JP7846752B2 - ウエハ加工装置、半導体チップの製造方法および半導体チップ - Google Patents

ウエハ加工装置、半導体チップの製造方法および半導体チップ

Info

Publication number
JP7846752B2
JP7846752B2 JP2024517843A JP2024517843A JP7846752B2 JP 7846752 B2 JP7846752 B2 JP 7846752B2 JP 2024517843 A JP2024517843 A JP 2024517843A JP 2024517843 A JP2024517843 A JP 2024517843A JP 7846752 B2 JP7846752 B2 JP 7846752B2
Authority
JP
Japan
Prior art keywords
wafer
module
modules
wafers
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024517843A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023210088A1 (https=
Inventor
芳邦 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of JPWO2023210088A1 publication Critical patent/JPWO2023210088A1/ja
Application granted granted Critical
Publication of JP7846752B2 publication Critical patent/JP7846752B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Dicing (AREA)
JP2024517843A 2022-04-27 2023-02-03 ウエハ加工装置、半導体チップの製造方法および半導体チップ Active JP7846752B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2022/019169 WO2023209897A1 (ja) 2022-04-27 2022-04-27 ウエハ加工装置、半導体チップの製造方法および半導体チップ
JPPCT/JP2022/019169 2022-04-27
PCT/JP2023/003610 WO2023210088A1 (ja) 2022-04-27 2023-02-03 ウエハ加工装置、半導体チップの製造方法および半導体チップ

Publications (2)

Publication Number Publication Date
JPWO2023210088A1 JPWO2023210088A1 (https=) 2023-11-02
JP7846752B2 true JP7846752B2 (ja) 2026-04-15

Family

ID=88518316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024517843A Active JP7846752B2 (ja) 2022-04-27 2023-02-03 ウエハ加工装置、半導体チップの製造方法および半導体チップ

Country Status (3)

Country Link
JP (1) JP7846752B2 (https=)
TW (1) TWI899562B (https=)
WO (2) WO2023209897A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282666A (ja) 2002-03-25 2003-10-03 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
JP2005109324A (ja) 2003-10-01 2005-04-21 Tokyo Seimitsu Co Ltd レーザーダイシング装置
JP2005228771A (ja) 2004-02-10 2005-08-25 Shinko Electric Co Ltd 基板搬送方法、及びその装置
JP2007235068A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP2010125488A (ja) 2008-11-28 2010-06-10 Apic Yamada Corp 切断装置
JP2011018731A (ja) 2009-07-08 2011-01-27 Rayresearch Corp ウェハ分岐搬送装置
JP2017204508A (ja) 2016-05-09 2017-11-16 キヤノン株式会社 基板処理装置、および物品製造方法
JP2020191331A (ja) 2019-05-20 2020-11-26 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100162955A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Systems and methods for substrate processing
JP2013219328A (ja) * 2012-03-13 2013-10-24 Tokyo Electron Ltd 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP6802722B2 (ja) * 2017-01-27 2020-12-16 株式会社ディスコ 加工装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282666A (ja) 2002-03-25 2003-10-03 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
JP2005109324A (ja) 2003-10-01 2005-04-21 Tokyo Seimitsu Co Ltd レーザーダイシング装置
JP2005228771A (ja) 2004-02-10 2005-08-25 Shinko Electric Co Ltd 基板搬送方法、及びその装置
JP2007235068A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP2010125488A (ja) 2008-11-28 2010-06-10 Apic Yamada Corp 切断装置
JP2011018731A (ja) 2009-07-08 2011-01-27 Rayresearch Corp ウェハ分岐搬送装置
JP2017204508A (ja) 2016-05-09 2017-11-16 キヤノン株式会社 基板処理装置、および物品製造方法
JP2020191331A (ja) 2019-05-20 2020-11-26 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
TWI899562B (zh) 2025-10-01
WO2023210088A1 (ja) 2023-11-02
WO2023209897A1 (ja) 2023-11-02
TW202401536A (zh) 2024-01-01
JPWO2023210088A1 (https=) 2023-11-02

Similar Documents

Publication Publication Date Title
JP7798680B2 (ja) ウエハ加工装置、半導体チップの製造方法および半導体チップ
JP2002334852A (ja) 被加工物の分割処理方法および分割処理方法に用いるチップ間隔拡張装置
US20240290909A1 (en) Method and system of producing microstructured components
TW201946208A (zh) 對半導體晶圓貼附之保護膠帶的貼附裝置及貼附方法
JP2024110735A (ja) ウエハマウント装置、半導体チップおよび半導体チップの製造方法
JP6415349B2 (ja) ウェーハの位置合わせ方法
TW201810398A (zh) 晶圓加工系統
TW201839834A (zh) 切割裝置
JP7846752B2 (ja) ウエハ加工装置、半導体チップの製造方法および半導体チップ
JP7804522B2 (ja) エキスパンド装置、および、半導体チップの製造方法
JP3172778B2 (ja) 半導体ウエハの全自動ポリッシング装置
CN1721998A (zh) 光刻装置和器件制造方法
JP7804756B2 (ja) ウエハ加工装置、半導体チップの製造方法および半導体チップ
JP7624075B2 (ja) エキスパンド装置、半導体チップの製造方法および半導体チップ
JP2024110792A (ja) ウエハマウント装置、半導体チップ、および、半導体チップの製造方法
KR102938788B1 (ko) 익스팬드 장치, 반도체 칩의 제조 방법, 및 반도체 칩
JP7821876B2 (ja) ウエハ加工装置および半導体チップの製造方法
US20260096385A1 (en) Adhesive tape application system to modify the adhesive strength of the adhesive tape and method of applying the adhesive tape
WO2024161640A1 (ja) レーザ加工装置、レーザ加工方法、半導体チップおよび半導体チップの製造方法
JP2024110737A (ja) ウエハマウント装置、半導体チップおよび半導体チップの製造方法
JP2024110703A (ja) ウエハマウント装置、半導体チップおよび半導体チップの製造方法
WO2023209873A1 (ja) ダイシング装置、半導体チップの製造方法および半導体チップ
WO2024116598A1 (ja) 成膜装置及び成膜方法
WO2024161635A1 (ja) レーザ加工装置、半導体チップおよび半導体チップの製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240913

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20251028

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251210

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260324

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260403

R150 Certificate of patent or registration of utility model

Ref document number: 7846752

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150