JP7773645B2 - 電子制御装置、及び、電子制御装置の製造方法 - Google Patents

電子制御装置、及び、電子制御装置の製造方法

Info

Publication number
JP7773645B2
JP7773645B2 JP2024531885A JP2024531885A JP7773645B2 JP 7773645 B2 JP7773645 B2 JP 7773645B2 JP 2024531885 A JP2024531885 A JP 2024531885A JP 2024531885 A JP2024531885 A JP 2024531885A JP 7773645 B2 JP7773645 B2 JP 7773645B2
Authority
JP
Japan
Prior art keywords
electromagnetic wave
wave shielding
circuit board
base
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024531885A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024009500A1 (https=
Inventor
雄亮 高橋
尭之 福沢
義夫 河合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Astemo Ltd filed Critical Astemo Ltd
Publication of JPWO2024009500A1 publication Critical patent/JPWO2024009500A1/ja
Application granted granted Critical
Publication of JP7773645B2 publication Critical patent/JP7773645B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0049—Casings being metallic containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2024531885A 2022-07-08 2022-07-08 電子制御装置、及び、電子制御装置の製造方法 Active JP7773645B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/027108 WO2024009500A1 (ja) 2022-07-08 2022-07-08 電子制御装置、及び、電子制御装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024009500A1 JPWO2024009500A1 (https=) 2024-01-11
JP7773645B2 true JP7773645B2 (ja) 2025-11-19

Family

ID=89453140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024531885A Active JP7773645B2 (ja) 2022-07-08 2022-07-08 電子制御装置、及び、電子制御装置の製造方法

Country Status (5)

Country Link
US (1) US20250365908A1 (https=)
JP (1) JP7773645B2 (https=)
CN (1) CN119366276A (https=)
DE (1) DE112022007073T5 (https=)
WO (1) WO2024009500A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044646A (ja) 1999-07-28 2001-02-16 Hitachi Denshi Ltd プリント配線基板実装用筐体
JP2001111283A (ja) 1999-10-08 2001-04-20 Three Bond Co Ltd 電磁波シールド構造及び電磁波シールド方法
JP2005045810A (ja) 2003-07-23 2005-02-17 Lg Electronics Inc 内蔵型アンテナ及びその内蔵型アンテナを具備した携帯端末機
JP2010267927A (ja) 2009-05-18 2010-11-25 Denso Corp 電子装置
JP2018148026A (ja) 2017-03-06 2018-09-20 株式会社ソニー・インタラクティブエンタテインメント 電子機器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4340108C3 (de) * 1993-11-22 2003-08-14 Emi Tec Elektronische Material Abschirmelement und Verfahren zu dessen Herstellung
JPH08222877A (ja) * 1995-02-16 1996-08-30 Oki Electric Ind Co Ltd シールドカバー取付構造
JP2898603B2 (ja) * 1996-07-02 1999-06-02 三菱電機株式会社 回路基板用シールド機構
JP6497477B1 (ja) 2018-10-03 2019-04-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電子部品搭載基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044646A (ja) 1999-07-28 2001-02-16 Hitachi Denshi Ltd プリント配線基板実装用筐体
JP2001111283A (ja) 1999-10-08 2001-04-20 Three Bond Co Ltd 電磁波シールド構造及び電磁波シールド方法
JP2005045810A (ja) 2003-07-23 2005-02-17 Lg Electronics Inc 内蔵型アンテナ及びその内蔵型アンテナを具備した携帯端末機
JP2010267927A (ja) 2009-05-18 2010-11-25 Denso Corp 電子装置
JP2018148026A (ja) 2017-03-06 2018-09-20 株式会社ソニー・インタラクティブエンタテインメント 電子機器

Also Published As

Publication number Publication date
CN119366276A (zh) 2025-01-24
JPWO2024009500A1 (https=) 2024-01-11
WO2024009500A1 (ja) 2024-01-11
DE112022007073T5 (de) 2025-02-20
US20250365908A1 (en) 2025-11-27

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