TW202236497A - 工件處理裝置及工件處理方法 - Google Patents

工件處理裝置及工件處理方法 Download PDF

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Publication number
TW202236497A
TW202236497A TW111107236A TW111107236A TW202236497A TW 202236497 A TW202236497 A TW 202236497A TW 111107236 A TW111107236 A TW 111107236A TW 111107236 A TW111107236 A TW 111107236A TW 202236497 A TW202236497 A TW 202236497A
Authority
TW
Taiwan
Prior art keywords
workpiece
aforementioned
bernoulli chuck
fluid
carbonated water
Prior art date
Application number
TW111107236A
Other languages
English (en)
Chinese (zh)
Inventor
柏木誠
伊沢真於
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202236497A publication Critical patent/TW202236497A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/062—Work-clamping means adapted for holding workpieces having a special form or being made from a special material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW111107236A 2021-03-05 2022-03-01 工件處理裝置及工件處理方法 TW202236497A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021035047A JP7733453B2 (ja) 2021-03-05 2021-03-05 ワークピース処理装置およびワークピース処理方法
JP2021-035047 2021-03-05

Publications (1)

Publication Number Publication Date
TW202236497A true TW202236497A (zh) 2022-09-16

Family

ID=83155042

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111107236A TW202236497A (zh) 2021-03-05 2022-03-01 工件處理裝置及工件處理方法

Country Status (4)

Country Link
US (1) US20240165759A1 (enExample)
JP (1) JP7733453B2 (enExample)
TW (1) TW202236497A (enExample)
WO (1) WO2022185865A1 (enExample)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10189511A (ja) * 1996-12-20 1998-07-21 Sony Corp ウェーハ洗浄装置
TW466665B (en) * 1999-02-05 2001-12-01 Hitachi Ltd Cleaner of plate part and its method
JP2000228383A (ja) * 1999-02-05 2000-08-15 Hitachi Ltd 板状部品の洗浄装置およびその方法
JP4467379B2 (ja) * 2004-08-05 2010-05-26 大日本スクリーン製造株式会社 基板処理装置
JP5239564B2 (ja) * 2008-07-04 2013-07-17 セイコーエプソン株式会社 チャック装置および吸引保持ハンド
CN105792998A (zh) * 2013-12-03 2016-07-20 哈莫技术股份有限公司 保持设备、保持系统、控制方法和传送设备
US20180096879A1 (en) * 2016-10-05 2018-04-05 Lam Research Ag Spin chuck including edge ring
JP6993806B2 (ja) * 2017-07-31 2022-01-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6908496B2 (ja) * 2017-10-25 2021-07-28 株式会社荏原製作所 研磨装置
JP2020184581A (ja) * 2019-05-08 2020-11-12 株式会社荏原製作所 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2022135312A (ja) 2022-09-15
US20240165759A1 (en) 2024-05-23
JP7733453B2 (ja) 2025-09-03
WO2022185865A1 (ja) 2022-09-09

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