JPH01100279A - 金属層の製造方法 - Google Patents
金属層の製造方法Info
- Publication number
- JPH01100279A JPH01100279A JP63203314A JP20331488A JPH01100279A JP H01100279 A JPH01100279 A JP H01100279A JP 63203314 A JP63203314 A JP 63203314A JP 20331488 A JP20331488 A JP 20331488A JP H01100279 A JPH01100279 A JP H01100279A
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- laser
- coating
- substrate
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 46
- 239000002184 metal Substances 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 239000011248 coating agent Substances 0.000 claims description 28
- 238000000576 coating method Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 19
- 230000005855 radiation Effects 0.000 claims description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- -1 argon ion Chemical class 0.000 claims description 3
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims 1
- 230000003595 spectral effect Effects 0.000 claims 1
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract 3
- 239000011247 coating layer Substances 0.000 abstract 2
- 239000013078 crystal Substances 0.000 abstract 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 239000000975 dye Substances 0.000 description 8
- 229910052763 palladium Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 150000002902 organometallic compounds Chemical class 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052705 radium Inorganic materials 0.000 description 2
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 159000000021 acetate salts Chemical class 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 235000021395 porridge Nutrition 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3727422.8 | 1987-08-17 | ||
| DE3727422 | 1987-08-17 | ||
| DE3826046.8 | 1988-07-30 | ||
| DE3826046A DE3826046A1 (de) | 1987-08-17 | 1988-07-30 | Verfahren zur herstellung von metallischen schichten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100279A true JPH01100279A (ja) | 1989-04-18 |
Family
ID=25858741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63203314A Pending JPH01100279A (ja) | 1987-08-17 | 1988-08-17 | 金属層の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4900581A (US06368395-20020409-C00050.png) |
| JP (1) | JPH01100279A (US06368395-20020409-C00050.png) |
| DE (1) | DE3826046A1 (US06368395-20020409-C00050.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04183873A (ja) * | 1990-11-19 | 1992-06-30 | Agency Of Ind Science & Technol | 紫外レーザーを用いた高分子成形品への無電解めっき方法 |
| JP2014533775A (ja) * | 2011-11-16 | 2014-12-15 | セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｅｒａｍＴｅｃ ＧｍｂＨ | セラミック基板に埋め込まれた金属構造体 |
Families Citing this family (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4960613A (en) * | 1988-10-04 | 1990-10-02 | General Electric Company | Laser interconnect process |
| KR100190423B1 (ko) * | 1989-06-06 | 1999-06-01 | 기타지마 요시도시 | 에멀젼마스크 등의결함 수정방법 및 장치 |
| DE3922233A1 (de) * | 1989-07-06 | 1991-01-17 | Guenter Link | Verfahren zur abscheidung von metallen aus metallorganischen verbindungen mittels photonenstrahlung |
| DE3936479A1 (de) * | 1989-11-02 | 1991-05-08 | Guenter Link | Verfahren zur erzeugung von schutzschichten auf materialoberflaechen mittels laserstrahlung |
| US5225251A (en) * | 1989-12-22 | 1993-07-06 | Asea Brown Boveri Aktiengesellschaft | Method for forming layers by UV radiation of aluminum nitride |
| DE4008482A1 (de) * | 1990-03-16 | 1991-09-19 | Asea Brown Boveri | Galvanisierungsverfahren |
| DE4034834C2 (de) * | 1990-11-02 | 1995-03-23 | Heraeus Noblelight Gmbh | Verfahren zur Herstellung metallischer Schichten auf Substraten und Verwendung der Schichten |
| US5153023A (en) * | 1990-12-03 | 1992-10-06 | Xerox Corporation | Process for catalysis of electroless metal plating on plastic |
| DE4210400C1 (en) * | 1992-03-30 | 1993-01-07 | Siemens Ag, 8000 Muenchen, De | Local copper@ deposition from organo:metallic film on substrate - by forming film from mixt. of copper acetate and copper formate in specified ratio and depositing film by laser irradiation |
| GB9207054D0 (en) * | 1992-03-31 | 1992-05-13 | Gillette Co | Methods of manufacturing perforated foils |
| US5322986A (en) * | 1992-04-06 | 1994-06-21 | Eastman Kodak Company | Methods for preparing polymer stripe waveguides and polymer stripe waveguides prepared thereby |
