JP7769804B2 - インターポーザおよびインターポーザの製造方法 - Google Patents

インターポーザおよびインターポーザの製造方法

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Publication number
JP7769804B2
JP7769804B2 JP2024536717A JP2024536717A JP7769804B2 JP 7769804 B2 JP7769804 B2 JP 7769804B2 JP 2024536717 A JP2024536717 A JP 2024536717A JP 2024536717 A JP2024536717 A JP 2024536717A JP 7769804 B2 JP7769804 B2 JP 7769804B2
Authority
JP
Japan
Prior art keywords
interposer
compact
magnetic material
conductor portion
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024536717A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024024069A1 (https=
JPWO2024024069A5 (https=
Inventor
芳嗣 若園
信 谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2024024069A1 publication Critical patent/JPWO2024024069A1/ja
Publication of JPWO2024024069A5 publication Critical patent/JPWO2024024069A5/ja
Application granted granted Critical
Publication of JP7769804B2 publication Critical patent/JP7769804B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2024536717A 2022-07-29 2022-07-29 インターポーザおよびインターポーザの製造方法 Active JP7769804B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/029224 WO2024024069A1 (ja) 2022-07-29 2022-07-29 インターポーザおよびインターポーザの製造方法

Publications (3)

Publication Number Publication Date
JPWO2024024069A1 JPWO2024024069A1 (https=) 2024-02-01
JPWO2024024069A5 JPWO2024024069A5 (https=) 2025-01-31
JP7769804B2 true JP7769804B2 (ja) 2025-11-13

Family

ID=89705828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024536717A Active JP7769804B2 (ja) 2022-07-29 2022-07-29 インターポーザおよびインターポーザの製造方法

Country Status (3)

Country Link
US (1) US20250157905A1 (https=)
JP (1) JP7769804B2 (https=)
WO (1) WO2024024069A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011058945A1 (ja) 2009-11-11 2011-05-19 株式会社村田製作所 積層セラミック電子部品
US20130285256A1 (en) 2010-11-22 2013-10-31 Andreas Fischer Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
JP2014143312A (ja) 2013-01-24 2014-08-07 Napura:Kk 受動素子内蔵基板
JP2017157792A (ja) 2016-03-04 2017-09-07 イビデン株式会社 電子部品内蔵基板及びその製造方法
WO2018139046A1 (ja) 2017-01-27 2018-08-02 株式会社村田製作所 インターポーザ基板、回路モジュール、インターポーザ基板の製造方法
JP2021061264A (ja) 2019-10-02 2021-04-15 味の素株式会社 インダクタ機能を有する配線基板及びその製造方法
JP2021061387A (ja) 2019-10-08 2021-04-15 インテル コーポレイション 予め製造されたフェライトコアを有する同軸磁性インダクタ
JP2021086856A (ja) 2019-11-25 2021-06-03 イビデン株式会社 インダクタ内蔵基板、インダクタ内蔵基板の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011058945A1 (ja) 2009-11-11 2011-05-19 株式会社村田製作所 積層セラミック電子部品
US20130285256A1 (en) 2010-11-22 2013-10-31 Andreas Fischer Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
JP2014143312A (ja) 2013-01-24 2014-08-07 Napura:Kk 受動素子内蔵基板
JP2017157792A (ja) 2016-03-04 2017-09-07 イビデン株式会社 電子部品内蔵基板及びその製造方法
WO2018139046A1 (ja) 2017-01-27 2018-08-02 株式会社村田製作所 インターポーザ基板、回路モジュール、インターポーザ基板の製造方法
JP2021061264A (ja) 2019-10-02 2021-04-15 味の素株式会社 インダクタ機能を有する配線基板及びその製造方法
JP2021061387A (ja) 2019-10-08 2021-04-15 インテル コーポレイション 予め製造されたフェライトコアを有する同軸磁性インダクタ
JP2021086856A (ja) 2019-11-25 2021-06-03 イビデン株式会社 インダクタ内蔵基板、インダクタ内蔵基板の製造方法

Also Published As

Publication number Publication date
US20250157905A1 (en) 2025-05-15
JPWO2024024069A1 (https=) 2024-02-01
WO2024024069A1 (ja) 2024-02-01

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