JP7783198B2 - アキシャルフィーダ、及びアキシャルリード部品を保持する方法 - Google Patents

アキシャルフィーダ、及びアキシャルリード部品を保持する方法

Info

Publication number
JP7783198B2
JP7783198B2 JP2022573830A JP2022573830A JP7783198B2 JP 7783198 B2 JP7783198 B2 JP 7783198B2 JP 2022573830 A JP2022573830 A JP 2022573830A JP 2022573830 A JP2022573830 A JP 2022573830A JP 7783198 B2 JP7783198 B2 JP 7783198B2
Authority
JP
Japan
Prior art keywords
pair
leads
component
axial lead
lead component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022573830A
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English (en)
Japanese (ja)
Other versions
JPWO2022149204A1 (https=
Inventor
茂雄 斉藤
英樹 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPWO2022149204A1 publication Critical patent/JPWO2022149204A1/ja
Application granted granted Critical
Publication of JP7783198B2 publication Critical patent/JP7783198B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022573830A 2021-01-06 2021-01-06 アキシャルフィーダ、及びアキシャルリード部品を保持する方法 Active JP7783198B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/000176 WO2022149204A1 (ja) 2021-01-06 2021-01-06 アキシャルフィーダ、及びアキシャルリード部品を保持する方法

Publications (2)

Publication Number Publication Date
JPWO2022149204A1 JPWO2022149204A1 (https=) 2022-07-14
JP7783198B2 true JP7783198B2 (ja) 2025-12-09

Family

ID=82358170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022573830A Active JP7783198B2 (ja) 2021-01-06 2021-01-06 アキシャルフィーダ、及びアキシャルリード部品を保持する方法

Country Status (2)

Country Link
JP (1) JP7783198B2 (https=)
WO (1) WO2022149204A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020064906A (ja) 2018-10-15 2020-04-23 パナソニックＩｐマネジメント株式会社 部品装着装置、及び、部品装着方法
WO2020183535A1 (ja) 2019-03-08 2020-09-17 株式会社Ｆｕｊｉ 屈曲装置、部品供給装置、及び屈曲方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6090641A (ja) * 1983-10-21 1985-05-21 Nichiden Mach Ltd Ｉｃ插入用ロボツトハンド
JP3198619B2 (ja) * 1992-06-05 2001-08-13 松下電器産業株式会社 電子部品挿入方法及びその装置
JPH07170099A (ja) * 1993-12-14 1995-07-04 Matsushita Electric Ind Co Ltd 電子部品挿入方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020064906A (ja) 2018-10-15 2020-04-23 パナソニックＩｐマネジメント株式会社 部品装着装置、及び、部品装着方法
WO2020183535A1 (ja) 2019-03-08 2020-09-17 株式会社Ｆｕｊｉ 屈曲装置、部品供給装置、及び屈曲方法

Also Published As

Publication number Publication date
JPWO2022149204A1 (https=) 2022-07-14
WO2022149204A1 (ja) 2022-07-14

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