JPWO2023238562A1 - - Google Patents

Info

Publication number
JPWO2023238562A1
JPWO2023238562A1 JP2024526298A JP2024526298A JPWO2023238562A1 JP WO2023238562 A1 JPWO2023238562 A1 JP WO2023238562A1 JP 2024526298 A JP2024526298 A JP 2024526298A JP 2024526298 A JP2024526298 A JP 2024526298A JP WO2023238562 A1 JPWO2023238562 A1 JP WO2023238562A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024526298A
Other languages
Japanese (ja)
Other versions
JP7798193B2 (ja
JPWO2023238562A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023238562A1 publication Critical patent/JPWO2023238562A1/ja
Publication of JPWO2023238562A5 publication Critical patent/JPWO2023238562A5/ja
Application granted granted Critical
Publication of JP7798193B2 publication Critical patent/JP7798193B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/03—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers with respect to the orientation of features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2398/00—Unspecified macromolecular compounds
    • B32B2398/20—Thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2024526298A 2022-06-09 2023-05-06 多層基板 Active JP7798193B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022093630 2022-06-09
JP2022093630 2022-06-09
PCT/JP2023/017214 WO2023238562A1 (ja) 2022-06-09 2023-05-06 多層基板

Publications (3)

Publication Number Publication Date
JPWO2023238562A1 true JPWO2023238562A1 (https=) 2023-12-14
JPWO2023238562A5 JPWO2023238562A5 (https=) 2024-11-19
JP7798193B2 JP7798193B2 (ja) 2026-01-14

Family

ID=89118100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024526298A Active JP7798193B2 (ja) 2022-06-09 2023-05-06 多層基板

Country Status (4)

Country Link
US (1) US20250010577A1 (https=)
JP (1) JP7798193B2 (https=)
CN (1) CN223093990U (https=)
WO (1) WO2023238562A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002171036A (ja) * 2000-12-04 2002-06-14 Olympus Optical Co Ltd 多層基板
JP2006344828A (ja) * 2005-06-09 2006-12-21 Denso Corp 多層基板及びその製造方法
WO2014115433A1 (ja) * 2013-01-22 2014-07-31 株式会社村田製作所 コイル部品および電子機器
JP2014207346A (ja) * 2013-04-15 2014-10-30 株式会社村田製作所 多層配線基板およびこれを備えるモジュール
JP2019021863A (ja) * 2017-07-21 2019-02-07 株式会社村田製作所 多層基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002171036A (ja) * 2000-12-04 2002-06-14 Olympus Optical Co Ltd 多層基板
JP2006344828A (ja) * 2005-06-09 2006-12-21 Denso Corp 多層基板及びその製造方法
WO2014115433A1 (ja) * 2013-01-22 2014-07-31 株式会社村田製作所 コイル部品および電子機器
JP2014207346A (ja) * 2013-04-15 2014-10-30 株式会社村田製作所 多層配線基板およびこれを備えるモジュール
JP2019021863A (ja) * 2017-07-21 2019-02-07 株式会社村田製作所 多層基板

Also Published As

Publication number Publication date
CN223093990U (zh) 2025-07-11
WO2023238562A1 (ja) 2023-12-14
US20250010577A1 (en) 2025-01-09
JP7798193B2 (ja) 2026-01-14

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