JP7799249B2 - 保存安定性に優れた研磨用組成物及びその製造方法 - Google Patents

保存安定性に優れた研磨用組成物及びその製造方法

Info

Publication number
JP7799249B2
JP7799249B2 JP2025520178A JP2025520178A JP7799249B2 JP 7799249 B2 JP7799249 B2 JP 7799249B2 JP 2025520178 A JP2025520178 A JP 2025520178A JP 2025520178 A JP2025520178 A JP 2025520178A JP 7799249 B2 JP7799249 B2 JP 7799249B2
Authority
JP
Japan
Prior art keywords
silica
polishing composition
dispersion
silica particle
exchange resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025520178A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025070705A1 (https=
Inventor
響 石島
結女 海老原
滋 三井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2023/035232 external-priority patent/WO2025069272A1/ja
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of JPWO2025070705A1 publication Critical patent/JPWO2025070705A1/ja
Application granted granted Critical
Publication of JP7799249B2 publication Critical patent/JP7799249B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2025520178A 2023-09-27 2024-09-27 保存安定性に優れた研磨用組成物及びその製造方法 Active JP7799249B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPPCT/JP2023/035232 2023-09-27
PCT/JP2023/035232 WO2025069272A1 (ja) 2023-09-27 2023-09-27 保存安定性に優れた研磨用組成物及びその製造方法
PCT/JP2024/019443 WO2025069562A1 (ja) 2023-09-27 2024-05-27 保存安定性に優れた研磨用組成物及びその製造方法
JPPCT/JP2024/019443 2024-05-27
PCT/JP2024/034606 WO2025070705A1 (ja) 2023-09-27 2024-09-27 保存安定性に優れた研磨用組成物及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2025070705A1 JPWO2025070705A1 (https=) 2025-04-03
JP7799249B2 true JP7799249B2 (ja) 2026-01-15

Family

ID=95201693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025520178A Active JP7799249B2 (ja) 2023-09-27 2024-09-27 保存安定性に優れた研磨用組成物及びその製造方法

Country Status (5)

Country Link
US (1) US20260117105A1 (https=)
JP (1) JP7799249B2 (https=)
KR (1) KR20250111242A (https=)
CN (1) CN121285611A (https=)
WO (1) WO2025070705A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017117894A (ja) 2015-12-22 2017-06-29 日立化成株式会社 研磨液、研磨方法、半導体基板及び電子機器
WO2018012174A1 (ja) 2016-07-15 2018-01-18 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法および研磨方法
WO2018116890A1 (ja) 2016-12-22 2018-06-28 ニッタ・ハース株式会社 研磨用組成物
WO2018124229A1 (ja) 2016-12-28 2018-07-05 ニッタ・ハース株式会社 研磨用組成物及び研磨方法
WO2020091000A1 (ja) 2018-11-01 2020-05-07 日産化学株式会社 水親和性の高い研磨粒子を用いた研磨用組成物
WO2020262628A1 (ja) 2019-06-27 2020-12-30 日産化学株式会社 塩基性物質を含有する水親和性の高い研磨粒子を用いた研磨用組成物
WO2023119549A1 (ja) 2021-12-23 2023-06-29 扶桑化学工業株式会社 コロイダルシリカ及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6506913B2 (ja) 2014-03-31 2019-04-24 ニッタ・ハース株式会社 研磨用組成物及び研磨方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017117894A (ja) 2015-12-22 2017-06-29 日立化成株式会社 研磨液、研磨方法、半導体基板及び電子機器
WO2018012174A1 (ja) 2016-07-15 2018-01-18 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法および研磨方法
WO2018116890A1 (ja) 2016-12-22 2018-06-28 ニッタ・ハース株式会社 研磨用組成物
WO2018124229A1 (ja) 2016-12-28 2018-07-05 ニッタ・ハース株式会社 研磨用組成物及び研磨方法
WO2020091000A1 (ja) 2018-11-01 2020-05-07 日産化学株式会社 水親和性の高い研磨粒子を用いた研磨用組成物
WO2020262628A1 (ja) 2019-06-27 2020-12-30 日産化学株式会社 塩基性物質を含有する水親和性の高い研磨粒子を用いた研磨用組成物
WO2023119549A1 (ja) 2021-12-23 2023-06-29 扶桑化学工業株式会社 コロイダルシリカ及びその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
MACKAY, R. et al.，Colloids and Surfaces A: Physicochem. Eng. Aspects，2004年，250，pp.343-348

Also Published As

Publication number Publication date
JPWO2025070705A1 (https=) 2025-04-03
US20260117105A1 (en) 2026-04-30
CN121285611A (zh) 2026-01-06
KR20250111242A (ko) 2025-07-22
WO2025070705A1 (ja) 2025-04-03
TW202523816A (zh) 2025-06-16

Similar Documents

Publication Publication Date Title
JP6520711B2 (ja) スラリー、研磨液セット、研磨液及び基体の研磨方法
US12227674B2 (en) Polishing composition comprising polishing particles having high water affinity
JP6482234B2 (ja) 研磨用組成物
JP7213234B2 (ja) シリカ粒子分散液、研磨組成物及びシリカ粒子分散液の製造方法
CN114026195A (zh) 含有碱性物质的使用了亲水性高的研磨粒子的研磨用组合物
JP6589622B2 (ja) 研磨液、研磨方法、半導体基板及び電子機器
TWI804488B (zh) 研磨劑、研磨劑用儲存液及研磨方法
JP2018012752A (ja) 研磨剤、研磨剤用貯蔵液及び研磨方法
JP7799249B2 (ja) 保存安定性に優れた研磨用組成物及びその製造方法
WO2011016323A1 (ja) 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法
TWI920750B (zh) 研磨用組成物及其製造方法
WO2025069562A1 (ja) 保存安定性に優れた研磨用組成物及びその製造方法
JP2010024119A (ja) 金平糖状シリカゾルの製造方法
JP7487507B2 (ja) 研磨剤及び研磨方法
JP2015189828A (ja) 研磨用組成物
JP6436638B2 (ja) 研磨用組成物
WO2025244080A1 (ja) シリカ粒子と塩基性アルミニウム塩水溶液とを含む分散液、及び研磨用組成物
JP2023108405A (ja) 有機無機複合微粒子分散液およびその製造方法、並びに砥粒分散液
JP2024109110A (ja) シリカゾルの製造方法、シリカゾル製造容器、研磨組成物の製造方法、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法
TW202605088A (zh) 含矽石粒子與鹼性鋁鹽水溶液之分散液，及研磨用組成物

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250408

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20250408

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250716

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250908

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251113

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251126

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251209

R150 Certificate of patent or registration of utility model

Ref document number: 7799249

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150