JP2023028395A5 - - Google Patents

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Publication number
JP2023028395A5
JP2023028395A5 JP2021134075A JP2021134075A JP2023028395A5 JP 2023028395 A5 JP2023028395 A5 JP 2023028395A5 JP 2021134075 A JP2021134075 A JP 2021134075A JP 2021134075 A JP2021134075 A JP 2021134075A JP 2023028395 A5 JP2023028395 A5 JP 2023028395A5
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JP
Japan
Prior art keywords
substrate
cleaning
cleaning liquid
supply unit
spray angle
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Application number
JP2021134075A
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English (en)
Japanese (ja)
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JP7795884B2 (ja
JP2023028395A (ja
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Priority to JP2021134075A priority Critical patent/JP7795884B2/ja
Priority claimed from JP2021134075A external-priority patent/JP7795884B2/ja
Priority to US18/683,735 priority patent/US20240351078A1/en
Priority to PCT/JP2022/031289 priority patent/WO2023022210A1/ja
Publication of JP2023028395A publication Critical patent/JP2023028395A/ja
Publication of JP2023028395A5 publication Critical patent/JP2023028395A5/ja
Application granted granted Critical
Publication of JP7795884B2 publication Critical patent/JP7795884B2/ja
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JP2021134075A 2021-08-19 2021-08-19 基板洗浄装置、基板洗浄方法及び基板研磨装置 Active JP7795884B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021134075A JP7795884B2 (ja) 2021-08-19 2021-08-19 基板洗浄装置、基板洗浄方法及び基板研磨装置
US18/683,735 US20240351078A1 (en) 2021-08-19 2022-08-19 Substrate cleaning device, substrate cleaning method, and substrate polishing apparatus
PCT/JP2022/031289 WO2023022210A1 (ja) 2021-08-19 2022-08-19 基板洗浄装置、基板洗浄方法及び基板研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021134075A JP7795884B2 (ja) 2021-08-19 2021-08-19 基板洗浄装置、基板洗浄方法及び基板研磨装置

Publications (3)

Publication Number Publication Date
JP2023028395A JP2023028395A (ja) 2023-03-03
JP2023028395A5 true JP2023028395A5 (https=) 2024-08-23
JP7795884B2 JP7795884B2 (ja) 2026-01-08

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JP2021134075A Active JP7795884B2 (ja) 2021-08-19 2021-08-19 基板洗浄装置、基板洗浄方法及び基板研磨装置

Country Status (3)

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US (1) US20240351078A1 (https=)
JP (1) JP7795884B2 (https=)
WO (1) WO2023022210A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025171626A (ja) * 2024-05-10 2025-11-20 株式会社荏原製作所 基板洗浄方法、基板洗浄装置、基板洗浄プログラムおよび基板処理装置
CN118983637B (zh) * 2024-08-05 2025-05-06 途趣(惠州)技术服务有限公司 一种分体式车载智能终端

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3645144B2 (ja) 2000-02-24 2005-05-11 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
JP2002203830A (ja) 2000-10-20 2002-07-19 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP5522903B2 (ja) 2008-04-16 2014-06-18 株式会社Ｓｏｋｕｄｏ 基板乾燥装置およびそれを備えた基板処理装置
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
JP2018056385A (ja) 2016-09-29 2018-04-05 株式会社荏原製作所 基板洗浄装置および基板洗浄方法ならびに基板洗浄装置用のロールスポンジ

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