JPH01103632A - 電気絶縁用積層板 - Google Patents
電気絶縁用積層板Info
- Publication number
- JPH01103632A JPH01103632A JP12865988A JP12865988A JPH01103632A JP H01103632 A JPH01103632 A JP H01103632A JP 12865988 A JP12865988 A JP 12865988A JP 12865988 A JP12865988 A JP 12865988A JP H01103632 A JPH01103632 A JP H01103632A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- epoxy
- modified polyimide
- polyimide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003566 sealing material Substances 0.000 title claims description 4
- 239000003822 epoxy resin Substances 0.000 claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 29
- 229920001721 polyimide Polymers 0.000 claims abstract description 28
- 239000009719 polyimide resin Substances 0.000 claims abstract description 28
- 239000002841 Lewis acid Substances 0.000 claims abstract description 11
- 125000005462 imide group Chemical group 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 125000003277 amino group Chemical group 0.000 claims abstract description 7
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 6
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 6
- 239000002966 varnish Substances 0.000 claims abstract description 4
- 150000001491 aromatic compounds Chemical class 0.000 claims description 12
- -1 Lewis acid compound Chemical class 0.000 claims description 11
- 238000010292 electrical insulation Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 238000010521 absorption reaction Methods 0.000 abstract description 11
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 239000004744 fabric Substances 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract description 2
- 239000004745 nonwoven fabric Substances 0.000 abstract description 2
- 239000011229 interlayer Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 150000007517 lewis acids Chemical class 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 150000003949 imides Chemical class 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Insulating Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12865988A JPH01103632A (ja) | 1987-07-06 | 1988-05-26 | 電気絶縁用積層板 |
| JP4054075A JPH0795481B2 (ja) | 1988-05-26 | 1992-03-13 | 電子部品封止用材料 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-168219 | 1987-07-06 | ||
| JP16821987 | 1987-07-06 | ||
| JP12865988A JPH01103632A (ja) | 1987-07-06 | 1988-05-26 | 電気絶縁用積層板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4054075A Division JPH0795481B2 (ja) | 1988-05-26 | 1992-03-13 | 電子部品封止用材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01103632A true JPH01103632A (ja) | 1989-04-20 |
| JPH0588892B2 JPH0588892B2 (https=) | 1993-12-24 |
Family
ID=26464268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12865988A Granted JPH01103632A (ja) | 1987-07-06 | 1988-05-26 | 電気絶縁用積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01103632A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6523721B1 (en) | 1999-04-30 | 2003-02-25 | Kawasaki Jukogyo Kabushiki Kaisha | Powder and granular material supply system for closed system |
| JP2019522714A (ja) * | 2016-08-08 | 2019-08-15 | エルジー・ケム・リミテッド | 重合性組成物 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5650934A (en) * | 1979-10-04 | 1981-05-08 | Mitsubishi Electric Corp | Heat-resistant prepreg |
| JPS579011A (en) * | 1980-06-18 | 1982-01-18 | Mitsubishi Electric Corp | Refractory prepreg insulator |
| JPS60210640A (ja) * | 1984-10-05 | 1985-10-23 | Hitachi Chem Co Ltd | 積層板の製造法 |
-
1988
- 1988-05-26 JP JP12865988A patent/JPH01103632A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5650934A (en) * | 1979-10-04 | 1981-05-08 | Mitsubishi Electric Corp | Heat-resistant prepreg |
| JPS579011A (en) * | 1980-06-18 | 1982-01-18 | Mitsubishi Electric Corp | Refractory prepreg insulator |
| JPS60210640A (ja) * | 1984-10-05 | 1985-10-23 | Hitachi Chem Co Ltd | 積層板の製造法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6523721B1 (en) | 1999-04-30 | 2003-02-25 | Kawasaki Jukogyo Kabushiki Kaisha | Powder and granular material supply system for closed system |
| JP2019522714A (ja) * | 2016-08-08 | 2019-08-15 | エルジー・ケム・リミテッド | 重合性組成物 |
| US10927215B2 (en) | 2016-08-08 | 2021-02-23 | Lg Chem, Ltd. | Polymerizable composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0588892B2 (https=) | 1993-12-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |