JPWO2023210088A1 - - Google Patents
Info
- Publication number
- JPWO2023210088A1 JPWO2023210088A1 JP2024517843A JP2024517843A JPWO2023210088A1 JP WO2023210088 A1 JPWO2023210088 A1 JP WO2023210088A1 JP 2024517843 A JP2024517843 A JP 2024517843A JP 2024517843 A JP2024517843 A JP 2024517843A JP WO2023210088 A1 JPWO2023210088 A1 JP WO2023210088A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/019169 WO2023209897A1 (ja) | 2022-04-27 | 2022-04-27 | ウエハ加工装置、半導体チップの製造方法および半導体チップ |
| JPPCT/JP2022/019169 | 2022-04-27 | ||
| PCT/JP2023/003610 WO2023210088A1 (ja) | 2022-04-27 | 2023-02-03 | ウエハ加工装置、半導体チップの製造方法および半導体チップ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023210088A1 true JPWO2023210088A1 (https=) | 2023-11-02 |
| JP7846752B2 JP7846752B2 (ja) | 2026-04-15 |
Family
ID=88518316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024517843A Active JP7846752B2 (ja) | 2022-04-27 | 2023-02-03 | ウエハ加工装置、半導体チップの製造方法および半導体チップ |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7846752B2 (https=) |
| TW (1) | TWI899562B (https=) |
| WO (2) | WO2023209897A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003282666A (ja) * | 2002-03-25 | 2003-10-03 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および基板処理装置 |
| JP2005109324A (ja) * | 2003-10-01 | 2005-04-21 | Tokyo Seimitsu Co Ltd | レーザーダイシング装置 |
| JP2005228771A (ja) * | 2004-02-10 | 2005-08-25 | Shinko Electric Co Ltd | 基板搬送方法、及びその装置 |
| JP2007235068A (ja) * | 2006-03-03 | 2007-09-13 | Tokyo Seimitsu Co Ltd | ウェーハ加工方法 |
| JP2010125488A (ja) * | 2008-11-28 | 2010-06-10 | Apic Yamada Corp | 切断装置 |
| JP2011018731A (ja) * | 2009-07-08 | 2011-01-27 | Rayresearch Corp | ウェハ分岐搬送装置 |
| JP2017204508A (ja) * | 2016-05-09 | 2017-11-16 | キヤノン株式会社 | 基板処理装置、および物品製造方法 |
| JP2020191331A (ja) * | 2019-05-20 | 2020-11-26 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100162955A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Systems and methods for substrate processing |
| JP2013219328A (ja) * | 2012-03-13 | 2013-10-24 | Tokyo Electron Ltd | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
| JP6802722B2 (ja) * | 2017-01-27 | 2020-12-16 | 株式会社ディスコ | 加工装置 |
-
2022
- 2022-04-27 WO PCT/JP2022/019169 patent/WO2023209897A1/ja not_active Ceased
-
2023
- 2023-02-03 WO PCT/JP2023/003610 patent/WO2023210088A1/ja not_active Ceased
- 2023-02-03 JP JP2024517843A patent/JP7846752B2/ja active Active
- 2023-04-20 TW TW112114670A patent/TWI899562B/zh active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003282666A (ja) * | 2002-03-25 | 2003-10-03 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および基板処理装置 |
| JP2005109324A (ja) * | 2003-10-01 | 2005-04-21 | Tokyo Seimitsu Co Ltd | レーザーダイシング装置 |
| JP2005228771A (ja) * | 2004-02-10 | 2005-08-25 | Shinko Electric Co Ltd | 基板搬送方法、及びその装置 |
| JP2007235068A (ja) * | 2006-03-03 | 2007-09-13 | Tokyo Seimitsu Co Ltd | ウェーハ加工方法 |
| JP2010125488A (ja) * | 2008-11-28 | 2010-06-10 | Apic Yamada Corp | 切断装置 |
| JP2011018731A (ja) * | 2009-07-08 | 2011-01-27 | Rayresearch Corp | ウェハ分岐搬送装置 |
| JP2017204508A (ja) * | 2016-05-09 | 2017-11-16 | キヤノン株式会社 | 基板処理装置、および物品製造方法 |
| JP2020191331A (ja) * | 2019-05-20 | 2020-11-26 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI899562B (zh) | 2025-10-01 |
| WO2023210088A1 (ja) | 2023-11-02 |
| JP7846752B2 (ja) | 2026-04-15 |
| WO2023209897A1 (ja) | 2023-11-02 |
| TW202401536A (zh) | 2024-01-01 |
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