JPH01106570U - - Google Patents

Info

Publication number
JPH01106570U
JPH01106570U JP196788U JP196788U JPH01106570U JP H01106570 U JPH01106570 U JP H01106570U JP 196788 U JP196788 U JP 196788U JP 196788 U JP196788 U JP 196788U JP H01106570 U JPH01106570 U JP H01106570U
Authority
JP
Japan
Prior art keywords
substrate
electroforming
electroformed
transfer tape
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP196788U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP196788U priority Critical patent/JPH01106570U/ja
Publication of JPH01106570U publication Critical patent/JPH01106570U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP196788U 1988-01-11 1988-01-11 Pending JPH01106570U (no)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP196788U JPH01106570U (no) 1988-01-11 1988-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP196788U JPH01106570U (no) 1988-01-11 1988-01-11

Publications (1)

Publication Number Publication Date
JPH01106570U true JPH01106570U (no) 1989-07-18

Family

ID=31202322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP196788U Pending JPH01106570U (no) 1988-01-11 1988-01-11

Country Status (1)

Country Link
JP (1) JPH01106570U (no)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009102743A (ja) * 1997-04-04 2009-05-14 Univ Of Southern California 多層３次元構造を製造するための方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009102743A (ja) * 1997-04-04 2009-05-14 Univ Of Southern California 多層３次元構造を製造するための方法

Similar Documents

Publication Publication Date Title
JPH0476985A (ja) プリント配線板の製造法
JPH05198926A (ja) 成形されたマンドレルを使用する隆起部分を有するセミアディティブ回路
EP0185998A1 (en) Interconnection circuits made from transfer electroforming
JPH01106570U (no)
JP2002004077A (ja) 電鋳製品およびその製造方法
JPS6176479U (no)
JPH04127492A (ja) プリント配線用材とその製造方法とプリント配線板
JPS6432193U (no)
JPS62104792A (ja) 層間剥離型転写材
JP2001127409A (ja) メッキ転写原版およびその製造方法とそれを用いた電子部品の製造方法
JP3740869B2 (ja) 微細パターンの製造方法およびそれを用いたプリント配線板
JPH0243797A (ja) スルーホール付回路基板の製造方法
JP2566424B2 (ja) 導電性回路転写箔およびその製造法
KR0157143B1 (ko) 전착화상의 제조방법
JPH0233080U (no)
JPS6330843A (ja) パタ−ンの形成方法
JPH07273432A (ja) プリント配線板の製造法
JPS6434586U (no)
JPS63130922U (no)
JPH0499689A (ja) 接着剤層付きメッキパターン構造体の製造方法及び接着剤層付きメッキパターン構造体
JPS62164624U (no)
JPH0284794A (ja) パネル転写両面配線基板及びその製造方法
JPH0787205B2 (ja) ２層ｔａｂの製造方法
JPH04185435A (ja) スクリーンマスクの製造方法
JPS6185843U (no)