JP7798193B2 - 多層基板 - Google Patents

多層基板

Info

Publication number
JP7798193B2
JP7798193B2 JP2024526298A JP2024526298A JP7798193B2 JP 7798193 B2 JP7798193 B2 JP 7798193B2 JP 2024526298 A JP2024526298 A JP 2024526298A JP 2024526298 A JP2024526298 A JP 2024526298A JP 7798193 B2 JP7798193 B2 JP 7798193B2
Authority
JP
Japan
Prior art keywords
region
multilayer substrate
conductor layers
conductor
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024526298A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023238562A1 (https=
JPWO2023238562A5 (https=
Inventor
伸郎 池本
敬一 市川
健太朗 川辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023238562A1 publication Critical patent/JPWO2023238562A1/ja
Publication of JPWO2023238562A5 publication Critical patent/JPWO2023238562A5/ja
Application granted granted Critical
Publication of JP7798193B2 publication Critical patent/JP7798193B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/03—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers with respect to the orientation of features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2398/00—Unspecified macromolecular compounds
    • B32B2398/20—Thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2024526298A 2022-06-09 2023-05-06 多層基板 Active JP7798193B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022093630 2022-06-09
JP2022093630 2022-06-09
PCT/JP2023/017214 WO2023238562A1 (ja) 2022-06-09 2023-05-06 多層基板

Publications (3)

Publication Number Publication Date
JPWO2023238562A1 JPWO2023238562A1 (https=) 2023-12-14
JPWO2023238562A5 JPWO2023238562A5 (https=) 2024-11-19
JP7798193B2 true JP7798193B2 (ja) 2026-01-14

Family

ID=89118100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024526298A Active JP7798193B2 (ja) 2022-06-09 2023-05-06 多層基板

Country Status (4)

Country Link
US (1) US20250010577A1 (https=)
JP (1) JP7798193B2 (https=)
CN (1) CN223093990U (https=)
WO (1) WO2023238562A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002171036A (ja) 2000-12-04 2002-06-14 Olympus Optical Co Ltd 多層基板
JP2006344828A (ja) 2005-06-09 2006-12-21 Denso Corp 多層基板及びその製造方法
WO2014115433A1 (ja) 2013-01-22 2014-07-31 株式会社村田製作所 コイル部品および電子機器
JP2014207346A (ja) 2013-04-15 2014-10-30 株式会社村田製作所 多層配線基板およびこれを備えるモジュール

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6673304B2 (ja) * 2017-07-21 2020-03-25 株式会社村田製作所 多層基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002171036A (ja) 2000-12-04 2002-06-14 Olympus Optical Co Ltd 多層基板
JP2006344828A (ja) 2005-06-09 2006-12-21 Denso Corp 多層基板及びその製造方法
WO2014115433A1 (ja) 2013-01-22 2014-07-31 株式会社村田製作所 コイル部品および電子機器
JP2014207346A (ja) 2013-04-15 2014-10-30 株式会社村田製作所 多層配線基板およびこれを備えるモジュール

Also Published As

Publication number Publication date
CN223093990U (zh) 2025-07-11
WO2023238562A1 (ja) 2023-12-14
US20250010577A1 (en) 2025-01-09
JPWO2023238562A1 (https=) 2023-12-14

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