CN118974917A - 半导体模块、半导体装置以及车辆 - Google Patents

半导体模块、半导体装置以及车辆 Download PDF

Info

Publication number
CN118974917A
CN118974917A CN202380031428.XA CN202380031428A CN118974917A CN 118974917 A CN118974917 A CN 118974917A CN 202380031428 A CN202380031428 A CN 202380031428A CN 118974917 A CN118974917 A CN 118974917A
Authority
CN
China
Prior art keywords
recess
roughening
sub
semiconductor module
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380031428.XA
Other languages
English (en)
Chinese (zh)
Inventor
中村瑶子
岩谷昭彦
齐藤麻衣
渡壁翼
玉井雄大
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN118974917A publication Critical patent/CN118974917A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H10W72/634—Cross-sectional shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/886—Die-attach connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202380031428.XA 2022-10-25 2023-08-31 半导体模块、半导体装置以及车辆 Pending CN118974917A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-170593 2022-10-25
JP2022170593 2022-10-25
PCT/JP2023/031781 WO2024090029A1 (ja) 2022-10-25 2023-08-31 半導体モジュール、半導体装置、及び車両

Publications (1)

Publication Number Publication Date
CN118974917A true CN118974917A (zh) 2024-11-15

Family

ID=90830593

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380031428.XA Pending CN118974917A (zh) 2022-10-25 2023-08-31 半导体模块、半导体装置以及车辆

Country Status (4)

Country Link
US (1) US20250022833A1 (https=)
JP (1) JP7827161B2 (https=)
CN (1) CN118974917A (https=)
WO (1) WO2024090029A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7091602B2 (en) * 2002-12-13 2006-08-15 Freescale Semiconductor, Inc. Miniature moldlocks for heatsink or flag for an overmolded plastic package
JP4739111B2 (ja) * 2006-05-15 2011-08-03 ローム株式会社 リードフレームの製造方法および製造装置
JP2008211168A (ja) * 2007-01-31 2008-09-11 Mitsubishi Electric Corp 半導体装置および半導体モジュール
JP5833459B2 (ja) * 2012-01-31 2015-12-16 新光電気工業株式会社 リードフレーム及びその製造方法と半導体装置及びその製造方法
JP2017208486A (ja) * 2016-05-19 2017-11-24 株式会社ミスズ工業 表面に凹凸を有する金属部材、ヒートスプレッダ、半導体パッケージ及びそれらの製造方法
CN114787991A (zh) * 2020-06-30 2022-07-22 富士电机株式会社 半导体模块以及半导体模块的制造方法

Also Published As

Publication number Publication date
WO2024090029A1 (ja) 2024-05-02
JPWO2024090029A1 (https=) 2024-05-02
US20250022833A1 (en) 2025-01-16
JP7827161B2 (ja) 2026-03-10

Similar Documents

Publication Publication Date Title
CN111584477A (zh) 半导体模块和半导体模块的制造方法
US12074090B2 (en) Semiconductor apparatus
JP7568132B2 (ja) 半導体モジュール及び半導体装置
CN111341731A (zh) 半导体装置
CN112670262A (zh) 半导体模块
CN111354710B (zh) 半导体装置及其制造方法
EP4214749B1 (en) Power module and method for producing a power module
CN115206919A (zh) 半导体装置
JP2015023226A (ja) ワイドギャップ半導体装置
US20260101768A1 (en) Base Plate for a Semiconductor Module Arrangement and Method for Producing a Base Plate
JP2003197858A (ja) 電力半導体装置及びその製造方法
EP3739624A1 (en) Semiconductor arrangement with a compressible contact element encapsulated between two carriers and corresponding manufacturing method
US20240021569A1 (en) Semiconductor module and method for manufacturing semiconductor module
JP2020072101A (ja) パワーユニット、パワーユニットの製造方法、パワーユニットを有する電気装置及びヒートシンク
CN118974917A (zh) 半导体模块、半导体装置以及车辆
US12412847B2 (en) Semiconductor module, semiconductor device and vehicle
CN115206905A (zh) 半导体装置和使用该半导体装置的半导体模块
US20250022832A1 (en) Semiconductor module, semiconductor device, and vehicle
US20250062271A1 (en) Semiconductor module and method for manufacturing semiconductor module
US20240136319A1 (en) Semiconductor module, semiconductor device, and vehicle
US20250062272A1 (en) Semiconductor module
US20250054897A1 (en) Semiconductor module
JP2023118481A (ja) 半導体装置及び車両
JP2023118480A (ja) 半導体装置及び車両
WO2023119837A1 (ja) 半導体モジュール、半導体装置、及び車両

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination