JP7795884B2 - 基板洗浄装置、基板洗浄方法及び基板研磨装置 - Google Patents

基板洗浄装置、基板洗浄方法及び基板研磨装置

Info

Publication number
JP7795884B2
JP7795884B2 JP2021134075A JP2021134075A JP7795884B2 JP 7795884 B2 JP7795884 B2 JP 7795884B2 JP 2021134075 A JP2021134075 A JP 2021134075A JP 2021134075 A JP2021134075 A JP 2021134075A JP 7795884 B2 JP7795884 B2 JP 7795884B2
Authority
JP
Japan
Prior art keywords
substrate
cleaning liquid
cleaning
supply unit
liquid supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021134075A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023028395A5 (https=
JP2023028395A (ja
Inventor
直廉 半田
聡美 ▲浜▼田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2021134075A priority Critical patent/JP7795884B2/ja
Priority to US18/683,735 priority patent/US20240351078A1/en
Priority to PCT/JP2022/031289 priority patent/WO2023022210A1/ja
Publication of JP2023028395A publication Critical patent/JP2023028395A/ja
Publication of JP2023028395A5 publication Critical patent/JP2023028395A5/ja
Application granted granted Critical
Publication of JP7795884B2 publication Critical patent/JP7795884B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2021134075A 2021-08-19 2021-08-19 基板洗浄装置、基板洗浄方法及び基板研磨装置 Active JP7795884B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021134075A JP7795884B2 (ja) 2021-08-19 2021-08-19 基板洗浄装置、基板洗浄方法及び基板研磨装置
US18/683,735 US20240351078A1 (en) 2021-08-19 2022-08-19 Substrate cleaning device, substrate cleaning method, and substrate polishing apparatus
PCT/JP2022/031289 WO2023022210A1 (ja) 2021-08-19 2022-08-19 基板洗浄装置、基板洗浄方法及び基板研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021134075A JP7795884B2 (ja) 2021-08-19 2021-08-19 基板洗浄装置、基板洗浄方法及び基板研磨装置

Publications (3)

Publication Number Publication Date
JP2023028395A JP2023028395A (ja) 2023-03-03
JP2023028395A5 JP2023028395A5 (https=) 2024-08-23
JP7795884B2 true JP7795884B2 (ja) 2026-01-08

Family

ID=85240594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021134075A Active JP7795884B2 (ja) 2021-08-19 2021-08-19 基板洗浄装置、基板洗浄方法及び基板研磨装置

Country Status (3)

Country Link
US (1) US20240351078A1 (https=)
JP (1) JP7795884B2 (https=)
WO (1) WO2023022210A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025171626A (ja) * 2024-05-10 2025-11-20 株式会社荏原製作所 基板洗浄方法、基板洗浄装置、基板洗浄プログラムおよび基板処理装置
CN118983637B (zh) * 2024-08-05 2025-05-06 途趣(惠州)技术服务有限公司 一种分体式车载智能终端

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237389A (ja) 2000-02-24 2001-08-31 Nec Corp 半導体装置の製造方法
JP2002203830A (ja) 2000-10-20 2002-07-19 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2009260034A (ja) 2008-04-16 2009-11-05 Sokudo Co Ltd 基板乾燥装置およびそれを備えた基板処理装置
JP2015201627A (ja) 2014-04-01 2015-11-12 株式会社荏原製作所 洗浄装置及び洗浄方法
JP2018056385A (ja) 2016-09-29 2018-04-05 株式会社荏原製作所 基板洗浄装置および基板洗浄方法ならびに基板洗浄装置用のロールスポンジ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237389A (ja) 2000-02-24 2001-08-31 Nec Corp 半導体装置の製造方法
JP2002203830A (ja) 2000-10-20 2002-07-19 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2009260034A (ja) 2008-04-16 2009-11-05 Sokudo Co Ltd 基板乾燥装置およびそれを備えた基板処理装置
JP2015201627A (ja) 2014-04-01 2015-11-12 株式会社荏原製作所 洗浄装置及び洗浄方法
JP2018056385A (ja) 2016-09-29 2018-04-05 株式会社荏原製作所 基板洗浄装置および基板洗浄方法ならびに基板洗浄装置用のロールスポンジ

Also Published As

Publication number Publication date
US20240351078A1 (en) 2024-10-24
WO2023022210A1 (ja) 2023-02-23
JP2023028395A (ja) 2023-03-03

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