JPS5921052A - Lead frame for semiconductor substrate - Google Patents

Abstract

PURPOSE:To form a lead frame for a semiconductor device whose pattern is difficult to deform and which has good workability by providing bending parts at edges of both outer frame parts. CONSTITUTION:The bending parts 7a and 7b for protecting a bent element mounting part 3 are provided. The lead frame can prevent the external force applied directly onto the element mounting part 3. Thereby, it is not necessary to use a protection plate 9 at the time of packaging. Since the patterns of lead frames do not tightly contact each other even on superposing them each other at the time of packaging, deformations such as the inclination of the element mounting part 3 by rubbing each other during transportation, the inclination of inner leads 4 toward right and left, the generation of stepwise differences by the inner leads 4 in the direction of the plate thickness are eliminated. Further, the generation of deflection due to the residual internal stress of the material of the lead frame is restrained by the increase of rigidity, and accordingly the large improvement of yield at the time of lead frame manufacture can be improved.

Description

[Detailed description of the invention] The present invention relates to lead frames for semiconductor devices.

The lead frame for the conventional resin-sealed base conductor device is made of a binary alloy (commonly known as 42% iron and nickel).
2 alloy) is manufactured by etching or press processing using a thick metal thin plate, and as shown in FIGS. 1 and 2, an element mounting part 3 for fixing a semiconductor element 2
, a large number of internal leads 4, an inner frame 5 that connects and fixes the internal leads 4 to each other, a ground lead 4' that also plays a role of supporting the element mounting section 3, and a structure that is easy to handle during semiconductor device manufacturing. It is provided with outer frames 1a and lb for packaging. A plurality of such structures are continuously formed between the outer frames 1a and lb. Using the lead frame configured in this way, first, the semiconductor element 2 is fixed on the element mounting part 3 and connected to the internal leads 4 of 1-1 using the thin metal wires 6 (only one wire is drawn in Figure 1). However, in reality, they are provided for each internal lead 4). Next, range 10 shown in dots
is sealed with resin. Here, the semiconductor element 2 is connected to the thin metal wire 6.
When connecting the metal wires 6 and the internal leads 4, the thin metal wires 6 come into contact with the peripheral corners of the semiconductor cables 2 and other internal leads [7] to prevent electrical conduction and impairing the function of the semiconductor device. As shown in FIG. 2, it is common practice to make the element mounting part 3 slightly lower than other parts.

However, for this reason, what used to be a single plane has now become a three-dimensional structure.

When transporting such lead frames between processes, the sixth
As shown in the figure, it is common to stack several dozen sheets and package them as a bundle, but at this time, a protective plate 9 for protecting the rater mounting s3 is also packaged at the same time.

Special treatment (I! Do I need one? This protection machine...
Figure 5 shows the thread □sui sea urchin: 'Kamigo plasty l'
'a@Director'')-1□-deframe, cut into 9 inch pieces, and mounted the elements.

It has a part 8 which is concave or penetrates through the part corresponding to the mounting part 3, which reduces the cost considerably and is also a factor in increasing the cost of the lead frame.

Also, one child has already been mounted since the lead frame was manufactured.

It is easy to deform the mounting part 3, and the ring shape is gold JIIA thin 6
Cutting i, transporting metal 1i+16, contact accident with the surrounding area of body 2, causing the suction of 1 trade.μ Here) This low yield apricot is pushed to Q: j4 λ Therefore, the lead frame must be handled carefully from the time of manufacture, resulting in a decrease in work efficiency.

SUMMARY OF THE INVENTION An object of the present invention is to provide a lead frame for a semiconductor device that eliminates such conventional drawbacks, prevents pattern deformation, and has good workability.

Invention d, both frame portions with bent portions provided at the ends 1,,j
, , :: ,1. '; and all the features for the cow conductor device.

1''Next, the present invention will be described in detail with reference to the drawings.The lead frame of the embodiment of the present invention is a cocoon AA.

As shown in FIG. 4, the main disadvantage is that the device is bent and the bending portions 7a and 7b are provided to protect the element mounting portion 3.

11111□111 Unexploded ij1. The primary advantage of the embodiment I over the lead-off and follow-up is that external forces directly applied to the load-bearing section 3 can be prevented. This 9fc packaging!
1. .

Tsumugi "13pa"'&IMl19 eJtll, -, L6*
””′. 6° 1 Also, from the time of lead frame manufacture to the time of completion of the conductor device, there is no need for special constant abrasion and handling, improving work efficiency.

The second advantage is that even if the lead frames are stacked on top of each other during packaging, the patterns on the lead frames are not closely spaced, so they rub against each other during transportation, causing the element mounting section 3 to tilt. This eliminates deformations such as shifting to the left or right or creating a step in the thickness direction of the internal leads 4.
, .

轡壬's excellence, the small point is that the conventional input and frame are one 9
Because it is not plural in nature: Next,, Wanderimai,
At times, the thin metal wire 6 after connecting the body element 2 and the internal lead 4 would be cut, and it would no longer function as a semiconductor fabric. This is to prevent the occurrence of 4 fukkura. Ma,
Oh, lead beam material! I+9. It also prevents the occurrence of deflection due to the stress of the ribs and retainers, and the lead flaps and frames, 11
! Significant yield at the time of production, low l cost: ffl1
Can you make one more? ,,,,,,.

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[Brief explanation of drawings]

Fig. 1 is a plan view of a lead frame for a conventional lead-in device, Fig. 2 is a cross-sectional view taken along the arrow A-^' in Fig. 1, and Fig. 3 is an implementation 1i1. Plan and side view of the semiconductor Q re-lead frame 1. 4th A is a misfired fruit, koji example 9 for semiconductor devices, a perspective view of a lead frame:, 5th. diagram, company,
The rate of the lead frame in FIG. 1 is -! The mounting part is used as a helicopter to protect the gorge. The diagram is 1. It is a sectional view of a conventional lead frame with a protection plate applied. In the plan view, 1a, 1b... outer frame, 2...
... Semiconductor element, 3 ... Element mounting part for fixing the semiconductor device, 4 ... Internal lead 4
/... Grounding which also plays the role of supporting the element mounting section -, Do, 5... Inner frame 5 which connects and fixes the internal leads to each other. ．． 6... A thin metal wire that electrically connects the semiconductor element and the internal lead,
7a, 71]...Bent part, 8...Part penetrated by a concave hole to protect the element mounting part, 9...Protection Plate, 10...Resin: A moment indicating the area sealed with resin ・, ・
−〇− Beam, 27F ril A fb

Claims (1)

[Claims] A lead frame for semiconductor devices characterized by a bent part at the end of both rows of frame parts.