KR20250111242A - 보존안정성이 우수한 연마용 조성물 및 그의 제조방법 - Google Patents

보존안정성이 우수한 연마용 조성물 및 그의 제조방법

Info

Publication number
KR20250111242A
KR20250111242A KR1020257023315A KR20257023315A KR20250111242A KR 20250111242 A KR20250111242 A KR 20250111242A KR 1020257023315 A KR1020257023315 A KR 1020257023315A KR 20257023315 A KR20257023315 A KR 20257023315A KR 20250111242 A KR20250111242 A KR 20250111242A
Authority
KR
South Korea
Prior art keywords
silica
dispersion
polishing composition
silica particle
exchange resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257023315A
Other languages
English (en)
Korean (ko)
Inventor
히비키 이시지마
유메 에비하라
시게루 미츠이
Original Assignee
닛산 가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2023/035232 external-priority patent/WO2025069272A1/ja
Application filed by 닛산 가가쿠 가부시키가이샤 filed Critical 닛산 가가쿠 가부시키가이샤
Publication of KR20250111242A publication Critical patent/KR20250111242A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020257023315A 2023-09-27 2024-09-27 보존안정성이 우수한 연마용 조성물 및 그의 제조방법 Pending KR20250111242A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPPCT/JP2023/035232 2023-09-27
PCT/JP2023/035232 WO2025069272A1 (ja) 2023-09-27 2023-09-27 保存安定性に優れた研磨用組成物及びその製造方法
PCT/JP2024/019443 WO2025069562A1 (ja) 2023-09-27 2024-05-27 保存安定性に優れた研磨用組成物及びその製造方法
JPPCT/JP2024/019443 2024-05-27
PCT/JP2024/034606 WO2025070705A1 (ja) 2023-09-27 2024-09-27 保存安定性に優れた研磨用組成物及びその製造方法

Publications (1)

Publication Number Publication Date
KR20250111242A true KR20250111242A (ko) 2025-07-22

Family

ID=95201693

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257023315A Pending KR20250111242A (ko) 2023-09-27 2024-09-27 보존안정성이 우수한 연마용 조성물 및 그의 제조방법

Country Status (5)

Country Link
US (1) US20260117105A1 (https=)
JP (1) JP7799249B2 (https=)
KR (1) KR20250111242A (https=)
CN (1) CN121285611A (https=)
WO (1) WO2025070705A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015152151A1 (ja) 2014-03-31 2015-10-08 ニッタ・ハース株式会社 研磨用組成物及び研磨方法
JP2017117894A (ja) 2015-12-22 2017-06-29 日立化成株式会社 研磨液、研磨方法、半導体基板及び電子機器
WO2018012174A1 (ja) 2016-07-15 2018-01-18 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法および研磨方法
WO2018116890A1 (ja) 2016-12-22 2018-06-28 ニッタ・ハース株式会社 研磨用組成物
WO2020091000A1 (ja) 2018-11-01 2020-05-07 日産化学株式会社 水親和性の高い研磨粒子を用いた研磨用組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102508180B1 (ko) * 2016-12-28 2023-03-09 니타 듀퐁 가부시키가이샤 연마용 조성물 및 연마 방법
JPWO2020262628A1 (https=) * 2019-06-27 2020-12-30
KR20240130728A (ko) * 2021-12-23 2024-08-29 후소카가쿠코교 가부시키가이샤 콜로이달실리카 및 그 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015152151A1 (ja) 2014-03-31 2015-10-08 ニッタ・ハース株式会社 研磨用組成物及び研磨方法
JP2017117894A (ja) 2015-12-22 2017-06-29 日立化成株式会社 研磨液、研磨方法、半導体基板及び電子機器
WO2018012174A1 (ja) 2016-07-15 2018-01-18 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法および研磨方法
WO2018116890A1 (ja) 2016-12-22 2018-06-28 ニッタ・ハース株式会社 研磨用組成物
WO2020091000A1 (ja) 2018-11-01 2020-05-07 日産化学株式会社 水親和性の高い研磨粒子を用いた研磨用組成物

Also Published As

Publication number Publication date
JPWO2025070705A1 (https=) 2025-04-03
US20260117105A1 (en) 2026-04-30
CN121285611A (zh) 2026-01-06
JP7799249B2 (ja) 2026-01-15
WO2025070705A1 (ja) 2025-04-03
TW202523816A (zh) 2025-06-16

Similar Documents

Publication Publication Date Title
JP6520711B2 (ja) スラリー、研磨液セット、研磨液及び基体の研磨方法
EP1190006B1 (en) Slurry composition and method of chemical mechanical polishing using same
US12227674B2 (en) Polishing composition comprising polishing particles having high water affinity
EP2260013B1 (en) Ceria material and method of forming same
CN114026195A (zh) 含有碱性物质的使用了亲水性高的研磨粒子的研磨用组合物
TW200806781A (en) Fluoride-modified silica sols for chemical mechanical planarization
TW201412888A (zh) 聚吡咯啶酮拋光組合物及其使用方法
JP2018012752A (ja) 研磨剤、研磨剤用貯蔵液及び研磨方法
JP7044704B2 (ja) 研磨用組成物、研磨用組成物の製造方法および研磨方法
WO2018168534A1 (ja) 研磨剤、研磨剤用貯蔵液及び研磨方法
JP7799249B2 (ja) 保存安定性に優れた研磨用組成物及びその製造方法
TWI920750B (zh) 研磨用組成物及其製造方法
WO2025069562A1 (ja) 保存安定性に優れた研磨用組成物及びその製造方法
KR20130121721A (ko) 슬러리, 연마액 세트, 연마액, 기체의 연마 방법 및 기체
TWI692510B (zh) 用於拋光記憶體硬碟以展現減少之表面刮痕之組合物及方法
WO2025244080A1 (ja) シリカ粒子と塩基性アルミニウム塩水溶液とを含む分散液、及び研磨用組成物
US20190322899A1 (en) Cerium oxide abrasive grains
US20260098196A1 (en) Chemical-mechanical polishing composition for silver polishing
TW202605088A (zh) 含矽石粒子與鹼性鋁鹽水溶液之分散液，及研磨用組成物

Legal Events

Date Code Title Description
D11 Substantive examination requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D11-EXM-PA0201 (AS PROVIDED BY THE NATIONAL OFFICE)

D16 Fast track examination requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D16-EXM-PA0302 (AS PROVIDED BY THE NATIONAL OFFICE)

D17 Fast track examination accepted

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D17-EXM-PA0302 (AS PROVIDED BY THE NATIONAL OFFICE)

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000