| US5459098A (en) * | 1992-10-19 | 1995-10-17 | Marietta Energy Systems, Inc. | Maskless laser writing of microscopic metallic interconnects |
| US5643356A (en) | 1993-08-05 | 1997-07-01 | Kimberly-Clark Corporation | Ink for ink jet printers |
| US6017661A (en) | 1994-11-09 | 2000-01-25 | Kimberly-Clark Corporation | Temporary marking using photoerasable colorants |
| US5773182A (en) | 1993-08-05 | 1998-06-30 | Kimberly-Clark Worldwide, Inc. | Method of light stabilizing a colorant |
| US5681380A (en) | 1995-06-05 | 1997-10-28 | Kimberly-Clark Worldwide, Inc. | Ink for ink jet printers |
| US6211383B1 (en) | 1993-08-05 | 2001-04-03 | Kimberly-Clark Worldwide, Inc. | Nohr-McDonald elimination reaction |
| CA2120838A1 (en) | 1993-08-05 | 1995-02-06 | Ronald Sinclair Nohr | Solid colored composition mutable by ultraviolet radiation |
| US6017471A (en) | 1993-08-05 | 2000-01-25 | Kimberly-Clark Worldwide, Inc. | Colorants and colorant modifiers |
| US5865471A (en) | 1993-08-05 | 1999-02-02 | Kimberly-Clark Worldwide, Inc. | Photo-erasable data processing forms |
| US5645964A (en) | 1993-08-05 | 1997-07-08 | Kimberly-Clark Corporation | Digital information recording media and method of using same |
| US5721287A (en) | 1993-08-05 | 1998-02-24 | Kimberly-Clark Worldwide, Inc. | Method of mutating a colorant by irradiation |
| US5733693A (en) | 1993-08-05 | 1998-03-31 | Kimberly-Clark Worldwide, Inc. | Method for improving the readability of data processing forms |
| US5703341A (en) * | 1993-11-23 | 1997-12-30 | Lockheed Martin Energy Systems, Inc. | Method for adhesion of metal films to ceramics |
| US5739175A (en) | 1995-06-05 | 1998-04-14 | Kimberly-Clark Worldwide, Inc. | Photoreactor composition containing an arylketoalkene wavelength-specific sensitizer |
| US5685754A (en) | 1994-06-30 | 1997-11-11 | Kimberly-Clark Corporation | Method of generating a reactive species and polymer coating applications therefor |
| US6242057B1 (en) | 1994-06-30 | 2001-06-05 | Kimberly-Clark Worldwide, Inc. | Photoreactor composition and applications therefor |
| US6071979A (en) | 1994-06-30 | 2000-06-06 | Kimberly-Clark Worldwide, Inc. | Photoreactor composition method of generating a reactive species and applications therefor |
| JP2882572B2 (ja) * | 1994-08-31 | 1999-04-12 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 金属薄膜をレーザで平坦化する方法 |
| US5626670A (en) * | 1994-10-03 | 1997-05-06 | American Research Corporation Of Virginia | Method for producing low thermal budget ferroelectric thin films for integrated device structures using laser-crystallization of spin-on sol-gel films |
| US6008268A (en) | 1994-10-21 | 1999-12-28 | Kimberly-Clark Worldwide, Inc. | Photoreactor composition, method of generating a reactive species, and applications therefor |
| DE4444567A1 (de) * | 1994-12-02 | 1996-06-05 | Siemens Ag | Verfahren zum Herstellen einer Leiterplatte mit einer Kernplatte aus Aluminium oder Aluminiumlegierung |
| DE19518512C2 (de) * | 1995-03-06 | 2001-11-29 | Fraunhofer Ges Forschung | Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial |
| US5747550A (en) | 1995-06-05 | 1998-05-05 | Kimberly-Clark Worldwide, Inc. | Method of generating a reactive species and polymerizing an unsaturated polymerizable material |
| US5786132A (en) | 1995-06-05 | 1998-07-28 | Kimberly-Clark Corporation | Pre-dyes, mutable dye compositions, and methods of developing a color |
| RU2170943C2 (ru) | 1995-06-05 | 2001-07-20 | Кимберли-Кларк Уорлдвайд, Инк. | Новые прекрасители |
| US5811199A (en) | 1995-06-05 | 1998-09-22 | Kimberly-Clark Worldwide, Inc. | Adhesive compositions containing a photoreactor composition |
| US5798015A (en) | 1995-06-05 | 1998-08-25 | Kimberly-Clark Worldwide, Inc. | Method of laminating a structure with adhesive containing a photoreactor composition |
| US5849411A (en) | 1995-06-05 | 1998-12-15 | Kimberly-Clark Worldwide, Inc. | Polymer film, nonwoven web and fibers containing a photoreactor composition |
| JP2000506550A (ja) | 1995-06-28 | 2000-05-30 | キンバリー クラーク ワールドワイド インコーポレイテッド | 新規な着色剤および着色剤用改質剤 |
| CA2210480A1 (en) | 1995-11-28 | 1997-06-05 | Kimberly-Clark Worldwide, Inc. | Improved colorant stabilizers |
| US5855655A (en) | 1996-03-29 | 1999-01-05 | Kimberly-Clark Worldwide, Inc. | Colorant stabilizers |
