JPH0110928Y2 - - Google Patents

Info

Publication number
JPH0110928Y2
JPH0110928Y2 JP1982014817U JP1481782U JPH0110928Y2 JP H0110928 Y2 JPH0110928 Y2 JP H0110928Y2 JP 1982014817 U JP1982014817 U JP 1982014817U JP 1481782 U JP1481782 U JP 1481782U JP H0110928 Y2 JPH0110928 Y2 JP H0110928Y2
Authority
JP
Japan
Prior art keywords
bonding
block
bonding block
solder
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982014817U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58118739U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1481782U priority Critical patent/JPS58118739U/ja
Publication of JPS58118739U publication Critical patent/JPS58118739U/ja
Application granted granted Critical
Publication of JPH0110928Y2 publication Critical patent/JPH0110928Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1481782U 1982-02-05 1982-02-05 ボンデイングブロツク Granted JPS58118739U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1481782U JPS58118739U (ja) 1982-02-05 1982-02-05 ボンデイングブロツク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1481782U JPS58118739U (ja) 1982-02-05 1982-02-05 ボンデイングブロツク

Publications (2)

Publication Number Publication Date
JPS58118739U JPS58118739U (ja) 1983-08-13
JPH0110928Y2 true JPH0110928Y2 (enrdf_load_stackoverflow) 1989-03-29

Family

ID=30027271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1481782U Granted JPS58118739U (ja) 1982-02-05 1982-02-05 ボンデイングブロツク

Country Status (1)

Country Link
JP (1) JPS58118739U (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722168B2 (ja) * 1986-05-21 1995-03-08 株式会社日立製作所 ハイブリツドｉｃ
JPH0513011Y2 (enrdf_load_stackoverflow) * 1987-08-13 1993-04-06

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4420211Y1 (enrdf_load_stackoverflow) * 1967-02-17 1969-08-29

Also Published As

Publication number Publication date
JPS58118739U (ja) 1983-08-13

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