JPH0111729Y2 - - Google Patents
Info
- Publication number
- JPH0111729Y2 JPH0111729Y2 JP5267985U JP5267985U JPH0111729Y2 JP H0111729 Y2 JPH0111729 Y2 JP H0111729Y2 JP 5267985 U JP5267985 U JP 5267985U JP 5267985 U JP5267985 U JP 5267985U JP H0111729 Y2 JPH0111729 Y2 JP H0111729Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tank
- stripping
- plating solution
- endless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 77
- 239000007788 liquid Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- -1 nickel metals Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5267985U JPH0111729Y2 (fr) | 1985-04-09 | 1985-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5267985U JPH0111729Y2 (fr) | 1985-04-09 | 1985-04-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61168171U JPS61168171U (fr) | 1986-10-18 |
| JPH0111729Y2 true JPH0111729Y2 (fr) | 1989-04-06 |
Family
ID=30572847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5267985U Expired JPH0111729Y2 (fr) | 1985-04-09 | 1985-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0111729Y2 (fr) |
-
1985
- 1985-04-09 JP JP5267985U patent/JPH0111729Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61168171U (fr) | 1986-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4401522A (en) | Plating method and apparatus | |
| IE822387L (en) | Electroplating discrete planar workpieces. | |
| CN112663119B (zh) | 一种防止导电辊镀铜的装置及方法 | |
| KR100212875B1 (ko) | 소형 부품용 전기도금 장치 | |
| JP4445859B2 (ja) | 少なくとも表面が導電性であるワークピースを電解処理するための装置および方法 | |
| JP2749453B2 (ja) | プリント基板を処理するための装置 | |
| JPH0111729Y2 (fr) | ||
| US4326933A (en) | Electro-chemical deburring method | |
| JP2010189736A (ja) | 自動めっき装置 | |
| JP3293598B2 (ja) | めっき装置とその置換析出防止方法 | |
| CN217757735U (zh) | 一种电镀生产线 | |
| JP2516927B2 (ja) | 短冊状薄板のメツキ装置 | |
| JPH11106998A (ja) | アルミニウムの陽極酸化品と電解着色品とを一度に製造する方法およびこれに用いる電解着色装置 | |
| JPS6311693A (ja) | 帯状物のメツキ装置 | |
| JPS6222534B2 (fr) | ||
| JPH01162798A (ja) | 電気めっき用コンダクターロールの付着金属除去装置 | |
| JPS6187895A (ja) | めつき方法とその装置 | |
| JP3355813B2 (ja) | 鉄合金製リードフレームの電解研磨方法 | |
| CN215799995U (zh) | 一种零件镀镍用镀镍池 | |
| JPH04130450U (ja) | リードフレームの不要電気めつき部の自動電解剥離装置 | |
| CN217499476U (zh) | 一种链式电镀设备 | |
| JPS58125857A (ja) | リ−ドフレ−ムのめつき処理装置 | |
| JPH0224396B2 (fr) | ||
| US3468782A (en) | Machine for having glass plates electrochemically copper plated by means of soluble electrodes,in the making of mirrors | |
| JP3516933B2 (ja) | 連続電気メッキの爪送り搬送装置 |