| US6099628A (en) | 1996-03-29 | 2000-08-08 | Kimberly-Clark Worldwide, Inc. | Colorant stabilizers |
| US5782963A (en) | 1996-03-29 | 1998-07-21 | Kimberly-Clark Worldwide, Inc. | Colorant stabilizers |
| US5891229A (en) | 1996-03-29 | 1999-04-06 | Kimberly-Clark Worldwide, Inc. | Colorant stabilizers |
| US5894038A (en) * | 1997-02-28 | 1999-04-13 | The Whitaker Corporation | Direct deposition of palladium |
| DE19723734C2 (de) | 1997-06-06 | 2002-02-07 | Gerhard Naundorf | Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung |
| US6524379B2 (en) | 1997-08-15 | 2003-02-25 | Kimberly-Clark Worldwide, Inc. | Colorants, colorant stabilizers, ink compositions, and improved methods of making the same |
| BR9906513A (pt) | 1998-06-03 | 2001-10-30 | Kimberly Clark Co | Fotoiniciadores novos e aplicações para osmesmos |
| EP1062285A2 (en) | 1998-06-03 | 2000-12-27 | Kimberly-Clark Worldwide, Inc. | Neonanoplasts and microemulsion technology for inks and ink jet printing |
| IE980461A1 (en) * | 1998-06-15 | 2000-05-03 | Univ Cork | Method for selective activation and metallisation of materials |
| US6228157B1 (en) | 1998-07-20 | 2001-05-08 | Ronald S. Nohr | Ink jet ink compositions |
| DE19835158A1 (de) * | 1998-08-04 | 2000-02-10 | Wolfgang Anger | Verfahren zur Erzeugung von Leiterplatten |
| DE69930948T2 (de) | 1998-09-28 | 2006-09-07 | Kimberly-Clark Worldwide, Inc., Neenah | Chelate mit chinoiden gruppen als photoinitiatoren |
| ATE238393T1 (de) | 1999-01-19 | 2003-05-15 | Kimberly Clark Co | Farbstoffe, farbstoffstabilisatoren, tintenzusammensetzungen und verfahren zu deren herstellung |
| US6331056B1 (en) | 1999-02-25 | 2001-12-18 | Kimberly-Clark Worldwide, Inc. | Printing apparatus and applications therefor |
| US6294698B1 (en) | 1999-04-16 | 2001-09-25 | Kimberly-Clark Worldwide, Inc. | Photoinitiators and applications therefor |
| US6368395B1 (en) | 1999-05-24 | 2002-04-09 | Kimberly-Clark Worldwide, Inc. | Subphthalocyanine colorants, ink compositions, and method of making the same |
| US6171712B1 (en) | 2000-03-15 | 2001-01-09 | Ford Global Technologies, Inc. | Palladium and palladium/copper thin flat membranes |
| IL138530A0 (en) * | 2000-09-18 | 2003-02-12 | T L M Advanced Laser Technolog | Method for the formation of a pattern on an insulating substrate |
| US7800024B2 (en) * | 2004-09-27 | 2010-09-21 | Duguay Michel A | Lithic wireless warming table and portable heaters |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3318978A1 (de) * | 1983-05-25 | 1984-11-29 | Werner Dr. Vaduz Tabarelli | Einrichtung zum projektionskopieren von masken auf ein werkstueck |
| DE3337790A1 (de) * | 1983-10-18 | 1985-04-25 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur chemischen metallisierung |
| DE3347038C2 (de) * | 1983-12-24 | 1986-12-11 | Fr. Kammerer GmbH, 7530 Pforzheim | Verfahren zum Beschichten von Trägern mit Metallen |
| DE3407089A1 (de) * | 1984-02-27 | 1985-08-29 | Siemens Ag | Verfahren und vorrichtung zur lichtinduzierten, fotolytischen abscheidung |
| JPS61119676A (ja) * | 1984-11-15 | 1986-06-06 | Ulvac Corp | シ−トプラズマとレ−ザ光を利用した成膜装置 |
| US4574095A (en) * | 1984-11-19 | 1986-03-04 | International Business Machines Corporation | Selective deposition of copper |
| JPS61187237A (ja) * | 1985-02-14 | 1986-08-20 | Toshiba Corp | パタ−ン形成方法 |
| JPS61276233A (ja) * | 1985-05-30 | 1986-12-06 | Nec Corp | パタ−ン形成方法 |
| US4786358A (en) * | 1986-08-08 | 1988-11-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a pattern of a film on a substrate with a laser beam |
-
1988
- 1988-07-30 DE DE3826046A patent/DE3826046A1/de active Granted
- 1988-08-17 US US07/233,241 patent/US4900581A/en not_active Expired - Fee Related
- 1988-08-17 JP JP63203314A patent/JPH01100279A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04183873A (ja) * | 1990-11-19 | 1992-06-30 | Agency Of Ind Science & Technol | 紫外レーザーを用いた高分子成形品への無電解めっき方法 |
| JP2014533775A (ja) * | 2011-11-16 | 2014-12-15 | セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｅｒａｍＴｅｃ ＧｍｂＨ | セラミック基板に埋め込まれた金属構造体 |
Also Published As
| Publication number | Publication date |
|---|---|
| US4900581A (en) | 1990-02-13 |
| DE3826046A1 (de) | 1989-03-02 |
| DE3826046C2 (US06368395-20020409-C00050.png) | 1990-12-06 |
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