. Then, lead bases of various sizes can be used in common.

[0028]

1 is a perspective view of an embodiment of the present invention, FIG. 2 is a top view of a main part of the present invention, and FIG. 1A shows an example of use in which a large lead base is stored, and FIG. ) Is an example of use when a small PGA package is stored. In the figure,
1 is a connecting member, 2 is a guide member, 3 is an outer frame, 3a is a convex portion,
3b is a concave portion, 3c is a direction detection surface, 3d is an engagement groove, 4 is a lead base, 4a is a pin, 5 is a PGA package, and 10 is a carrier.

In FIG. 1, a connecting member 1 has a rectangular outer frame 3.
, And are connected in a rectangular lattice shape, and have upper and lower surfaces open. A guide member 2 is installed at an angle of 45 degrees on two sides of the connecting member 1 that are orthogonal to each other. The connecting member 1, the guide member 2, and the outer frame 3 are integrally formed by injection molding of a thermoplastic resin having high chemical resistance such as polyethylene or polypropylene.

Since the thickness of the guide member 2 is such that the pins 4a projecting in a lattice form from the lower surface of the lead base 4 cross over at an angle of 45 degrees, the gap size of the adjacent pins 4a is 分 の.
It is smaller than the multiplication.

That is, for example, when the pins 4a each having a thickness of 0.5 mmφ are arranged side by side in a square lattice having an adjacent pitch of 2.54 mm, the size of the gap between the adjacent pins 4a is about 2
mm. Therefore, in order for the guide member 2 to cross the gap between the adjacent pins 4a at an angle of, for example, 45 degrees, the guide member 2 only needs to have a thickness of 2/2 ^1/2 mm ≒ 1.4 mm or less. Also, the upper end surface is sharpened like a knife edge so that the plurality of pins 4a do not hit the upper surface of the guide member 2.

The PGA lead base carrier 10 according to the present invention has a size up to the size surrounded by the connecting member 1 as shown in FIG. Can be stored. Also, for example, a small PGA package 5
When storing PGA, as shown in FIG.
The PGA package 5 can be accommodated up to the dimension where the four corners of the package 5 are hooked on the guide member 2. The same applies to the case of the lead base 4.

By the way, the lead base 4 and the PGA package 5 housed in the carrier 10 are supported at four corners so that the pins 4a straddle the guide member 2, so that they can be housed in a state where they are accurately positioned. Can be. Therefore,
This carrier 10 is handled using a handling robot or the like.
It is desired that the carrier 10 be transported, and that the lead base 4 and the PGA package 5 be housed in the carrier 10.

Therefore, first, when the empty carrier 10 or the carrier 10 containing the lead base 4, the PGA package 5, etc. is stored and transported, it is efficient and convenient if it can be handled in a stacked manner.

Therefore, the upper surface of the outer frame 3 has at least two
A plurality of convex portions 3a are provided, and a concave portion 3b is provided on a lower surface opposite to each of the convex portions 3a so as to be fitted to the convex portion 3a.
In this way, a plurality of carriers 10 can be sequentially stacked.

When a plurality of carriers 10 are stacked, it is desirable to determine the direction of each carrier 10 and stack them in the same direction. For that, outer frame 3
The direction detection surface 3c is provided by cutting off the side wall at one corner. Then, if the direction detection surface 3c is detected using, for example, a sensor or an index pen, the direction of the carrier 10 can be confirmed.

Further, in order to separate the stacked carriers 10 one by one, at least one pair of opposed side walls of the outer frame 3 is provided with an engagement groove 3d. And, regardless of whether a manual operation or a handling robot is used, if this engagement groove 3d is used, it can be placed on a flat plate or picked up the carrier 10,
The stacked carriers 10 can be easily separated individually.

The carrier according to the present invention can be used for lead bases and PGA packages of various sizes within the range of dimensions of the connecting member and the guide member. Depending on the pitch or the like, various modifications are possible as to how the guide members are erected and which range is more efficient if shared. Also,
When the pins of the lead base are juxtaposed in a rectangular lattice, the commonality is greatest when the guide member is erected at a 45 ° angle to the connecting member, but various modifications are possible.

[0039]

The carrier according to the present invention can be housed in common with lead bases and PGA packages of various sizes, unlike conventional products. Moreover, it can be washed and reused.

Therefore, the present invention greatly contributes to productivity improvement such as efficiency, cost reduction and resource saving in the manufacturing process of the PGA package type semiconductor device which is expected to increase more and more in the future. is there.

[Brief description of the drawings]

FIG. 1 is a perspective view of an embodiment of the present invention.

FIGS. 2A and 2B are top views of main parts of the present invention, wherein FIG. 2A is a usage example in which a large lead base is stored, and FIG.
This is an example of use when a GA package is stored.

FIG. 3 is a partially cutaway perspective view of an example of a PGA.

FIG. 4 is a perspective view of an example of a conventional carrier.

FIG. 5 is a sectional view taken along line XX of FIG. 4;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Connecting member 2 Guide member 3 Outer frame 3a Convex part 3b
Recess 3c Direction detection surface 3d Engagement groove 4 Lead base 4a Pin 5 PGA package 10 Carrier

Claims (5)

(57) [Claims] 1. A connecting member (1) and a guide member (2). The connecting member (1) is supported by an outer frame (3) and is connected in a square lattice shape with upper and lower openings. Wherein the guide member (2) is provided between two mutually orthogonal sides of the connecting member (1).
(2) is such that when the lead base (4) having a plurality of pins (4a) protruding in a lattice shape on the lower surface is stored, the pin (4a) straddles the four corners of the lead base (4). A PGA lead base carrier, characterized by crossing over the PGA. 2. The guide member (2), wherein the thickness of the guide member (2) is smaller than a half of the gap size between the adjacent pins (4a),
2. The PGA lead base carrier according to claim 1, wherein the upper end surface is pointed like a knife edge. 3. The outer frame (3) has at least two projections (3a) on the upper surface, and the projections (3a) fit on the lower surface opposite to each of the projections (3a). The PGA lead base carrier according to claim 1, having a concave portion (3b). 4. The PGA lead base carrier according to claim 1, wherein the outer frame has a direction detecting surface on one side wall at one corner. 5. The PGA lead base carrier according to claim 1, wherein said outer frame has engagement grooves on at least a pair of opposed side walls.