JPH01110443U - - Google Patents
Info
- Publication number
- JPH01110443U JPH01110443U JP500888U JP500888U JPH01110443U JP H01110443 U JPH01110443 U JP H01110443U JP 500888 U JP500888 U JP 500888U JP 500888 U JP500888 U JP 500888U JP H01110443 U JPH01110443 U JP H01110443U
- Authority
- JP
- Japan
- Prior art keywords
- damper
- flange
- lsi module
- ceramic substrate
- multilayer ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Description
第１図は本考案に係るフランジを備えた冷却構
造の部分拡大図、第２図はＬＳＩモジユールとフ
ランジとの接合部の部分拡大図、第３図は半導体
装置の冷却構造を示す断面図、である。
図において、１はＬＳＩモジユール、２は多層
セラミツク基板、３はＬＳＩ、５はフランジ、６
はダンパ、７はＯリング、８は冷却容器、９はネ
ジ、１４はプレート、１５はメタライズ層、１６
は高温半田、１８はダンパ垂直部、１９はダンパ
水平部、である。
FIG. 1 is a partially enlarged view of a cooling structure equipped with a flange according to the present invention, FIG. 2 is a partially enlarged view of a joint between an LSI module and a flange, and FIG. 3 is a cross-sectional view showing a cooling structure for a semiconductor device. It is. In the figure, 1 is an LSI module, 2 is a multilayer ceramic substrate, 3 is an LSI, 5 is a flange, and 6
is a damper, 7 is an O-ring, 8 is a cooling container, 9 is a screw, 14 is a plate, 15 is a metallized layer, 16
18 is a vertical part of the damper, and 19 is a horizontal part of the damper.
Claims (1)
を搭載し、該多層セラミツク基板２の裏面に該Ｌ
ＳＩ３と回路接続する複数のリードピン４を突出
して形成されるＬＳＩモジユール１の周辺にメタ
ライズ処理を施した後、該ＬＳＩモジユール１の
メタライズ層１５と、 プレート１４とダンパ６とを溶接して形成した
フランジ５のダンパ水平部１９とを高温半田１６
を用いて熔着した後、該フランジ５をＯリング７
を介して冷却容器８の底部にネジ止めして密封容
器を作り、該密封容器中に冷媒１０を封入してな
る冷却構造において、 前記ＬＳＩモジユール１を冷却容器８に固定す
るフランジ５のダンパ６が従来のダンパに較べて
厚さの薄いダンパ垂直部１８と従来のダンパに較
べて厚さの厚いダンパ水平部１９とを熔着してな
ることを特徴とする半導体装置の冷却構造。[Claims for Utility Model Registration] A plurality of LSIs 3 on a multilayer ceramic substrate 2
is mounted on the back surface of the multilayer ceramic substrate 2.
After applying metallization to the periphery of the LSI module 1, which is formed by protruding a plurality of lead pins 4 that are connected to the SI 3, the metallized layer 15 of the LSI module 1, the plate 14, and the damper 6 are welded together. The damper horizontal part 19 of the flange 5 is soldered with high temperature solder 16.
After welding using the O-ring 7, the flange 5 is
In the cooling structure, the damper 6 of the flange 5 fixes the LSI module 1 to the cooling container 8. A cooling structure for a semiconductor device, characterized in that a damper vertical portion 18 having a thinner thickness than a conventional damper and a damper horizontal portion 19 having a thicker thickness than a conventional damper are welded together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP500888U JPH0617312Y2 (en) | 1988-01-19 | 1988-01-19 | Semiconductor device cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP500888U JPH0617312Y2 (en) | 1988-01-19 | 1988-01-19 | Semiconductor device cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01110443U true JPH01110443U (en) | 1989-07-26 |
| JPH0617312Y2 JPH0617312Y2 (en) | 1994-05-02 |
Family
ID=31208009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP500888U Expired - Lifetime JPH0617312Y2 (en) | 1988-01-19 | 1988-01-19 | Semiconductor device cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617312Y2 (en) |
-
1988
- 1988-01-19 JP JP500888U patent/JPH0617312Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0617312Y2 (en) | 1994-05-02 |
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