JP7724153B2 - 順方向パラメータ補正および増強されたリバースエンジニアリングを使用するコーティング制御 - Google Patents

順方向パラメータ補正および増強されたリバースエンジニアリングを使用するコーティング制御

Info

Publication number
JP7724153B2
JP7724153B2 JP2021514425A JP2021514425A JP7724153B2 JP 7724153 B2 JP7724153 B2 JP 7724153B2 JP 2021514425 A JP2021514425 A JP 2021514425A JP 2021514425 A JP2021514425 A JP 2021514425A JP 7724153 B2 JP7724153 B2 JP 7724153B2
Authority
JP
Japan
Prior art keywords
information
run
runs
coating
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021514425A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022511320A (ja
JP2022511320A5 (https=
Inventor
ケイ ティルヒ マーカス
ジェイ オケンファス ジョージ
グリゴニス マリウス
クラーク アンドリュー
ドンゴン ペン
ヤンシャン シャ
シャオ ユエン
ナイバンク エリック
ピンカートン ニール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Viavi Solutions Inc
Original Assignee
Viavi Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Viavi Solutions Inc filed Critical Viavi Solutions Inc
Publication of JP2022511320A publication Critical patent/JP2022511320A/ja
Priority to JP2023107163A priority Critical patent/JP2023134537A/ja
Publication of JP2022511320A5 publication Critical patent/JP2022511320A5/ja
Application granted granted Critical
Publication of JP7724153B2 publication Critical patent/JP7724153B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0042—Controlling partial pressure or flow rate of reactive or inert gases with feedback of measurements
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52—Means for observation of the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/547—Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3476—Testing and control
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/28—Interference filters
    • G02B5/285—Interference filters comprising deposited thin solid films

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Physical Vapour Deposition (AREA)
  • Optical Filters (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
JP2021514425A 2018-09-28 2018-09-28 順方向パラメータ補正および増強されたリバースエンジニアリングを使用するコーティング制御 Active JP7724153B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023107163A JP2023134537A (ja) 2018-09-28 2023-06-29 順方向パラメータ補正および増強されたリバースエンジニアリングを使用するコーティング制御

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/108297 WO2020062016A1 (en) 2018-09-28 2018-09-28 Coating control using forward parameter correction and enhanced reverse engineering

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023107163A Division JP2023134537A (ja) 2018-09-28 2023-06-29 順方向パラメータ補正および増強されたリバースエンジニアリングを使用するコーティング制御

Publications (3)

Publication Number Publication Date
JP2022511320A JP2022511320A (ja) 2022-01-31
JP2022511320A5 JP2022511320A5 (https=) 2025-01-09
JP7724153B2 true JP7724153B2 (ja) 2025-08-15

Family

ID=69949498

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021514425A Active JP7724153B2 (ja) 2018-09-28 2018-09-28 順方向パラメータ補正および増強されたリバースエンジニアリングを使用するコーティング制御
JP2023107163A Withdrawn JP2023134537A (ja) 2018-09-28 2023-06-29 順方向パラメータ補正および増強されたリバースエンジニアリングを使用するコーティング制御

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023107163A Withdrawn JP2023134537A (ja) 2018-09-28 2023-06-29 順方向パラメータ補正および増強されたリバースエンジニアリングを使用するコーティング制御

Country Status (7)

Country Link
US (1) US11692263B2 (https=)
EP (1) EP3841227A4 (https=)
JP (2) JP7724153B2 (https=)
KR (1) KR102761027B1 (https=)
CN (1) CN112752865A (https=)
TW (1) TWI793371B (https=)
WO (1) WO2020062016A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11481524B2 (en) * 2020-06-26 2022-10-25 Microsoft Technology Licensing, Llc Conformal coating iteration
WO2022240385A1 (en) 2021-05-10 2022-11-17 Carl Zeiss Vision International Gmbh A method for calibrating optical coating apparatuses
US12526655B2 (en) 2023-07-10 2026-01-13 T-Mobile Usa, Inc. Managing bandwidth consumption associated with multiple interaction channels of a wireless telecommunication network related to information campaigns

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002294444A (ja) 2001-03-30 2002-10-09 Shibaura Mechatronics Corp 成膜装置および成膜装置用プログラム
JP2007321170A (ja) 2006-05-30 2007-12-13 Sony Corp スパッタ成膜方法、光吸収膜並びにｎｄフィルター
JP2008223140A (ja) 2007-03-13 2008-09-25 Jds Uniphase Corp 複数の材料の混合物から構成され、かつ、予め決められた屈折率を有する層を堆積させるための方法およびスパッタ堆積システム

