JP7834422B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JP7834422B2
JP7834422B2 JP2023548112A JP2023548112A JP7834422B2 JP 7834422 B2 JP7834422 B2 JP 7834422B2 JP 2023548112 A JP2023548112 A JP 2023548112A JP 2023548112 A JP2023548112 A JP 2023548112A JP 7834422 B2 JP7834422 B2 JP 7834422B2
Authority
JP
Japan
Prior art keywords
semiconductor
wiring board
semiconductor device
chip
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023548112A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023042450A1 (https=
Inventor
大祐 茅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Semiconductor Solutions Corp
Original Assignee
Sony Semiconductor Solutions Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Semiconductor Solutions Corp filed Critical Sony Semiconductor Solutions Corp
Publication of JPWO2023042450A1 publication Critical patent/JPWO2023042450A1/ja
Application granted granted Critical
Publication of JP7834422B2 publication Critical patent/JP7834422B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2023548112A 2021-09-14 2022-03-23 半導体装置の製造方法 Active JP7834422B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021149232 2021-09-14
JP2021149232 2021-09-14
PCT/JP2022/013330 WO2023042450A1 (ja) 2021-09-14 2022-03-23 半導体装置の製造方法、半導体装置、及び半導体装置用の配線基板

Publications (2)

Publication Number Publication Date
JPWO2023042450A1 JPWO2023042450A1 (https=) 2023-03-23
JP7834422B2 true JP7834422B2 (ja) 2026-03-24

Family

ID=85601973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023548112A Active JP7834422B2 (ja) 2021-09-14 2022-03-23 半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JP7834422B2 (https=)
WO (1) WO2023042450A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322858A (ja) 2004-05-11 2005-11-17 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP2009246174A (ja) 2008-03-31 2009-10-22 Sanyo Electric Co Ltd 半導体モジュール、半導体モジュールの製造方法、ならびに携帯機器
JP2009267409A (ja) 2008-04-24 2009-11-12 Mutual-Pak Technology Co Ltd 集積回路デバイス用のパッケージ構造およびパッケージ方法
JP2010114243A (ja) 2008-11-06 2010-05-20 Toppan Printing Co Ltd 半導体装置
WO2021111716A1 (ja) 2019-12-04 2021-06-10 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322858A (ja) 2004-05-11 2005-11-17 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP2009246174A (ja) 2008-03-31 2009-10-22 Sanyo Electric Co Ltd 半導体モジュール、半導体モジュールの製造方法、ならびに携帯機器
JP2009267409A (ja) 2008-04-24 2009-11-12 Mutual-Pak Technology Co Ltd 集積回路デバイス用のパッケージ構造およびパッケージ方法
JP2010114243A (ja) 2008-11-06 2010-05-20 Toppan Printing Co Ltd 半導体装置
WO2021111716A1 (ja) 2019-12-04 2021-06-10 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法

Also Published As

Publication number Publication date
WO2023042450A1 (ja) 2023-03-23
JPWO2023042450A1 (https=) 2023-03-23

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