JP7733453B2 - ワークピース処理装置およびワークピース処理方法 - Google Patents

ワークピース処理装置およびワークピース処理方法

Info

Publication number
JP7733453B2
JP7733453B2 JP2021035047A JP2021035047A JP7733453B2 JP 7733453 B2 JP7733453 B2 JP 7733453B2 JP 2021035047 A JP2021035047 A JP 2021035047A JP 2021035047 A JP2021035047 A JP 2021035047A JP 7733453 B2 JP7733453 B2 JP 7733453B2
Authority
JP
Japan
Prior art keywords
workpiece
bernoulli chuck
fluid
carbonated water
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021035047A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022135312A (ja
JP2022135312A5 (enExample
Inventor
誠 柏木
真於 伊沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2021035047A priority Critical patent/JP7733453B2/ja
Priority to US18/547,889 priority patent/US20240165759A1/en
Priority to PCT/JP2022/005070 priority patent/WO2022185865A1/ja
Priority to TW111107236A priority patent/TW202236497A/zh
Publication of JP2022135312A publication Critical patent/JP2022135312A/ja
Publication of JP2022135312A5 publication Critical patent/JP2022135312A5/ja
Application granted granted Critical
Publication of JP7733453B2 publication Critical patent/JP7733453B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/062—Work-clamping means adapted for holding workpieces having a special form or being made from a special material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2021035047A 2021-03-05 2021-03-05 ワークピース処理装置およびワークピース処理方法 Active JP7733453B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021035047A JP7733453B2 (ja) 2021-03-05 2021-03-05 ワークピース処理装置およびワークピース処理方法
US18/547,889 US20240165759A1 (en) 2021-03-05 2022-02-09 Workpiece processing apparatus and workpiece processing method
PCT/JP2022/005070 WO2022185865A1 (ja) 2021-03-05 2022-02-09 ワークピース処理装置およびワークピース処理方法
TW111107236A TW202236497A (zh) 2021-03-05 2022-03-01 工件處理裝置及工件處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021035047A JP7733453B2 (ja) 2021-03-05 2021-03-05 ワークピース処理装置およびワークピース処理方法

Publications (3)

Publication Number Publication Date
JP2022135312A JP2022135312A (ja) 2022-09-15
JP2022135312A5 JP2022135312A5 (enExample) 2024-03-08
JP7733453B2 true JP7733453B2 (ja) 2025-09-03

Family

ID=83155042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021035047A Active JP7733453B2 (ja) 2021-03-05 2021-03-05 ワークピース処理装置およびワークピース処理方法

Country Status (4)

Country Link
US (1) US20240165759A1 (enExample)
JP (1) JP7733453B2 (enExample)
TW (1) TW202236497A (enExample)
WO (1) WO2022185865A1 (enExample)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049598A (ja) 2004-08-05 2006-02-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2010016208A (ja) 2008-07-04 2010-01-21 Seiko Epson Corp チャック装置および吸引保持ハンド
WO2015083615A1 (ja) 2013-12-03 2015-06-11 株式会社ハーモテック 保持装置、保持システム、制御方法及び搬送装置
JP2019077003A (ja) 2017-10-25 2019-05-23 株式会社荏原製作所 研磨装置
JP2020184581A (ja) 2019-05-08 2020-11-12 株式会社荏原製作所 基板処理装置および基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10189511A (ja) * 1996-12-20 1998-07-21 Sony Corp ウェーハ洗浄装置
TW466665B (en) * 1999-02-05 2001-12-01 Hitachi Ltd Cleaner of plate part and its method
JP2000228383A (ja) * 1999-02-05 2000-08-15 Hitachi Ltd 板状部品の洗浄装置およびその方法
US20180096879A1 (en) * 2016-10-05 2018-04-05 Lam Research Ag Spin chuck including edge ring
JP6993806B2 (ja) * 2017-07-31 2022-01-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049598A (ja) 2004-08-05 2006-02-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2010016208A (ja) 2008-07-04 2010-01-21 Seiko Epson Corp チャック装置および吸引保持ハンド
WO2015083615A1 (ja) 2013-12-03 2015-06-11 株式会社ハーモテック 保持装置、保持システム、制御方法及び搬送装置
JP2019077003A (ja) 2017-10-25 2019-05-23 株式会社荏原製作所 研磨装置
JP2020184581A (ja) 2019-05-08 2020-11-12 株式会社荏原製作所 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2022135312A (ja) 2022-09-15
US20240165759A1 (en) 2024-05-23
TW202236497A (zh) 2022-09-16
WO2022185865A1 (ja) 2022-09-09

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