JP7727918B2 - 実装方法、及び、実装システム - Google Patents

実装方法、及び、実装システム

Info

Publication number
JP7727918B2
JP7727918B2 JP2022545507A JP2022545507A JP7727918B2 JP 7727918 B2 JP7727918 B2 JP 7727918B2 JP 2022545507 A JP2022545507 A JP 2022545507A JP 2022545507 A JP2022545507 A JP 2022545507A JP 7727918 B2 JP7727918 B2 JP 7727918B2
Authority
JP
Japan
Prior art keywords
case
cover
feeder
attachment
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022545507A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022044563A1 (enrdf_load_stackoverflow
Inventor
和宜 石川
能彦 八木
祐二 阿部
寛人 住田
達哉 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of JPWO2022044563A1 publication Critical patent/JPWO2022044563A1/ja
Application granted granted Critical
Publication of JP7727918B2 publication Critical patent/JP7727918B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022545507A 2020-08-31 2021-07-08 実装方法、及び、実装システム Active JP7727918B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020145252 2020-08-31
JP2020145252 2020-08-31
PCT/JP2021/025873 WO2022044563A1 (ja) 2020-08-31 2021-07-08 実装方法、及び、実装システム

Publications (2)

Publication Number Publication Date
JPWO2022044563A1 JPWO2022044563A1 (enrdf_load_stackoverflow) 2022-03-03
JP7727918B2 true JP7727918B2 (ja) 2025-08-22

Family

ID=80353169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022545507A Active JP7727918B2 (ja) 2020-08-31 2021-07-08 実装方法、及び、実装システム

Country Status (2)

Country Link
JP (1) JP7727918B2 (enrdf_load_stackoverflow)
WO (1) WO2022044563A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112023001639T5 (de) * 2022-03-30 2025-04-03 Panasonic Intellectual Property Management Co., Ltd. Instruktionssystem, Instruktionsverfahren und Programm
WO2024224705A1 (ja) * 2023-04-26 2024-10-31 パナソニックＩｐマネジメント株式会社 管理システム、フィーダ、管理方法及び実装機

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295618A (ja) 2008-06-02 2009-12-17 Taiyo Yuden Co Ltd バルクフィーダ用の部品補充システム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3170172B2 (ja) * 1995-03-30 2001-05-28 ティーディーケイ株式会社 チップ部品供給装置及び該装置に用いるチップ部品供給ケース
JPH08293697A (ja) * 1995-04-21 1996-11-05 Sony Corp バルクカセット
JPH10335888A (ja) * 1997-06-04 1998-12-18 Juki Corp バルクフィーダーにおけるバルクカセット誤挿入防止方法
JPH1174693A (ja) * 1997-08-27 1999-03-16 Tdk Corp チップ部品供給システム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295618A (ja) 2008-06-02 2009-12-17 Taiyo Yuden Co Ltd バルクフィーダ用の部品補充システム

Also Published As

Publication number Publication date
JPWO2022044563A1 (enrdf_load_stackoverflow) 2022-03-03
WO2022044563A1 (ja) 2022-03-03

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