JPH01106570U - - Google Patents
Info
- Publication number
- JPH01106570U JPH01106570U JP196788U JP196788U JPH01106570U JP H01106570 U JPH01106570 U JP H01106570U JP 196788 U JP196788 U JP 196788U JP 196788 U JP196788 U JP 196788U JP H01106570 U JPH01106570 U JP H01106570U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electroforming
- electroformed
- transfer tape
- photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 238000005323 electroforming Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000004070 electrodeposition Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Description
第１図ａ、本考案における基板に感光性電着樹
脂レジスト層を形成し電鋳層等を施した断面図。
第１図ｂ、本考案におけるエレクトロフオーミン
グ基板より電鋳層を剥離転写した転写テープの断
面図及び実施例―１の完成断面図。第１図ｃ、本
考案における実施例―２の完成断面図。第１図ｄ
、本考案における感光性電着樹脂形成浴の断面図
。第２図ａ、本考案における実施例―１の平面図
。第２図ｂ，ｃ、本考案における実施例―２の平
面図。第３図ａ、従来技術におけるエレクトロフ
オーミング基板の完成断面図。第３図ｂ、従来技
術におけるエレクトロフオーミング基板より電鋳
層を剥離転写した転写テープの断面図。第３図ｃ
、従来技術におけるネームプレート等の最終商品
に電鋳層を転写接着した断面図。
１……基板、２……レジスト層、２ａ……感光
性電着樹脂レジスト層、３……電鋳層、４……仕
上メツキ層、５……粘着層、６……転写テープ、
７……接着層、８……離形紙、９……感光性電着
樹脂液、１０……ネームプレート等、１１……極
板。
FIG. 1a is a cross-sectional view of a substrate according to the present invention on which a photosensitive electrodeposited resin resist layer is formed and an electroformed layer is applied.
FIG. 1b is a cross-sectional view of a transfer tape obtained by peeling and transferring an electroformed layer from an electroforming substrate according to the present invention, and a completed cross-sectional view of Example-1. FIG. 1c is a completed sectional view of Embodiment 2 of the present invention. Figure 1d
, a sectional view of a photosensitive electrodeposited resin forming bath in the present invention. FIG. 2a is a plan view of Embodiment 1 of the present invention. FIGS. 2b and 2c are plan views of Embodiment 2 of the present invention. FIG. 3a is a completed sectional view of an electroforming substrate according to the prior art. FIG. 3b is a sectional view of a transfer tape in which an electroformed layer is peeled off and transferred from an electroformed substrate in the prior art. Figure 3c
, is a cross-sectional view of an electroformed layer transferred and bonded to a final product such as a name plate in the prior art. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Resist layer, 2a... Photosensitive electrodeposition resin resist layer, 3... Electroforming layer, 4... Finish plating layer, 5... Adhesive layer, 6... Transfer tape,
7... Adhesive layer, 8... Release paper, 9... Photosensitive electrodeposited resin liquid, 10... Name plate, etc., 11... Electrode plate.
Claims (1)
パターンを露光、現像させた導電部に部分電鋳形
成させて、該電鋳物を剥離転写するエレクトロフ
オーミング基板及び転写テープにおいて、前記レ
ジスト層が感光性電着樹脂で構成されていること
を特徴とするエレクトロフオーミング基板及び転
写テープ。 (2) 前記基板の両面に感光性電着樹脂のレジス
ト層を形成させたことを特徴とする第１項記載の
エレクトロフオーミング基板及び転写テープ。[Claims for Utility Model Registration] (1) Electroforming in which a resist layer is formed on a conductive substrate, a necessary pattern is partially electroformed on the exposed and developed conductive part, and the electroformed product is peeled off and transferred. An electroforming substrate and a transfer tape, wherein the resist layer is made of a photosensitive electrodeposited resin. (2) The electroforming substrate and transfer tape according to item 1, wherein resist layers of photosensitive electrodeposition resin are formed on both sides of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP196788U JPH01106570U (en) | 1988-01-11 | 1988-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP196788U JPH01106570U (en) | 1988-01-11 | 1988-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01106570U true JPH01106570U (en) | 1989-07-18 |
Family
ID=31202322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP196788U Pending JPH01106570U (en) | 1988-01-11 | 1988-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01106570U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009102743A (en) * | 1997-04-04 | 2009-05-14 | Univ Of Southern California | Method for manufacturing multi-layer three-dimensional structure |
-
1988
- 1988-01-11 JP JP196788U patent/JPH01106570U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009102743A (en) * | 1997-04-04 | 2009-05-14 | Univ Of Southern California | Method for manufacturing multi-layer three-dimensional structure |
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