JPH01118454U - - Google Patents
Info
- Publication number
- JPH01118454U JPH01118454U JP1388488U JP1388488U JPH01118454U JP H01118454 U JPH01118454 U JP H01118454U JP 1388488 U JP1388488 U JP 1388488U JP 1388488 U JP1388488 U JP 1388488U JP H01118454 U JPH01118454 U JP H01118454U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- hole
- model registration
- utility
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の面付部品のリード形状の一
実施例を示す斜視図、第２図は第１図の―線
断面図、第３図は他の実施例を示す斜視図、第４
図は従来例を示す斜視図、第５図は第４図の―
線断面図。
１…面付部品、２…リード、３…スリツト、６
…プリント基板。
FIG. 1 is a perspective view showing one embodiment of the lead shape of the surface-mounted component of this invention, FIG. 2 is a cross-sectional view taken along the line -- in FIG.
The figure is a perspective view showing a conventional example, and Figure 5 is the same as Figure 4.
Line sectional view. 1... Face-mounted parts, 2... Leads, 3... Slits, 6
…Printed board.
Claims (1)
部品１のリード２の少なくとも先端部中央部に厚
み方向に貫通する貫通穴３が形成されていること
を特徴とする面付部品のリード形状。 ２ 貫通穴３がリード２の長さ方向に延びるよう
形成されている上記実用新案登録請求の範囲第１
項記載の面付部品のリード形状。[Claims for Utility Model Registration] 1. A through hole 3 penetrating in the thickness direction is formed at least in the center of the tip of the lead 2 of the surface-mounted component 1 mounted on the board 6 by soldering. Lead shape of surface-mounted parts. 2. Claim 1 of the above-mentioned utility model registration, in which the through hole 3 is formed to extend in the length direction of the lead 2.
Lead shape of surface-mounted parts described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1388488U JPH01118454U (en) | 1988-02-04 | 1988-02-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1388488U JPH01118454U (en) | 1988-02-04 | 1988-02-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01118454U true JPH01118454U (en) | 1989-08-10 |
Family
ID=31224581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1388488U Pending JPH01118454U (en) | 1988-02-04 | 1988-02-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01118454U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019140418A (en) * | 2014-01-30 | 2019-08-22 | クリー ファイエットヴィル インコーポレイテッド | Low profile, highly configurable, current sharing paralleled wide band gap power device power module |
-
1988
- 1988-02-04 JP JP1388488U patent/JPH01118454U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019140418A (en) * | 2014-01-30 | 2019-08-22 | クリー ファイエットヴィル インコーポレイテッド | Low profile, highly configurable, current sharing paralleled wide band gap power device power module |