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0733573B2 (ja) * 1988-10-14 1995-04-12 日本電信電話株式会社 薄膜形成方法
JPH0772307A (ja) * 1993-09-03 1995-03-17 Canon Inc 薄膜形成方法及び装置
US5911856A (en) 1993-09-03 1999-06-15 Canon Kabushiki Kaisha Method for forming thin film
US5772861A (en) * 1995-10-16 1998-06-30 Viratec Thin Films, Inc. System for evaluating thin film coatings
US6217720B1 (en) * 1997-06-03 2001-04-17 National Research Council Of Canada Multi-layer reactive sputtering method with reduced stabilization time
IL132639A (en) * 1999-10-28 2003-11-23 Nova Measuring Instr Ltd Optical measurements of patterned structures
WO2001090434A2 (en) 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
JP3965935B2 (ja) 2000-07-26 2007-08-29 セイコーエプソン株式会社 電気光学装置及び投射型表示装置
US7324865B1 (en) 2001-05-09 2008-01-29 Advanced Micro Devices, Inc. Run-to-run control method for automated control of metal deposition processes
DE10124609B4 (de) 2001-05-17 2012-12-27 Aixtron Se Verfahren zum Abscheiden aktiver Schichten auf Substraten
JP4327439B2 (ja) * 2002-10-31 2009-09-09 株式会社アルバック 誘電体多層膜の製造装置
US20060196765A1 (en) * 2005-03-07 2006-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Metallization target optimization method providing enhanced metallization layer uniformity
JP2007072307A (ja) 2005-09-08 2007-03-22 Matsushita Electric Works Ltd 光モジュール
CN102191475B (zh) * 2011-04-15 2012-10-10 中国科学院上海光学精密机械研究所 提高薄膜光谱性能的膜厚监控方法
CN102912306B (zh) * 2012-10-20 2014-04-16 大连理工大学 计算机自动控制的高功率脉冲磁控溅射设备及工艺
CN103540906B (zh) * 2013-09-29 2015-07-29 中国科学院上海光学精密机械研究所 光控-晶控综合膜厚监控方法
US10113228B2 (en) * 2014-06-20 2018-10-30 Taiwan Semiconductor Manufacturing Company Ltd. Method for controlling semiconductor deposition operation
JP6619934B2 (ja) 2015-01-07 2019-12-11 日東電工株式会社 多層光学膜の膜厚制御方法、多層光学膜の製造方法および多層光学膜のスパッタ装置
JP6822807B2 (ja) 2015-09-30 2021-01-27 キヤノンメディカルシステムズ株式会社 Ｘ線コンピュータ断層撮影装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002294444A (ja) 2001-03-30 2002-10-09 Shibaura Mechatronics Corp 成膜装置および成膜装置用プログラム
JP2007321170A (ja) 2006-05-30 2007-12-13 Sony Corp スパッタ成膜方法、光吸収膜並びにｎｄフィルター
JP2008223140A (ja) 2007-03-13 2008-09-25 Jds Uniphase Corp 複数の材料の混合物から構成され、かつ、予め決められた屈折率を有する層を堆積させるための方法およびスパッタ堆積システム

Also Published As

Publication number Publication date
JP2022511320A (ja) 2022-01-31
KR102761027B1 (ko) 2025-01-31
US20210332474A1 (en) 2021-10-28
WO2020062016A1 (en) 2020-04-02
KR20210063424A (ko) 2021-06-01
EP3841227A4 (en) 2021-10-06
JP2023134537A (ja) 2023-09-27
US11692263B2 (en) 2023-07-04
TWI793371B (zh) 2023-02-21
TW202031919A (zh) 2020-09-01
CN112752865A (zh) 2021-05-04
EP3841227A1 (en) 2021-06-30

Similar Documents

Publication Publication Date Title
JP2023134537A (ja) 順方向パラメータ補正および増強されたリバースエンジニアリングを使用するコーティング制御
JP5888919B2 (ja) 成膜装置及び成膜方法
KR102008046B1 (ko) 수정 발진식 막두께 모니터에 의한 막두께 제어 방법
JP2022511320A5 (https=)
BE1025251B1 (nl) Feedback systeem
JP2010093272A5 (https=)
CN121049533B (zh) Mocvd设备的卫星盘转速检测方法、系统、计算机设备及存储介质
JP2019137877A (ja) 蒸着装置及び蒸着方法
JP2025186217A (ja) 製造システムにおけるマルチレベルｒｆパルス監視およびｒｆパルス化パラメータ最適化
HK40047060A (en) Coating control using forward parameter correction and enhanced reverse engineering
JP2019131859A (ja) 蒸着装置及び蒸着方法
KR20200070115A (ko) 기판을 코팅하는 방법
JP7102130B2 (ja) 蒸着装置及び蒸着方法
CN116685709B (zh) 溅射装置、溅射装置的控制方法和溅射装置用控制装置
JP5800603B2 (ja) 蒸着装置、膜厚測定方法
US12130606B2 (en) Disturbance compensation for substrate processing recipes
TWI758514B (zh) 反應濺射的膜厚控制方法及裝置
WO2026007387A1 (zh) 应用声波元件即时量测薄膜厚度的系统
WO2026090083A1 (en) Artificial intelligence-based bias prediction for run-to-run process control
JP2025504340A (ja) 壁再結合を使用するプラズマ処理のための均一性制御

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210823

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220817

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220830

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221129

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230629

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20230810

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20231020

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20241126

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20241224

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250804

R150 Certificate of patent or registration of utility model

Ref document number: 7724153

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150