JP7827161B2 - 半導体モジュール、半導体装置、及び車両 - Google Patents

半導体モジュール、半導体装置、及び車両

Info

Publication number
JP7827161B2
JP7827161B2 JP2024552856A JP2024552856A JP7827161B2 JP 7827161 B2 JP7827161 B2 JP 7827161B2 JP 2024552856 A JP2024552856 A JP 2024552856A JP 2024552856 A JP2024552856 A JP 2024552856A JP 7827161 B2 JP7827161 B2 JP 7827161B2
Authority
JP
Japan
Prior art keywords
recess
roughening
recesses
sub
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024552856A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024090029A1 (https=
Inventor
瑶子 中村
昭彦 岩谷
まい 齊藤
翼 渡壁
雄大 玉井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of JPWO2024090029A1 publication Critical patent/JPWO2024090029A1/ja
Application granted granted Critical
Publication of JP7827161B2 publication Critical patent/JP7827161B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H10W72/634—Cross-sectional shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/886—Die-attach connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2024552856A 2022-10-25 2023-08-31 半導体モジュール、半導体装置、及び車両 Active JP7827161B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022170593 2022-10-25
JP2022170593 2022-10-25
PCT/JP2023/031781 WO2024090029A1 (ja) 2022-10-25 2023-08-31 半導体モジュール、半導体装置、及び車両

Publications (2)

Publication Number Publication Date
JPWO2024090029A1 JPWO2024090029A1 (https=) 2024-05-02
JP7827161B2 true JP7827161B2 (ja) 2026-03-10

Family

ID=90830593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024552856A Active JP7827161B2 (ja) 2022-10-25 2023-08-31 半導体モジュール、半導体装置、及び車両

Country Status (4)

Country Link
US (1) US20250022833A1 (https=)
JP (1) JP7827161B2 (https=)
CN (1) CN118974917A (https=)
WO (1) WO2024090029A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006510221A (ja) 2002-12-13 2006-03-23 フリースケール セミコンダクター インコーポレイテッド オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック
JP2007305916A (ja) 2006-05-15 2007-11-22 Rohm Co Ltd リードフレームの製造方法および製造装置
JP2008211168A (ja) 2007-01-31 2008-09-11 Mitsubishi Electric Corp 半導体装置および半導体モジュール
JP2013157536A (ja) 2012-01-31 2013-08-15 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法と半導体装置及びその製造方法
JP2017208486A (ja) 2016-05-19 2017-11-24 株式会社ミスズ工業 表面に凹凸を有する金属部材、ヒートスプレッダ、半導体パッケージ及びそれらの製造方法
WO2022004758A1 (ja) 2020-06-30 2022-01-06 富士電機株式会社 半導体モジュールおよび半導体モジュールの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006510221A (ja) 2002-12-13 2006-03-23 フリースケール セミコンダクター インコーポレイテッド オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック
JP2007305916A (ja) 2006-05-15 2007-11-22 Rohm Co Ltd リードフレームの製造方法および製造装置
JP2008211168A (ja) 2007-01-31 2008-09-11 Mitsubishi Electric Corp 半導体装置および半導体モジュール
JP2013157536A (ja) 2012-01-31 2013-08-15 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法と半導体装置及びその製造方法
JP2017208486A (ja) 2016-05-19 2017-11-24 株式会社ミスズ工業 表面に凹凸を有する金属部材、ヒートスプレッダ、半導体パッケージ及びそれらの製造方法
WO2022004758A1 (ja) 2020-06-30 2022-01-06 富士電機株式会社 半導体モジュールおよび半導体モジュールの製造方法

Also Published As

Publication number Publication date
CN118974917A (zh) 2024-11-15
WO2024090029A1 (ja) 2024-05-02
US20250022833A1 (en) 2025-01-16
JPWO2024090029A1 (https=) 2024-05-02

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